Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2014
08/14/2014US20140225266 Semiconductor device and manufacturing method for same
08/14/2014US20140225265 Functional material systems and processes for package-level interconnects
08/14/2014US20140225264 Method for providing electrical connections to spaced conductive lines
08/14/2014US20140225263 Semiconductor device and method for manufacturing semiconductor device
08/14/2014US20140225262 Electrical contact
08/14/2014US20140225261 Interconnect structure including a continuous conductive body
08/14/2014US20140225260 Solution process for improved nanowire electrodes and devices that use the electrodes
08/14/2014US20140225259 Semiconductor module system having encapsulated through wire interconnect (twi)
08/14/2014US20140225258 3D Packages and Methods for Forming the Same
08/14/2014US20140225257 Semiconductor Device and Method of Confining Conductive Bump Material During Reflow with Solder Mask Patch
08/14/2014US20140225256 Semiconductor Device with Conductive Pillars Having Recesses or Protrusions to Detect Interconnect Continuity Between Semiconductor Die and Substrate
08/14/2014US20140225255 Copper pillar full metal via electrical circuit structure
08/14/2014US20140225254 Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
08/14/2014US20140225253 Structure and method of forming a pad structure having enhanced reliability
08/14/2014US20140225252 On-track reverse lithography to thin mask for fabrication of dark-field features
08/14/2014US20140225251 Semiconductor devices and methods of fabricating the same
08/14/2014US20140225250 Methods and systems for fabrication of low-profile mems cmos devices
08/14/2014US20140225249 Semiconductor device and method for manufacturing semiconductor device
08/14/2014US20140225248 Power distribution and thermal solution for direct stacked integrated circuits
08/14/2014US20140225247 Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
08/14/2014US20140225246 Dual substrate, power distribution and thermal solution for direct stacked integrated devices
08/14/2014US20140225245 Power semiconductor module and power semiconductor module assembly with multiple power semiconductor modules
08/14/2014US20140225244 Method for embedding a chipset having an intermediary interposer in high density electronic modules
08/14/2014US20140225243 Semiconductor device
08/14/2014US20140225242 Semiconductor packages and methods of packaging semiconductor devices
08/14/2014US20140225241 Electronic device and package structure thereof
08/14/2014US20140225240 Manufacturing method of semiconductor device, and semiconductor device
08/14/2014US20140225239 Resin-encapsulated semiconductor device and method of manufacturing the same
08/14/2014US20140225238 Semiconductor device
08/14/2014US20140225237 Chip scale package structure and manufacturing method thereof
08/14/2014US20140225236 Semiconductor device, semiconductor package, and electronic device
08/14/2014US20140225235 Three-dimensional (3-d) integrated circuits (3dics) with graphene shield, and related components and methods
08/14/2014US20140225233 Layer arrangement
08/14/2014US20140225231 Modulating bow of thin wafers
08/14/2014US20140225230 Semiconductor package and method of forming the same
08/14/2014US20140225209 Semiconductor device, electrical device system, and method of producing semiconductor device
08/14/2014US20140225185 Method of making a low-rdson vertical power mosfet device
08/14/2014US20140225178 Electronic device including a nonvolatile memory structure having an antifuse component
08/14/2014US20140225144 Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting device
08/14/2014US20140225125 Composite Wafer and a Method for Manufacturing Same
08/14/2014US20140225116 Deuterated film encapsulation of nonvolatile charge trap memory device
08/14/2014US20140225114 Power semiconductor device
08/14/2014US20140225113 Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the same
08/14/2014US20140225112 Die testing using top surface test pads
08/14/2014US20140224887 Rfid tag
08/14/2014US20140224862 Method of manufacturing a semiconductor device
08/14/2014US20140224534 Method of manufacturing resin-encapsulated semiconductor device, and lead frame
08/14/2014US20140224317 Optoelectronic devices with thin barrier films with crystalline characteristics that are conformally coated onto complex surfaces to provide protection against moisture
