Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2009
05/26/2009US7538395 Method of forming low capacitance ESD device and structure therefor
05/26/2009US7538394 Compound semiconductor switch circuit device
05/26/2009US7538388 Semiconductor device with a super-junction
05/26/2009US7538353 Composite barrier/etch stop layer comprising oxygen doped SiC and SiC for interconnect structures
05/26/2009US7538346 Semiconductor device
05/26/2009US7538345 Inspection method of contact failure of semiconductor device and semiconductor device to which inspection method is applied
05/26/2009US7538344 Overlay and CD process window structure
05/26/2009US7538057 Ceramic electronic device and the production method
05/26/2009US7538023 Method of manufacturing a semiconductor wafer device having separated conductive patterns in peripheral area
05/26/2009US7538021 Removing dry film resist residues using hydrolyzable membranes
05/26/2009US7538016 Signal and/or ground planes with double buried insulator layers and fabrication process
05/26/2009US7538007 Semiconductor device with flowable insulation layer formed on capacitor and method for fabricating the same
05/26/2009US7538005 Semiconductor device and method for fabricating the same
05/26/2009US7537969 Fuse structure having reduced heat dissipation towards the substrate
05/26/2009US7537966 Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
05/26/2009US7537962 Method of fabricating a shielded stacked integrated circuit package system
05/26/2009US7537960 Method of making multi-chip package with high-speed serial communications between semiconductor dice
05/26/2009US7537959 Chip stack package and manufacturing method thereof
05/26/2009US7537958 High performance multi-chip flip chip package
05/26/2009US7537954 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
05/26/2009US7537864 Hole pattern design method and photomask
05/26/2009US7537448 Thermal processing method and thermal processing unit
05/26/2009US7537151 Method of making high performance heat sinks
05/26/2009US7536781 Method of assembling an application specific integrated circuit (ASIC) assembly with attach hardware
05/26/2009CA2493351C Pb-free solder-connected structure and electronic device
05/22/2009WO2009063808A1 Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device
05/22/2009WO2009063703A1 Vapor cooling apparatus
05/22/2009WO2009063591A1 Method for manufacturing semiconductor device
05/22/2009WO2009063570A1 Electronic device and its manufacturing method
05/22/2009WO2009063546A1 Heatsink
05/22/2009WO2009063372A1 Thermal stress reduction
05/22/2009WO2009062882A2 Method for manufacturing a solar cell with a surface-passivating dielectric double layer, and corresponding solar cell
05/22/2009WO2009062757A1 Method for connecting two joining surfaces
05/22/2009WO2009062732A2 Multicomponent heat sink
05/22/2009WO2009062534A1 Power semiconductor module
05/22/2009WO2009045008A3 Circuit protection device
05/22/2009WO2009035849A3 Semiconductor die mount by conformal die coating
05/22/2009WO2009034496A3 Wafer, method of manufacturing integrated circuits on a wafer, and method of storing data about said circuits
05/22/2009WO2009026224A3 High input/output, low profile package-on-package semiconductor system
05/22/2009WO2009020572A3 Stack packages using reconstituted wafers
05/22/2009WO2009020240A3 Semiconductor device and method for manufacturing the same
05/22/2009WO2009015984A3 Wafer joining method, wafer assemblage, and chip
05/22/2009WO2008051415A9 Method of manufacturing stacked chip packages
05/21/2009US20090132990 Integrated Circuit Devices and Methods and Apparatuses for Designing Integrated Circuit Devices
05/21/2009US20090130996 Semiconductor device
05/21/2009US20090130908 Memory module, socket and mounting method providing improved heat dissipating characteristics
05/21/2009US20090130837 In situ deposition of a low k dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application
05/21/2009US20090130802 Substrate based unmolded package
05/21/2009US20090130801 Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same
05/21/2009US20090129138 Semiconductor Integrated Circuit
05/21/2009US20090129062 Light emission device and display device using the light emission device as its light source
05/21/2009US20090129036 Semiconductor device and electronic device
