| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/19/2009 | US7535107 Tiled construction of layered materials |
| 05/19/2009 | US7535106 Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate |
| 05/19/2009 | US7535104 Structure and method for bond pads of copper-metallized integrated circuits |
| 05/19/2009 | US7535103 Structures and methods to enhance copper metallization |
| 05/19/2009 | US7535102 High performance sub-system design and assembly |
| 05/19/2009 | US7535101 Electrode pad on conductive semiconductor substrate |
| 05/19/2009 | US7535100 Wafer bonding of thinned electronic materials and circuits to high performance substrates |
| 05/19/2009 | US7535099 Sintered metallic thermal interface materials for microelectronic cooling assemblies |
| 05/19/2009 | US7535098 Structure of substrate |
| 05/19/2009 | US7535097 Semiconductor device and method of manufacturing the same |
| 05/19/2009 | US7535095 Printed wiring board and method for producing the same |
| 05/19/2009 | US7535094 Substrate structure, a method and an arrangement for producing such substrate structure |
| 05/19/2009 | US7535093 Method and apparatus for packaging circuit devices |
| 05/19/2009 | US7535092 Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment |
| 05/19/2009 | US7535091 Multichip stacking structure |
| 05/19/2009 | US7535090 LSI package provided with interface module |
| 05/19/2009 | US7535089 Monolithically integrated light emitting devices |
| 05/19/2009 | US7535088 Secure-digital (SD) flash card with slanted asymmetric circuit board |
| 05/19/2009 | US7535087 Semiconductor device with lead frames |
| 05/19/2009 | US7535086 Integrated circuit package-on-package stacking system |
| 05/19/2009 | US7535085 Semiconductor package having improved adhesiveness and ground bonding |
| 05/19/2009 | US7535084 Multi-chip package with a single die pad |
| 05/19/2009 | US7535083 Lead frame for surface mount-type piezoelectric vibrator |
| 05/19/2009 | US7535082 Nitride semiconductor wafer and method of processing nitride semiconductor wafer |
| 05/19/2009 | US7535078 Semiconductor device having a fuse and method of forming thereof |
| 05/19/2009 | US7535076 Power semiconductor device |
| 05/19/2009 | US7535021 Calibration technique for measuring gate resistance of power MOS gate device at water level |
| 05/19/2009 | US7535020 Systems and methods for thermal sensing |
| 05/19/2009 | US7534979 Pressure-contact type rectifier with contact friction reducer |
| 05/19/2009 | US7534722 Back-to-front via process |
| 05/19/2009 | US7534718 Post passivation interconnection schemes on top of IC chips |
| 05/19/2009 | US7534716 System and method for venting pressure from an integrated circuit package sealed with a lid |
| 05/19/2009 | US7534712 Semiconductor device and method for fabricating the same |
| 05/19/2009 | US7534702 Method for manufacturing a semiconductor device |
| 05/19/2009 | US7534664 Semiconductor device and method of manufacturing same |
| 05/19/2009 | US7534662 Methods for hermetic sealing of post media-filled MEMS package |
| 05/19/2009 | US7534661 Method of forming molded resin semiconductor device |
| 05/19/2009 | US7534660 Methods for assembly and packaging of flip chip configured dice with interposer |
| 05/19/2009 | US7534658 Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices |
| 05/19/2009 | US7534657 Method of manufacturing a semiconductor device |
| 05/19/2009 | US7534654 Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
| 05/19/2009 | US7534653 Chip packaging process |
| 05/19/2009 | US7534651 Seedless wirebond pad plating |
| 05/19/2009 | US7534650 Carbon-carbon and/or metal-carbon fiber composite heat spreader |
| 05/19/2009 | US7534637 Tunable alignment geometry |
| 05/19/2009 | US7534636 Lids for wafer-scale optoelectronic packages |
| 05/14/2009 | WO2009061751A2 Semiconductor device having through-silicon vias for high current, high frequency, and heat dissipation |
| 05/14/2009 | WO2009061282A1 An interconnect structure and a method of fabricating the same |
| 05/14/2009 | WO2009061091A1 Semiconductor chip having power supply line with minimized voltage drop |
| 05/14/2009 | WO2009060987A1 Phosphorus-containing epoxy resin and phosphorus-containing epoxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and the resin composition |
| 05/14/2009 | WO2009060934A1 Semiconductor device and method for manufacturing the same |
| 05/14/2009 | WO2009060902A1 Ceramic substrate, method for producing ceramic substrate, and method for producing substrate for power module |
| 05/14/2009 | WO2009060726A1 Integrated circuit and method for manufacturing the same |
