Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2009
05/21/2009US20090127678 Stacked assembly of semiconductor packages with fastening lead-cut ends of leadframe
05/21/2009US20090127677 Multi-Terminal Package Assembly For Semiconductor Devices
05/21/2009US20090127676 Back to Back Die Assembly For Semiconductor Devices
05/21/2009US20090127675 Semiconductor package
05/21/2009US20090127674 Multilayer dielectric substrate and semiconductor package
05/21/2009US20090127668 Stacked semiconductor device and method of forming serial path thereof
05/21/2009US20090127667 Semiconductor chip device having through-silicon-via (TSV) and its fabrication method
05/21/2009US20090127666 Semiconductor device, method of manufacturing the same, and phase shift mask
05/21/2009US20090127665 Semiconductor device and manufacturing method thereof
05/21/2009US20090127652 Structure of very high insertion loss of the substrate noise decoupling
05/21/2009US20090127648 Hybrid Gap-fill Approach for STI Formation
05/21/2009US20090127626 Stress-generating shallow trench isolation structure having dual composition
05/21/2009US20090127620 Semiconductor doping with reduced gate edge diode leakage
05/21/2009US20090127595 Semiconductor structure with field shield and method of forming the structure
05/21/2009US20090127582 Semiconductor apparatus including a radiator for diffusing the heat generated therein
05/21/2009US20090127553 Wafer with scribe lanes comprising external pads and/or active circuits for die testing
05/21/2009US20090126991 Substrate for mounting electronic part and electronic part
05/21/2009US20090126922 Heat transfer device
05/21/2009US20090126192 Heat pipe fin stack with extruded base
05/20/2009EP2061290A1 Ceramic substrate manufacturing method and ceramic substrate
05/20/2009EP2061278A1 Hearing aid chip with separate EMC mass and corresponding hearing aid
05/20/2009EP2061080A1 Semiconductor device, lead frame product used in the semiconductor device, and method for manufacturing the semiconductor device
05/20/2009EP2061079A1 Semiconductor package and semiconductor package assembly
05/20/2009EP2061078A1 Cooling element
05/20/2009EP2061077A2 Sheet structure and method of manufacturing the same
05/20/2009EP2061075A1 Semiconductor device
05/20/2009EP2061071A2 Method for producing a semiconductor component
05/20/2009EP2060537A2 Siloxane-grafted silica, transparent silicone composition, and optoelectronic device encapsulated therewith
05/20/2009EP2060533A2 Semiconductor device and method of manufacturing the same
05/20/2009EP2059948A2 Regulated power supply for a circuit
05/20/2009EP2059945A1 Device for wetting bumps of a semiconductor chip with a liquid substance
05/20/2009EP1801866B1 Method of manufacturing a semiconductor device
05/20/2009EP1312115B1 Semiconductor arrangement and method for production thereof
05/20/2009DE20321684U1 Elektronische Schaltung mit einem Leistungshalbleiterbauelement und mit einem Sicherungsmittel zum Schutz des Leistungshalbleiterbauelements An electronic circuit comprising a power semiconductor device and having a safety means for protecting the power semiconductor component,
05/20/2009DE202009002722U1 Anordnung zur Kraftverteilung einer Klemmvorrichtung für Kühlkörper Arrangement for power distribution of a clamping device for heat sink
05/20/2009DE202009002157U1 Rückplatte eines Kühlers Back plate of a radiator
05/20/2009DE19945675B4 Oberflächenbefestigbares LED-Gehäuse Oberflächenbefestigbares LED housing
05/20/2009DE10318074B4 Verfahren zur Herstellung von BOC Modul Anordnungen mit verbesserten mechanischen Eigenschaften Process for the preparation of BOC module assemblies with improved mechanical properties
05/20/2009DE102008052470A1 Verfahren zum Prozessieren eines Kontaktpads, Verfahren zum Herstellen eines Kontaktpads und integriertes Schaltkreiselement A method for processing a contact pad, methods of making a contact pad and integrated circuit element
05/20/2009DE102008051465A1 Halbleiterbaustein Semiconductor device
05/20/2009DE102008051464A1 Halbleiterbaustein Semiconductor device
05/20/2009DE102008049059A1 Ein Wafer und ein Verfahren zum Vereinzeln eines Wafers A wafer and a method of dicing a wafer
05/20/2009DE102008048424A1 Elektronikbauelement Electronic component
05/20/2009DE102008048423A1 Integriertes Schaltungsbauelement The integrated circuit device
05/20/2009DE102008010784B3 Wärmeabfuhrtechnisch polyvalente Wärmeübertragungsvorrichtung für wenigstens ein Halbleiterbauelement sowie zugehöriges Test- und Betriebsverfahren Heat dissipation Technically polyvalent heat transfer device for at least a semiconductor device and associated testing and operating procedures
05/20/2009DE102008007543B3 Stack of chips has multiple semiconductor chips arranged on one another, where each semiconductor chip has upper side, lower side and lateral surface encircling border of upper and lower sides
