Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2009
05/27/2009CN101442036A Conductor holder structure and application thereof
05/27/2009CN101442035A Flat non down-lead encapsulation piece and method for producing the same
05/27/2009CN101442034A Bonding pad and method for forming the same
05/27/2009CN101442033A Heat dissipation apparatus
05/27/2009CN101442032A Heat dissipation apparatus
05/27/2009CN101442031A Encapsulation conformation and encapsulation method capable of balancing window top and bottom model stream
05/27/2009CN101442030A Group iii nitride semiconductor crystal substrate and semiconductor device
05/27/2009CN101442016A Silicon wafer projection structure and manufacturing method thereof
05/27/2009CN101442015A Light emitting diode device and manufacturing method thereof
05/27/2009CN101442014A Organic electroluminescence display device and manufacturing method thereof
05/27/2009CN101442013A Circuit module and manufacturing method thereof
05/27/2009CN101442012A Model sealing and cutting method for small window and formed encapsulation conformation
05/27/2009CN101442000A Semiconductor device including semiconductor thin film, crystallizing method for the semiconductor thin film, and crystallizing apparatus for the semiconductor thin film
05/27/2009CN101441992A Semiconductor device and manufacturing method thereof
05/27/2009CN101441727A Electronic apparatus and method of manufacturing the same
05/27/2009CN101441331A Semiconductor device including semiconductor thin film, crystallizing method for the semiconductor thin film, and crystallizing apparatus for the semiconductor thin film
05/27/2009CN101440950A High power LED illumination road lamp
05/27/2009CN101440949A Heat radiating device
05/27/2009CN101440945A Low wattage high-brightness lighting lamp
05/27/2009CN101440943A LED mechanism capable of being replaced
05/27/2009CN101440928A Free curved surface lens
05/27/2009CN101440923A Vehicular lamp
05/27/2009CN101440918A Method for manufacturing LED flexible water-proof luminous belt
05/27/2009CN101440915A Combined type polar heat radiation high power LED electronic lamp
05/27/2009CN100493322C Groove-type flat-plate heat pipe soaking device
05/27/2009CN100493321C Heat radiating device
05/27/2009CN100493319C Heat radiation loop system
05/27/2009CN100493316C Integrated liquid cooling heat abstractor
05/27/2009CN100493292C Radiator fixing device
05/27/2009CN100492683C Light-emitting semiconductor body
05/27/2009CN100492682C Luminous optical element with semiconductor main body
05/27/2009CN100492681C Wavelength-converting filler and its manufacture method and optical element containing the filler
05/27/2009CN100492655C Organic light emitting display device and manufacturing therefor
05/27/2009CN100492647C Flash memory device and method of manufacturing the same
05/27/2009CN100492638C Stack package of semiconductor device
05/27/2009CN100492637C Semiconductor device package and its manufacturing method, and semiconductor
05/27/2009CN100492636C Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement
05/27/2009CN100492635C Integrated circuit with connecting layer and methods for making same
05/27/2009CN100492634C Mount assembly, optical transmission line and photoelectric circuit board
05/27/2009CN100492633C Welding disc mode structure
05/27/2009CN100492632C 电路装置及其制造方法 Circuit device and manufacturing method thereof
05/27/2009CN100492631C Optical display packaging structure and its method
05/27/2009CN100492630C Optoelectronic device, method for producing such a device and method for the structural metallization of a body
05/27/2009CN100492629C Electronic assembly comprising interposer with embedded capacitors and methods of manufacture
05/27/2009CN100492628C Electronic assembly comprisnig substrate with embedded capacitors and methods of manufacture
05/27/2009CN100492627C Chip structure, chip package structure and its process
05/27/2009CN100492626C 半导体装置 Semiconductor device
05/27/2009CN100492625C Electronic component and method of manufacture
05/27/2009CN100492624C External pin structure, active part array base plate, photoelectric device and making method
05/27/2009CN100492623C Low power multi-chip semiconductor memory device and chip enabling method thereof
05/27/2009CN100492622C Reactive solder material
05/27/2009CN100492621C Heat radiator
05/27/2009CN100492620C Carbonaceous heat radiator and associated methods
05/27/2009CN100492619C Semiconductor device and its making method
05/27/2009CN100492617C Making method of the pixel structure and pixel structure
05/27/2009CN100492607C Microelectronic device containing conductive bumps and its preparation method
05/27/2009CN100492560C Laminated body, capacitor, electronic part, and method and device for manufacturing the same
05/27/2009CN100492147C Liquid crystal display device and manufacturing method thereof
05/27/2009CN100491888C Loop type heat-exchange device
05/27/2009CN100491486C Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
05/26/2009US7539962 Pattern data correcting method, photo mask manufacturing method, semiconductor device manufacturing method, program and semiconductor device
05/26/2009US7539038 Nonvolatile nanochannel memory device using organic-inorganic complex mesoporous material
05/26/2009US7539034 Memory configured on a common substrate
05/26/2009US7539019 Apparatus for transferring heat from a heat spreader
05/26/2009US7539017 Heat dissipating device for central processor
05/26/2009US7539009 Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit
05/26/2009US7538804 Solid state image pick-up device and image pick-up system
05/26/2009US7538642 Waveguide coupler
05/26/2009US7538565 High density integrated circuit apparatus, test probe and methods of use thereof
05/26/2009US7538538 Method of using a four terminal hybrid silicon/organic field effect sensor device
05/26/2009US7538444 Wafer with optical control modules in exposure fields
05/26/2009US7538443 Offset dependent resistor for measuring misalignment of stitched masks
05/26/2009US7538442 Semiconductor chip and semiconductor device
05/26/2009US7538441 Chip with power and signal pads connected to power and signal lines on substrate
05/26/2009US7538440 Method for improved high current component interconnections
05/26/2009US7538439 Multi-chip semiconductor device with high withstand voltage, and a fabrication method of the same
05/26/2009US7538438 Substrate warpage control and continuous electrical enhancement
05/26/2009US7538437 Infrared receiver chip
05/26/2009US7538436 Press pack power semiconductor module
05/26/2009US7538435 Wafer structure and bumping process
05/26/2009US7538434 Copper interconnection with conductive polymer layer and method of forming the same
05/26/2009US7538433 Semiconductor device
05/26/2009US7538431 Semiconductor device
05/26/2009US7538429 Method of enabling solder deposition on a substrate and electronic package formed thereby
05/26/2009US7538428 Semiconductor device
05/26/2009US7538427 Microchannel structure and manufacturing method therefor, light source device, and projector
05/26/2009US7538426 Cooling system of power semiconductor module
05/26/2009US7538425 Power semiconductor package having integral fluid cooling
05/26/2009US7538424 System and method for dissipating heat from a semiconductor module
05/26/2009US7538423 Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device
05/26/2009US7538422 Integrated circuit micro-cooler having multi-layers of tubes of a CNT array
05/26/2009US7538421 Flip-chip package structure with stiffener
05/26/2009US7538420 Package mounted module
05/26/2009US7538419 Stacked-type chip package structure
05/26/2009US7538418 IC card
05/26/2009US7538417 Semiconductor device with signal line having decreased characteristic impedance
05/26/2009US7538416 Resin molded type semiconductor device and a method of manufacturing the same
05/26/2009US7538415 Semiconductor chip assembly with bumped terminal, filler and insulative base
05/26/2009US7538414 Semiconductor integrated circuit device
05/26/2009US7538410 Fuse structure window