| 05/14/2009 | WO2009060693A1 Device and device manufacturing method |
| 05/14/2009 | WO2009060670A1 Semiconductor device and method for manufacturing the same |
| 05/14/2009 | WO2009060556A1 Wiring structure and method for forming the same |
| 05/14/2009 | WO2009060168A1 Current limiting diode and method of manufacturing thereof |
| 05/14/2009 | WO2009059883A1 Chip packaging |
| 05/14/2009 | WO2009042500A3 Method for stacking semiconductor chips |
| 05/14/2009 | WO2009038706A3 Cooling hot-spots by lateral active heat transport |
| 05/14/2009 | WO2009033891A3 Electronic circuit arrangement having a heat sink that is functionally independent of the installed position, and heat sink therefor |
| 05/14/2009 | WO2009032506A3 Systems and methods for ball grid array (bga) escape routing |
| 05/14/2009 | WO2009028578A3 Semiconductor device including semiconductor constituent and manufacturing method thereof |
| 05/14/2009 | WO2007056253A3 A semiconductor package that includes stacked semiconductor die |
| 05/14/2009 | WO2007050422A3 Plastic packaged device with die interface layer |
| 05/14/2009 | US20090124045 Low Profile Stacking System and Method |
| 05/14/2009 | US20090123747 Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device |
| 05/14/2009 | US20090123643 Electronic Device and Method for Manufacturing the Same |
| 05/14/2009 | US20090122486 Semiconductor Packages |
| 05/14/2009 | US20090121737 Characterizing circuit performance by separating device and interconnect impact on signal delay |
| 05/14/2009 | US20090121363 Process for Producing Circuit Substrate and Circuit Substrate Obtained in Accordance With the Process |
| 05/14/2009 | US20090121362 Semiconductor package and mounting method thereof |
| 05/14/2009 | US20090121361 Semiconductor device and method for manufacturing thereof |
| 05/14/2009 | US20090121360 Semiconductor device having dual damascene structure |
| 05/14/2009 | US20090121359 Semiconductor device and method for fabricating the same |
| 05/14/2009 | US20090121358 Dual depth trench termination method for improving cu-based interconnect integrity |
| 05/14/2009 | US20090121357 Design structure for bridge of a seminconductor internal node |
| 05/14/2009 | US20090121356 Semiconductor device and method of manufacturing semiconductor device |
| 05/14/2009 | US20090121355 Semiconductor device and method for manufacturing the same |
| 05/14/2009 | US20090121354 Semiconductor Device and Method of Fabricating the Same |
| 05/14/2009 | US20090121353 Dual damascene beol integration without dummy fill structures to reduce parasitic capacitance |
| 05/14/2009 | US20090121352 Mutli-package module and electronic device using the same |
| 05/14/2009 | US20090121351 Process for forming a bump structure and bump structure |
| 05/14/2009 | US20090121350 Board adapted to mount an electronic device, semiconductor module and manufacturing method therefore, and portable device |
| 05/14/2009 | US20090121349 Semiconductor device and a method of manufacturing the same |
| 05/14/2009 | US20090121348 Chip structure and process thereof and stacked structure of chips and process thereof |
| 05/14/2009 | US20090121347 Semiconductor Device and Semiconductor Device Assembly |
| 05/14/2009 | US20090121346 Flexible Interposer for Stacking Semiconductor Chips and Connecting Same to Substrate |
| 05/14/2009 | US20090121345 Silicon interposer producing method, silicon interposer and semiconductor device package and semiconductor device incorporating silicon interposer |
| 05/14/2009 | US20090121344 Silicon interposer and semiconductor device package and semiconductor device incorporating the same |
| 05/14/2009 | US20090121343 Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules |
| 05/14/2009 | US20090121342 Semiconductor device including main substrate and sub substrates and fabrication method of the same |
| 05/14/2009 | US20090121341 Component for semiconductor package and manufacturing method of component for semiconductor package |
| 05/14/2009 | US20090121340 Fully testable surface mount die package configured for two-sided cooling |
| 05/14/2009 | US20090121339 Semiconductor module and image pickup apparatus |
| 05/14/2009 | US20090121335 Integrated circuit package system with package integration |
| 05/14/2009 | US20090121334 Manufacturing method of semiconductor apparatus and semiconductor apparatus |
| 05/14/2009 | US20090121333 Flexible substrates having a thin-film barrier |
| 05/14/2009 | US20090121332 Semiconductor chip package |
| 05/14/2009 | US20090121331 Self-Aligning Structures and Method For Integrated Circuits |