05/21/2009US20090129028 Power module and method of fabricating the same
05/21/2009US20090129022 Micro-chimney and thermosiphon die-level cooling
05/21/2009US20090128176 High density integrated circuit apparatus, test probe and methods of use thereof
05/21/2009US20090127723 AIM-Compatible Targets for Use with Methods of Inspecting and Optionally Reworking Summed Photolithography Patterns Resulting from Plurally-Overlaid Patterning Steps During Mass Production of Semiconductor Devices
05/21/2009US20090127722 Method for Processing a Spacer Structure, Method of Manufacturing an Integrated Circuit, Semiconductor Device and Intermediate Structure with at Least One Spacer Structure
05/21/2009US20090127721 Semiconductor integrated circuit device
05/21/2009US20090127720 Drop-mold conformable material as an encapsulation for an integrated circuit package system
05/21/2009US20090127719 Integrated circuit package system with package substrate having corner contacts
05/21/2009US20090127718 Flip chip wafer, flip chip die and manufacturing processes thereof
05/21/2009US20090127717 Semiconductor module
05/21/2009US20090127716 Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method
05/21/2009US20090127715 Mountable integrated circuit package system with protrusion
05/21/2009US20090127714 Contact plug of semiconductor device and method of forming the same
05/21/2009US20090127713 Semiconductor device
05/21/2009US20090127712 Nanotube-based directionally-conductive adhesive
05/21/2009US20090127711 Interconnect structure and method of making same
05/21/2009US20090127710 Undercut-free blm process for pb-free and pb-reduced c4
05/21/2009US20090127709 Semiconductor device
05/21/2009US20090127708 Copper pillar tin bump on semiconductor chip and method of forming the same
05/21/2009US20090127707 Semiconductor device and method for manufacturing the same
05/21/2009US20090127706 Chip structure, substrate structure, chip package structure and process thereof
05/21/2009US20090127705 Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device
05/21/2009US20090127704 Method and System for Providing a Reliable Semiconductor Assembly
05/21/2009US20090127703 Method and System for Providing a Low-Profile Semiconductor Assembly
05/21/2009US20090127702 Package, subassembly and methods of manufacturing thereof
05/21/2009US20090127701 Thermal attach for electronic device cooling
05/21/2009US20090127700 Thermal conductor lids for area array packaged multi-chip modules and methods to dissipate heat from multi-chip modules
05/21/2009US20090127699 Low temperature co-fired ceramics substrate and semiconductor package
05/21/2009US20090127698 Composite contact for fine pitch electrical interconnect assembly
05/21/2009US20090127697 Housing with a Cavity for a Mechanically-Sensitive Electronic Component and Method for Production
05/21/2009US20090127696 Piezoelectric Resonator Device
05/21/2009US20090127695 Surface mount package with enhanced strength solder joint
05/21/2009US20090127694 Semiconductor module and image pickup apparatus
05/21/2009US20090127693 Semiconductor module and image pickup apparatus
05/21/2009US20090127692 Method of connecting a semiconductor package to a printed wiring board
05/21/2009US20090127691 Semiconductor Power Module Packages with Simplified Structure and Methods of Fabricating the Same
05/21/2009US20090127690 Package and Manufacturing Method for a Microelectronic Component
05/21/2009US20090127689 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
05/21/2009US20090127688 Package-on-package with improved joint reliability
05/21/2009US20090127687 POP (package-on-package) semiconductor device
05/21/2009US20090127686 Stacking die package structure for semiconductor devices and method of the same
05/21/2009US20090127685 Power Device Packages and Methods of Fabricating the Same
05/21/2009US20090127684 Leadframe for leadless package
05/21/2009US20090127683 Integrated circuit package system with insulator
05/21/2009US20090127682 Chip package structure and method of fabricating the same
05/21/2009US20090127681 Semiconductor package and method of fabricating the same
05/21/2009US20090127680 Integrated circuit package-in-package system with wire-in-film encapsulant
05/21/2009US20090127679 POP (Package-On-Package) device encapsulating soldered joints between externals leads
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