05/20/2009DE102007053249A1 Semiconductor body has longitudinal structure with multiple rectangular-shaped areas, which contain integrated circuits, and other multiple areas, formed as scribed frame
05/20/2009DE102005034011B4 Halbleiterbauteil für Hochfrequenzen über 10 GHz und Verfahren zur Herstellung desselben Of the same semiconductor device for high frequencies exceeding 10 GHz and methods for preparing
05/20/2009DE102004050588B4 Anordnung mit einem Leistungshalbleiterbauelement und mit einer Kontakteinrichtung Arrangement with a power semiconductor component and with a contact device
05/20/2009DE102004048201B4 Halbleiterbauteil mit Haftvermittlerschicht, sowie Verfahren zu deren Herstellung A semiconductor device comprising an adhesion promoter layer, as well as processes for their preparation
05/20/2009DE102004015611B4 Vorrichtung und Verfahren zur Offset-Kompensation Apparatus and method for offset compensation
05/20/2009DE102004012979B4 Kopplungssubstrat für Halbleiterbauteile, Anordnungen mit dem Kopplungssubstrat, Kopplungssubstratstreifen, Verfahren zur Herstellung dieser Gegenstände und Verfahren zur Herstellung eines Halbleitermoduls Coupling substrate for semiconductor devices, with the coupling assemblies substrate, coupling substrate strip, process for producing these articles and methods for manufacturing a semiconductor module
05/20/2009DE10146854B4 Elektronisches Bauteil mit wenigstens einem Halbleiterchip und Verfahren zur Herstellung eines elektronischen Bauteils mit wenigstens einem Halbleiterchip Electronic component with at least one semiconductor chip and method for producing an electronic component comprising at least one semiconductor chip
05/20/2009CN201243430Y Multi-channel hot pipe type radiator
05/20/2009CN201243408Y Circuit board with embedded capacitance element
05/20/2009CN201243024Y Non-throwing encapsulation structure of LED
05/20/2009CN201243023Y Seat body of LED
05/20/2009CN201243017Y LED and LED module with open circuit breakage protection
05/20/2009CN201243016Y Laminated construction of integrated circuit component
05/20/2009CN201243015Y Liquid radiating device for high power light-emitting diode
05/20/2009CN201243014Y Integrated circuit component structure
05/20/2009CN201243013Y Self circulation type radiating device for computer CPU
05/20/2009CN201243012Y Cuprum aluminum composite radiating plate for IC chip
05/20/2009CN201242133Y Novel LED light fitting
05/20/2009CN201242132Y Heat radiation structure of large power LED
05/20/2009CN201242131Y Heat radiation energy-saving lamp
05/20/2009CN201242130Y Heat radiation energy-saving lamp
05/20/2009CN201242129Y High power LED lamp
05/20/2009CN201242128Y LED ball bulb lamp
05/20/2009CN201242126Y Heat sink radiating assembly of LED light source automobile head lamp
05/20/2009CN201242125Y LED lamp with improved heat radiating structure
05/20/2009CN201242106Y Light emitting diode lamp core
05/20/2009CN201242104Y High-power LED encapsulation structure
05/20/2009CN201242099Y LED fixed plate structure of LED lamp
05/20/2009CN201242067Y Large power LED road lamp
05/20/2009CN201242056Y High-brightness LED daylight lamp
05/20/2009CN201242053Y Combined component of LED and heat conducting device
05/20/2009CN201242052Y Combined component of LED and heat conducting device
05/20/2009CN101438405A Method and apparatus for indicating directionality in integrated circuit manufacturing
05/20/2009CN101438404A Structure and method for creating reliable via contacts for interconnect applications
05/20/2009CN101438403A Semiconductor device and method for manufacturing same
05/20/2009CN101438402A Method, apparatus and system for carbon nanotube wick structures
05/20/2009CN101438401A Aluminum-silicon carbide composite body and method for processing the same
05/20/2009CN101438396A Grooved substrates for uniform underfilling solder ball assembled electronic devices
05/20/2009CN101437386A Heat-radiating structure and method of manufacturing the same
05/20/2009CN101437385A Apparatus for cooling electronic device rack
05/20/2009CN101437383A Heat radiator
05/20/2009CN101437382A Heat radiator
05/20/2009CN101437381A Heat radiator
05/20/2009CN101437380A Combination of radiating device
05/20/2009CN101437364A Device mounting structure and device mounting method
05/20/2009CN101437362A Inverted through circuit board mounting with heat sink
05/20/2009CN101437187A Stacked encapsulation structure for tapering (reducing) minitype sensor encapsulation volume
05/20/2009CN101436632A LED chip component with heat-dissipating substrate and preparation method thereof
05/20/2009CN101436629A LED structure
05/20/2009CN101436610A Organic electric field light-emitting display device
05/20/2009CN101436608A Organic light emitting display apparatus
05/20/2009CN101436605A Image sensor and method for manufacturing thereof
05/20/2009CN101436603A Imaging die set
05/20/2009CN101436602A Array substrate and display panel having the same
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