| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/20/2009 | CN101436601A Array substrate of thin-film transistor |
| 05/20/2009 | CN101436600A Semiconductor device and method for manufacturing the same, and electric device |
| 05/20/2009 | CN101436598A Multi-domain liquid crystal display and array substrate device thereof |
| 05/20/2009 | CN101436596A Semiconductor device, display device and mobile device |
| 05/20/2009 | CN101436593A Semiconductor capacitance structure and layout thereof |
| 05/20/2009 | CN101436591A Metallic film bulk resistance |
| 05/20/2009 | CN101436590A Package-on-package with improved joint reliability |
| 05/20/2009 | CN101436589A Semiconductor module and image pickup apparatus |
| 05/20/2009 | CN101436588A 电路模块 Circuit module |
| 05/20/2009 | CN101436587A Semiconductor module and image pickup apparatus |
| 05/20/2009 | CN101436586A Semiconductor module and image pickup apparatus |
| 05/20/2009 | CN101436585A Power semiconductor module having a substrate and a pressure device |
| 05/20/2009 | CN101436584A Stacked semiconductor package |
| 05/20/2009 | CN101436583A Stacking type packaging piece |
| 05/20/2009 | CN101436581A Microwave low-waveband submicron hybrid integrated circuit and preparation technique thereof |
| 05/20/2009 | CN101436580A Structure and method for measuring stack pair |
| 05/20/2009 | CN101436579A Semiconductor device and method for manufacturing the same |
| 05/20/2009 | CN101436578A Wiring board and method for manufacturing the same |
| 05/20/2009 | CN101436577A Lead frame of pinless encapsulation |
| 05/20/2009 | CN101436576A Lead frame of pinless encapsulation |
| 05/20/2009 | CN101436575A Semiconductor package and mounting method thereof |
| 05/20/2009 | CN101436574A CPU radiator |
| 05/20/2009 | CN101436573A Electronic packaging device and preparation method thereof |
| 05/20/2009 | CN101436572A Package for integrated circuit lead |
| 05/20/2009 | CN101436571A Electrical device and method |
| 05/20/2009 | CN101436569A Method of manufacturing thin film transistor array substrate and display device |
| 05/20/2009 | CN101436557A Wafer level encapsulation method of LED array encapsulation and LED encapsulation device made thereby |
| 05/20/2009 | CN101436556A Method for producing a semiconductor component |
| 05/20/2009 | CN101436554A Method for manufacturing package structure with reconfigured crystal particle by aligning mark |
| 05/20/2009 | CN101436553A Method for manufacturing package structure with reconfigured chip by metal projection |
| 05/20/2009 | CN101436552A Method for manufacturing package structure with reconfigured crystal particle by net-shaped structure |
| 05/20/2009 | CN101436539A Manufacturing method for forming an integrated circuit device and corresponding integrated circuit device |
| 05/20/2009 | CN101436092A Display card heat radiation combination and blade point type server using the same |
| 05/20/2009 | CN101435962A TFT-LCD array substrate structure and manufacturing method thereof |
| 05/20/2009 | CN101435905A Solid-state image pickup device, process for producing the same and electronic device |
| 05/20/2009 | CN101435568A Light emitting diode illuminating apparatus and heat radiating device thereof |
| 05/20/2009 | CN101435567A LED light fitting |
| 05/20/2009 | CN101435566A LED light fitting |
| 05/20/2009 | CN101435551A Light emitting diode light fitting |
| 05/20/2009 | CN101434737A Package for integrated circuit die |
| 05/20/2009 | CN100490618C Heat radiator |
| 05/20/2009 | CN100490610C Circuit substrate production method and method for mounting electronic element |
| 05/20/2009 | CN100490202C Integrated parallel peltier/seebeck element chip and production method therefor, connection method |
| 05/20/2009 | CN100490198C Paster diode producing method |
| 05/20/2009 | CN100490195C Package structure for solid light-emitting element and method for manufacturing same |
| 05/20/2009 | CN100490165C Solid state image pickup device |
| 05/20/2009 | CN100490162C Solid-state imaging device and method for producing the same |
| 05/20/2009 | CN100490160C Optical device |
| 05/20/2009 | CN100490159C Method for manufacturing thin-film transistor |
| 05/20/2009 | CN100490154C Capacitor structure |
| 05/20/2009 | CN100490151C Controlled silicon structure used for CMOS electrostatic discharge protection |
| 05/20/2009 | CN100490149C Integrated circuit device, method of manufacturing the same and method of forming vanadium oxide film |
