Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2009
05/28/2009US20090134508 Integrated circuit with flexible planar leads
05/28/2009US20090134507 Adhesive on wire stacked semiconductor package
05/28/2009US20090134506 Semiconductor device, method for manufacturing the same, and flexible substrate for mounting semiconductor
05/28/2009US20090134505 Semiconductor device and method of manufacturing the same
05/28/2009US20090134504 Semiconductor package and packaging method for balancing top and bottom mold flows from window
05/28/2009US20090134503 Semiconductor power device package having a lead frame-based integrated inductor
05/28/2009US20090134502 Leadframe based flash memory cards
05/28/2009US20090134501 Device and method including a soldering process
05/28/2009US20090134500 Structures for Preventing Cross-talk Between Through-Silicon Vias and Integrated Circuits
05/28/2009US20090134498 Semiconductor apparatus
05/28/2009US20090134496 Wafer and method of forming alignment markers
05/28/2009US20090134495 Method of designing semiconductor device
05/28/2009US20090134494 Semiconductor device and method of manufacturing the same
05/28/2009US20090134490 Electronic component module
05/28/2009US20090134489 System including an inter-chip communication system
05/28/2009US20090134471 Semiconductor interconnect
05/28/2009US20090134407 A1 alloy film, electronic device, and active matrix substrate for use in electrooptic display device
05/28/2009US20090134393 Thin film transistor substrate and display device
05/28/2009US20090134391 High performance sub-system design and assembly
05/28/2009US20090133254 Components with posts and pads
05/28/2009US20090133247 Apparatus for packaging a tape substrate
05/28/2009DE202009003608U1 Zusammensetzbares Kühlgerät Assembleable cooling device
05/28/2009DE19822511B4 Auf einer Oberfläche befestigbare elektronische Bauelemente On a surface attachable electronic components
05/28/2009DE112007001243T5 Verfahren zum Trockenätzen einer Zwischenisolierschicht A method of dry-etching a interlayer
05/28/2009DE102008058013A1 Halbleitervorrichtung mit SOI-Substrat und Verfahren zu deren Fertigung A semiconductor device comprising an SOI substrate and methods for their production
05/28/2009DE102008057297A1 Elektrische Anordnung und Verfahren Electrical Apparatus and method
05/28/2009DE102008011153A1 Anordnung mit mindestens zwei lichtemittierenden Halbleiterbauelementen und Verfahren zur Herstellung einer Anordnung mit mindestens zwei lichtemittierenden Halbleiterbauelementen Arrangement having at least two light emitting semiconductor devices and method for producing an arrangement with at least two semiconductor light emitting devices
05/28/2009DE102007056909A1 Electronic component, particularly head wire for diode, particularly power diode, comprises reinforcement which is designed as rotationally symmetrical setting, where setting or reinforcement is provided at transition of head wire
05/28/2009DE102007056783A1 Thermal highly stressed component i.e. electronic component, cooling method for in high power electronic circuits, involves producing under-cooled flow simmering with imbalance between fluid and vapor temperature in evaporator
05/28/2009DE102007054709A1 Leistungshalbleitermodul mit einem Substrat und mit einer Druckeinrichtung Power semiconductor module with a substrate and with a printing device
05/28/2009DE102004006440B4 Sensorbauteil mit einem frei zugänglichen Sensorbereich und Verfahren zur Herstellung desselben Same sensor device having a freely accessible area sensor and methods for preparing
05/27/2009EP2063696A2 Method for cooling high thermal charged construction elements and device for carrying out the method
05/27/2009EP2063466A2 Interconnection element and method of fabrication thereof
05/27/2009EP2063456A2 Semiconductor manufacturing management system
05/27/2009EP2062299A1 Method for applying electric contacts to semi-conductor substrates, semi-conductor substrate and use of said method
05/27/2009EP2062294A1 Power semiconductor module comprising an explosion protection system
05/27/2009EP2062293A1 Functional element package and fabrication method therefor
05/27/2009EP1756861A4 Microfabricated miniature grids
05/27/2009EP1447843B1 Adhesive-backed tape for TAB and semiconductor device
05/27/2009CN201248224Y Radiating device
05/27/2009CN201248218Y Fixed device
05/27/2009CN201247781Y Coil holder conformation of thin type LED
05/27/2009CN201247775Y High-power controlled silicon set constructional device