08/14/2014DE10315532B4 Stromsensorvorrichtung in integrierter Ausführung und Verfahren zum Herstellen Current sensor apparatus of the integrated type and methods for preparing
08/14/2014DE102014101712A1 Halbleiterbauelement mit Umgehungsfunktionalität und Verfahren dafür Semiconductor component with bypass functionality and method therefor
08/14/2014DE102014101316A1 Elektronische Steuereinheit und drehende elektrische Maschine Electronic control unit and rotary electric machine
08/14/2014DE102013226544A1 Halbleitervorrichtung Semiconductor device
08/14/2014DE102013201479A1 Verfahren zur Durchkontaktierung eines Halbleitersubstrats und Halbleitersubstrat Process for through-hole plating of a semiconductor substrate and the semiconductor substrate
08/14/2014DE102013101260A1 Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement A device with at least one optoelectronic semiconductor component
08/14/2014DE102010038723B4 Leistungshalbleitermodul mit mindestens einer Positioniervorrichtung für ein Substrat Power semiconductor module having at least one positioning device for a substrate
08/14/2014DE102010006010B4 IC-Gehäuse IC package
08/14/2014DE102007002807B4 Chipanordnung Chip system
08/13/2014EP2765602A1 Semiconductor system
08/13/2014EP2765410A1 Gas sensor package
08/13/2014EP2764549A2 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
08/13/2014EP2764548A1 Memory modules in packages
08/13/2014EP2764547A1 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
08/13/2014EP2764546A2 Stub minimization for multi-die wirebond assemblies with orthogonal windows
08/13/2014EP2764545A1 Stub minimization for wirebond assemblies without windows
08/13/2014EP2764544A1 Stub minimization for multi-die wirebond assemblies with parallel windows
08/13/2014EP2764543A2 Stub minimization for multi-die wirebond assemblies with parallel windows
08/13/2014EP2764542A2 Stub minimization for assemblies without wirebonds to package substrate
08/13/2014EP2764541A1 Stub minimization for assemblies without wirebonds to package substrate
08/13/2014EP2764540A1 Gate array architecture with multiple programmable regions
08/13/2014EP2764539A1 Determining spacing of semiconductor dies using a spatially varying charge distribution
08/13/2014EP2764537A1 Removing conductive material to form conductive features in a substrate
08/13/2014EP2764513A2 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
08/13/2014EP2764512A2 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
08/13/2014CN203775594U 一种串联式电机控制器冷却结构 A tandem-type motor controller cooling structure
08/13/2014CN203775580U 马达驱动装置 Motor drive means
08/13/2014CN203775520U Igbt在电路板上的散热结构 Igbt heat dissipation structure of the circuit board
08/13/2014CN203775045U 一种智能半导体功率模块 An intelligent semiconductor power module
08/13/2014CN203774337U 大功率整流器件 Power rectifier
08/13/2014CN203774336U 表贴式薄型高可靠隔离二极管组件的封装结构 Table package highly reliable thin paste-style isolation diode assembly
08/13/2014CN203774326U 一种具有无线通信功能的动态存储bga封装模块 Dynamic storage bga package module having a wireless communication function
08/13/2014CN203774321U 一种用于sot23半导体的双二极管封装结构 Dual diode package structure for a semiconductor sot23
08/13/2014CN203774320U 一种多场效晶体管集成模块 A multi-field effect transistor integrated module
08/13/2014CN203774319U 堆叠式封装结构 Stacked package structure
08/13/2014CN203774318U 应力迁移测试结构 Stress migration test structure
08/13/2014CN203774317U 测试结构 Test structure
08/13/2014CN203774316U 对准标记 Alignment marks
08/13/2014CN203774315U Mim测试结构 Mim test structure
08/13/2014CN203774314U 通孔连线的测试结构 Vias connect the test structure
08/13/2014CN203774313U 一种互连金属电容测试结构 An interconnect metal capacitor test structure
08/13/2014CN203774312U Eeprom测试结构 Eeprom test structure
08/13/2014CN203774311U 晶圆识别结构 Wafer identification structure
08/13/2014CN203774310U 电子器件 Electronic devices
08/13/2014CN203774309U 一种mom电容结构 One kind of mom capacitance structure
08/13/2014CN203774308U 一种铜柱凸块的封装结构 A package structure copper pillar bumps
08/13/2014CN203774307U 一种提高产品可靠性的铜柱凸块结构 An increase copper pillar bump structure product reliability
08/13/2014CN203774306U 大功率器件引线框架 High-power devices leadframe
08/13/2014CN203774305U 一种矩阵列晶体管引线框架 A Matrix column transistor leadframe
08/13/2014CN203774304U 组合型直插式功率器件引线框架 Combined inline power devices leadframe
08/13/2014CN203774303U 阵列式引线框架版件 Array leadframe edition pieces
08/13/2014CN203774302U 一种应用于sot23集成电路封装的自锁型框架 Applied to an integrated circuit package sot23 self-locking frame
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