| 05/20/2009 | CN100490148C Method of reducing current leakage in a semiconductor capacitor and corresponding device thereof |
| 05/20/2009 | CN100490147C Method and structure for wiring electronic devices |
| 05/20/2009 | CN100490145C Package structure coated with asymmetric single-side pin lower wafer |
| 05/20/2009 | CN100490144C Electrostatic discharge protecting device |
| 05/20/2009 | CN100490143C Non-gate-controlled diode, electrostatic discharge protection circuit and manufacture method thereof |
| 05/20/2009 | CN100490142C System and method pertaining to semiconductor dies |
| 05/20/2009 | CN100490141C 半导体器件 Semiconductor devices |
| 05/20/2009 | CN100490140C Double gauge lead frame |
| 05/20/2009 | CN100490139C Lead frame for semiconductor device and manufacturing methode thereof |
| 05/20/2009 | CN100490138C Semiconductor encapsulation structure for improving wafer shift upon pressing |
| 05/20/2009 | CN100490137C Thin-film flip-chip packaging construction and circuit thin-film used for it |
| 05/20/2009 | CN100490136C Device for flip chip |
| 05/20/2009 | CN100490135C Preparation method for integrated pulsating chip heat pipe |
| 05/20/2009 | CN100490134C Nanotube-based fluid interface material and approach |
| 05/20/2009 | CN100490133C Aluminium-alloy high-power semi-conductor radiator and preparing method |
| 05/20/2009 | CN100490132C Insulating sheet and power module comprising the insulating sheet |
| 05/20/2009 | CN100490131C Encapsulation construction of ball lattice array for preventing glue overflow |
| 05/20/2009 | CN100490130C Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfilling applications |
| 05/20/2009 | CN100490129C Metal-base circuit board and its manufacturing method |
| 05/20/2009 | CN100490128C Method of grinding multilayer body and method of manufacturing solid state image pickup device |
| 05/20/2009 | CN100490127C Wafer and wafer cutting and dividing method |
| 05/20/2009 | CN100490126C Semiconductor wafer and process for producing a semiconductor wafer |
| 05/20/2009 | CN100490119C Dicing die-bonding film |
| 05/20/2009 | CN100490116C A semiconductor device and a method of manufacturing thereof |
| 05/20/2009 | CN100490115C Method of manufacturing a semiconductor device having damascene structures with air gaps |
| 05/20/2009 | CN100490114C Semiconductor structure, and method for forming a copper diffusion barrier |
| 05/20/2009 | CN100490113C Metal interconnection structure and its manufacture method |
| 05/20/2009 | CN100490104C Mould-seal array treating process of packaging wafer and used substrates bar |
| 05/20/2009 | CN100490103C Making method for base plate welding cover layer and its structure |
| 05/20/2009 | CN100490102C Lead frame and method for manufacturing semiconductor package with the same |
| 05/20/2009 | CN100490092C Selective W-CVD process and process for producing Cu multilayer wiring |
| 05/20/2009 | CN100490035C Electrolytic capacitor and its producing method |
| 05/20/2009 | CN100489629C Wiring structure and electrooptical device manufacturing method, electrooptical device and electronic apparatus |
| 05/20/2009 | CN100489552C Measurement of lateral diffusion of diffused layers |
| 05/20/2009 | CN100489434C Plate type integral structure heat-irradiation method and device suitable for large power high efficiency heat pipe heat-radiator |
| 05/20/2009 | CN100489366C Quick coupling device for detachably connecting two pipelines and use of such a coupling device |
| 05/19/2009 | US7535741 Semiconductor device |
| 05/19/2009 | US7535728 Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors |
| 05/19/2009 | US7535715 Conformable interface materials for improving thermal contacts |
| 05/19/2009 | US7535714 Apparatus and method providing metallic thermal interface between metal capped module and heat sink |
| 05/19/2009 | US7535695 DRAM cells and electronic systems |
| 05/19/2009 | US7535115 Wafer and method of producing a substrate by transfer of a layer that includes foreign species |
| 05/19/2009 | US7535113 Reduced inductance in ball grid array packages |
| 05/19/2009 | US7535112 Semiconductor constructions comprising multi-level patterns of radiation-imageable material |
| 05/19/2009 | US7535111 Semiconductor component with semiconductor chip and adhesive film, and method for its production |
| 05/19/2009 | US7535110 Stack die packages |
| 05/19/2009 | US7535109 Die assembly having electrical interconnect |
| 05/19/2009 | US7535108 Electronic component including reinforcing member |