| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/14/2009 | US20090121330 Clip Mount For Integrated Circuit Leadframes |
| 05/14/2009 | US20090121329 Lead frame structure and applications thereof |
| 05/14/2009 | US20090121328 Glass Substrate of Flat Panel Display and Display Integrated Circuit Chip |
| 05/14/2009 | US20090121327 Semiconductor device having spacer formed on semiconductor chip connected with wire |
| 05/14/2009 | US20090121326 Semiconductor package module |
| 05/14/2009 | US20090121323 Semiconductor device and method of fabricating the same |
| 05/14/2009 | US20090121322 Semiconductor chip and semiconductor device |
| 05/14/2009 | US20090121321 Wafer and a Method of Dicing a Wafer |
| 05/14/2009 | US20090121318 Semiconductor device, DRAM integrated circuit device, and method of producing the same |
| 05/14/2009 | US20090121314 Manufacturing method for forming an integrated circuit device and corresponding integrated circuit device |
| 05/14/2009 | US20090121304 Solid-state image pickup device, process for producing the same and electronic device |
| 05/14/2009 | US20090121302 Chip Package |
| 05/14/2009 | US20090121222 Test Structure |
| 05/14/2009 | US20090121221 High performance sub-system design and assembly |
| 05/14/2009 | US20090121220 High performance sub-system design and assembly |
| 05/14/2009 | US20090120685 Method For Encapsulating Electrical And/Or Electronic Components In A Housing |
| 05/14/2009 | US20090119915 Method for Manufacturing Circuit Device |
| 05/14/2009 | DE10209204B4 Elektronisches Bauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben The same electronic component having a stack of semiconductor chips and processes for making |
| 05/14/2009 | DE102008056388A1 Halbleitervorrichtung und die Halbleitervorrichtung aufweisende Inverterschaltung Semiconductor device and the semiconductor device having the inverter circuit |
| 05/14/2009 | DE102008051542A1 Integriertes Schaltungsbauelement und Verfahren The integrated circuit device and method |
| 05/14/2009 | DE102007053808A1 Sockelelement, Sockelanordnung und Verfahren zur Herstellung einer weiteren Sockelanordnung Base element, the base arrangement and method for the production of a further socket assembly |
| 05/14/2009 | DE102007052821A1 Sub-carriers for semiconductor element, has conductive block made of electrically conductive semiconductor material, where insulating block is arranged between conductive blocks |
| 05/14/2009 | DE102007052630A1 Power semiconductor module has electrically and thermally conductive base plate and electrically insulating and thermally conductive substrate arranged on base plate |
| 05/14/2009 | DE102007052048A1 Doppelintegrationsschema für Metallschicht mit geringem Widerstand Double integration scheme for metal layer having a low resistance |
| 05/14/2009 | DE102007051788A1 Halbleiterchip mit einer Schutzschicht und Verfahren zum Betrieb eines Halbleiterchip Semiconductor chip having a protective layer and method of operating a semiconductor chip |
| 05/14/2009 | DE102005047566B4 Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse sowie Herstellungsverfahren hierzu Arrangement with a power semiconductor device and a housing and manufacturing method therefor |
| 05/14/2009 | DE102004014676B4 Verfahren zum Herstellen einer integrierten Schaltungsanordnung mit Hilfsvertiefung, insbesondere mit Ausrichtmarken, und integrierte Schaltungsanordnung A method of fabricating an integrated circuit arrangement with auxiliary recess, in particular with alignment marks, and integrated circuit arrangement |
| 05/14/2009 | CA2704610A1 Device and device manufacture method |
| 05/13/2009 | EP2059103A1 Semiconductor device and multilayer wiring board |
| 05/13/2009 | EP2058872A2 Semiconductor package |
| 05/13/2009 | EP2058861A1 Electric power converter |
| 05/13/2009 | EP2058860A2 Fully testable surface mount die package configured for two-sided cooling |
| 05/13/2009 | EP2058859A2 Wiring substrate and semiconductor device and method of manufacturing the same |
| 05/13/2009 | EP2058858A2 Silicon interposer and semiconductor device package and semiconductor device incorporating the same |
| 05/13/2009 | EP2058857A2 IC chip package with directly connected leads |
| 05/13/2009 | EP2058856A2 Semiconductor package and mounting method thereof |
| 05/13/2009 | EP2058855A2 Method of manufacturing semiconductor package |
| 05/13/2009 | EP2058667A2 Microelectronic spring contact element |
| 05/13/2009 | EP2057869A1 Power core devices and methods of making thereof |
| 05/13/2009 | EP2057687A1 Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure |
| 05/13/2009 | EP2057680A2 Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same |
| 05/13/2009 | EP2057679A2 Semiconductor device having improved heat dissipation capabilities |