05/27/2009CN201247774Y Packaging structure for high-power multi-chip
05/27/2009CN201247773Y Protection circuit for novel power tube
05/27/2009CN201247772Y 线路板 Board
05/27/2009CN201247771Y Chip package substrate and projection welding plate construction
05/27/2009CN201247770Y Slide glass for conductor holder
05/27/2009CN201247769Y Material strip structure for holding radiating fin of chip
05/27/2009CN201246725Y High power LED illumination road lamp
05/27/2009CN201246723Y LED light fitting with built-in heat radiation model set
05/27/2009CN201246722Y LED road lamp with external heat radiation model set
05/27/2009CN201246720Y Heat radiation structure of LED illuminating apparatus
05/27/2009CN201246719Y LED illuminating apparatus
05/27/2009CN201246718Y LED illuminating apparatus
05/27/2009CN201246717Y Ultra-high power combined type LED lighting lamp
05/27/2009CN201246715Y Led热管散热器 Led heat pipe radiator
05/27/2009CN201246695Y Ceramic heat radiation substrate for chip LED encapsulation
05/27/2009CN201246616Y Novel large power LED candle type lamp
05/27/2009CN201246615Y LED sending light structure
05/27/2009CN101443979A Multi-chip module for battery power control
05/27/2009CN101443910A 功率半导体模块 Power semiconductor module
05/27/2009CN101443908A Body-biased PMOS protection against electrotatic discharge
05/27/2009CN101443907A Assembly, chip and method of operating
05/27/2009CN101443906A Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
05/27/2009CN101443905A Semiconductor device having low dielectric insulating film and manufacturing method of the same
05/27/2009CN101443904A Base for power module
05/27/2009CN101443903A Double-sided integrated circuit chips
05/27/2009CN101443418A Metal oxide particle-containing polysiloxane composition and method for producing same
05/27/2009CN101443414A Oxide particle-containing polysiloxane composition and method for producing same
05/27/2009CN101443151A Eyespot exercitation method for thread welding and relevant semiconductor processing operation
05/27/2009CN101442894A Electronic apparatus
05/27/2009CN101442893A System and method for facilitating cooling of a liquid-cooled electronics rack
05/27/2009CN101442892A Thermal pipe and method for assembling radiating device using the same
05/27/2009CN101442877A Novel interconnection structure and method for creating electric through-hole
05/27/2009CN101442869A Dynamic detection electrostatic protection circuit
05/27/2009CN101442262A High integration IGBT converter module
05/27/2009CN101442109A Organic electroluminescent device and down-lead structure, mask plate, drive chip thereof
05/27/2009CN101442079A Photovoltaic power converter
05/27/2009CN101442067A Image sensor and fabricating method thereof
05/27/2009CN101442064A Semiconductor device and method of manufacturing the same
05/27/2009CN101442063A Semiconductor device and image sensing device
05/27/2009CN101442062A Electronic assembly for image sensor device
05/27/2009CN101442061A Circuit board and camera component using the same
05/27/2009CN101442060A Pixel array and method of manufacturing the same
05/27/2009CN101442057A Semiconductor device,its manufacturing method and electronic apparatus
05/27/2009CN101442056A Pixel array substrate
05/27/2009CN101442055A Improved memory cell for silicon static state stochastic memory of part depletion isolator
05/27/2009CN101442054A Non-volatile memory devices and methods of forming the same
05/27/2009CN101442053A Semiconductor device having storage nodes on active regions and method of fabricating the same
05/27/2009CN101442050A Integrated circuit suitable for various encapsulation modes
05/27/2009CN101442047A Electrostatic protection structure for low trigger voltage thyristor
05/27/2009CN101442046A Dynamic detection electrostatic protection circuit structure
05/27/2009CN101442045A Multi-fork syconoid MOSFET structure
05/27/2009CN101442044A Multi-fork syconoid MOSFET structure for improving electrostatic conducting homogeneity
05/27/2009CN101442042A Display device, preparation method and mask board for preparing the same
05/27/2009CN101442040A Encapsulation structure for LED and method of manufacturing the same
05/27/2009CN101442039A Method for reducing trigger voltage of silicon control rectifier
05/27/2009CN101442038A Capacitor and light emitting display using the same
05/27/2009CN101442037A Structure for packing bearing belt and method of manufacturing the same
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