| 05/13/2009 | EP2057678A1 Three-dimensional thermal spreading in an air-cooled thermal device |
| 05/13/2009 | EP2057677A1 Method and apparatus for manufacturing an electronic module, and electronic module |
| 05/13/2009 | EP2057665A2 Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities |
| 05/13/2009 | EP2057568A2 Integrated circuit chip with repeater flops and method for automated design of same |
| 05/13/2009 | EP1356498A4 Chromium adhesion layer for copper vias in low-k technology |
| 05/13/2009 | EP1295370B1 Water getter devices for laser amplifiers and process for the manufacture thereof |
| 05/13/2009 | CN201238440Y Cooling structure with wind concentration function |
| 05/13/2009 | CN201238438Y Circular radiator |
| 05/13/2009 | CN201238437Y Heat radiator |
| 05/13/2009 | CN201238436Y Radiator module group |
| 05/13/2009 | CN201238051Y Controlled silicon three-phase fully controlled bridge and heat radiating device assembly |
| 05/13/2009 | CN201238050Y System including printed circuit board and at least one electronic component |
| 05/13/2009 | CN201238049Y Semiconductor chip packaging structure capable of achieving electric connection without need of routing |
| 05/13/2009 | CN201238048Y CPU radiator |
| 05/13/2009 | CN201237203Y Lighting lamp |
| 05/13/2009 | CN201237202Y Integral radiator for high-power LED light source |
| 05/13/2009 | CN201237201Y Thermal convection device for high-power LED lamp |
| 05/13/2009 | CN201237200Y Heat radiating device of LED reflectoscope |
| 05/13/2009 | CN201237199Y LED lamp |
| 05/13/2009 | CN201237195Y High-power LED lamp high-efficiency radiator |
| 05/13/2009 | CN201237194Y High-power high-efficiency LED road lamp radiator |
| 05/13/2009 | CN201237172Y High operating voltage LED |
| 05/13/2009 | CN201237116Y Explosion-proof LED light source tunnel lamp for mining |
| 05/13/2009 | CN201237110Y LED spot light |
| 05/13/2009 | CN201237096Y Improved LED lamp |
| 05/13/2009 | CN201237095Y LED lamp |
| 05/13/2009 | CN101433135A A system for cooling a heat-generating electronic device with increased air flow |
| 05/13/2009 | CN101432875A Apparatus and method for use in mounting electronic elements |
| 05/13/2009 | CN101432874A Semiconductor die package including multiple dies and a common node structure |
| 05/13/2009 | CN101432873A Method for micropackaging of electrical or electromechanical devices and micropackage |
| 05/13/2009 | CN101432872A Power LED package |
| 05/13/2009 | CN101432871A A microwave chip supporting structure |
| 05/13/2009 | CN101432870A Semiconductor device with double-sided electrode structure and its manufacturing method |
| 05/13/2009 | CN101432869A Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device |
| 05/13/2009 | CN101432868A Three-dimensional packaging scheme for package types utilizing a sacrificail metal base |
| 05/13/2009 | CN101432862A Substrate for a microelectronic package and method of fabricating thereof |
| 05/13/2009 | CN101432674A Methods of inter-integrated circuit addressing and devices for performing the same |
| 05/13/2009 | CN101432459A Film forming method, film forming device, and storage medium |
| 05/13/2009 | CN101432331A Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor de |
| 05/13/2009 | CN101431879A Heat pipe intensified electronic device radiator |
| 05/13/2009 | CN101431619A Solid-state imaging device and method of driving the same |
| 05/13/2009 | CN101431604A Image signal amplifying circuit and amplifying semiconductor integrated circuit |
| 05/13/2009 | CN101431329A OR gate logic circuit and its forming method |
| 05/13/2009 | CN101431319A Electronic component |
| 05/13/2009 | CN101431291A Processing method for high-power switch power supply commutation bridge and water cooling board |
| 05/13/2009 | CN101431132A Luminous diode |
| 05/13/2009 | CN101431131A Radiating module of light emitting diode |
| 05/13/2009 | CN101431095A Display device with improved brightness |
| 05/13/2009 | CN101431094A Display device with improved brightness |
| 05/13/2009 | CN101431093A Organic light emitting device and method of fabricating the same |
| 05/13/2009 | CN101431091A Image sensor and method for manufacturing the same |
| 05/13/2009 | CN101431090A Image sensor and method for manufacturing the same |
| 05/13/2009 | CN101431086A Semiconductor package and its forming method |
| 05/13/2009 | CN101431084A Multi-segment photovoltaic power converter with a center portion |
| 05/13/2009 | CN101431083A Active array substrate, LCD panel and its mending method |
| 05/13/2009 | CN101431081A Nonvolatile semiconductor memory device |
| 05/13/2009 | CN101431080A Nonvolatile semiconductor memory device |
| 05/13/2009 | CN101431079A Nonvolatile semiconductor memory device |