| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/03/2009 | CN101447439A Lead for integrated circuit package |
| 06/03/2009 | CN100495703C Inductor for a system-on-a-chip and method for manufacturing the same |
| 06/03/2009 | CN100495700C Semiconductor device |
| 06/03/2009 | CN100495699C Semiconductor encapsulation structure with electromagnetic shielding function and its making method |
| 06/03/2009 | CN100495698C Method for forming interconnect structure and the formed interconnect structure |
| 06/03/2009 | CN100495697C Fuse and method for disconnecting the fuse |
| 06/03/2009 | CN100495696C Symmetric connect passage of programmable logic device |
| 06/03/2009 | CN100495695C Array line base board |
| 06/03/2009 | CN100495694C Semiconductor device |
| 06/03/2009 | CN100495693C Driving device and display |
| 06/03/2009 | CN100495692C Capillary pump cooler with micro-groove wing structure and its manufacturing method |
| 06/03/2009 | CN100495691C CPU radiator |
| 06/03/2009 | CN100495690C High performance reworkable heatsink and packaging structure and method of making same |
| 06/03/2009 | CN100495689C Method of packaging an optical sensor and image sensor device |
| 06/03/2009 | CN100495688C Semiconductor photodetector |
| 06/03/2009 | CN100495674C 半导体器件 Semiconductor devices |
| 06/03/2009 | CN100495673C Plasma processing method and method for fabricating electronic component module using the same |
| 06/03/2009 | CN100495649C Substrate treatment method |
| 06/03/2009 | CN100495644C Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device |
| 06/03/2009 | CN100495192C Camera module using a printed circuit board having step part |
| 06/02/2009 | US7542287 Air diverter for directing air upwardly in an equipment enclosure |
| 06/02/2009 | US7541782 System and method for extracting energy from an ultracapacitor |
| 06/02/2009 | US7541682 Semiconductor chip having bond pads |
| 06/02/2009 | US7541681 Interconnection structure, electronic component and method of manufacturing the same |
| 06/02/2009 | US7541680 Semiconductor device package |
| 06/02/2009 | US7541679 Exposed pore sealing post patterning |
| 06/02/2009 | US7541678 Printed wiring board, information processing apparatus, and method of manufacturing the printed wiring board |
| 06/02/2009 | US7541677 Semiconductor device comprising through-electrode interconnect |
| 06/02/2009 | US7541676 Fuse-structure |
| 06/02/2009 | US7541675 Semiconductor device including fluorine diffusion barrier layer and method for manufacturing the same |
| 06/02/2009 | US7541674 Integrated circuit die for wire bonding and flip-chip mounting |
| 06/02/2009 | US7541672 Semiconductor device |
| 06/02/2009 | US7541671 Organic electronic devices having external barrier layer |
| 06/02/2009 | US7541670 Semiconductor device having terminals |
| 06/02/2009 | US7541669 Semiconductor device package with base features to reduce leakage |
| 06/02/2009 | US7541668 Package frame and semiconductor package using the same |
| 06/02/2009 | US7541667 Semiconductor device and method of manufacturing the same |
| 06/02/2009 | US7541665 Lead frame for a magnetic sensor |
| 06/02/2009 | US7541664 Lead frame and semiconductor device having the lead frame |
| 06/02/2009 | US7541662 Packaging chip having inductor therein |
| 06/02/2009 | US7541660 Power semiconductor device |
| 06/02/2009 | US7541658 Optically interactive device package array |
| 06/02/2009 | US7541651 Semiconductor integrated circuit |
| 06/02/2009 | US7541648 Electrostatic discharge (ESD) protection circuit |
| 06/02/2009 | US7541647 Method of designing semiconductor integrated circuit device and semiconductor integrated circuit device |
| 06/02/2009 | US7541644 Semiconductor device with effective heat-radiation |
| 06/02/2009 | US7541635 Semiconductor fabrication using a collar |
| 06/02/2009 | US7541613 Methods for reducing within chip device parameter variations |
| 06/02/2009 | US7541612 Multi-chip package semiconductor device and method of detecting a failure thereof |
| 06/02/2009 | US7541611 Apparatus using Manhattan geometry having non-Manhattan current flow |
| 06/02/2009 | US7541294 Semiconductor package and semiconductor package mounting method |
| 06/02/2009 | US7541278 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
| 06/02/2009 | US7541274 Integrated circuit with a reduced pad bump area and the manufacturing method thereof |
| 06/02/2009 | US7541255 Method for manufacturing semiconductor device |
| 06/02/2009 | US7541238 Inductor formed in an integrated circuit |
| 06/02/2009 | US7541222 Wire sweep resistant semiconductor package and manufacturing method therefor |
| 06/02/2009 | US7541220 Integrated circuit device having flexible leadframe |
| 06/02/2009 | US7541212 Image sensor including an anti-reflection pattern and method of manufacturing the same |
| 06/02/2009 | US7541111 Electrochemical cell and fabrication method of the same |
| 06/02/2009 | US7540950 Introducing electrically conductive body into electroplating bath, depositing porous adhesion promoter layer on at least one surface of electrically conductive body, adhesion promoter layer including same substance as anode, adhesion promoter layer being deposited by cathodic reduction of metal ions |
| 06/02/2009 | CA2447858C Solid silane coupling agent composition, method for manufacturing the same, and resin composition containing the same |
| 05/28/2009 | WO2009067265A1 Semiconductor power device package having a lead frame-based integrated inductor |
| 05/28/2009 | WO2009066704A1 Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module |
| 05/28/2009 | WO2009066692A1 Process for producing substrate for power module, substrate for power module, and power module |
| 05/28/2009 | WO2009066498A1 Active matrix substrate, liquid crystal panel, television receiver, and liquid crystal panel manufacturing method |
| 05/28/2009 | WO2009066192A2 Wafer level package device with an smd form factor |
| 05/28/2009 | WO2009029566A3 Semiconductor device having wafer level chip scale packaging substrate decoupling |
| 05/28/2009 | WO2009025471A4 Apparatus for attaching adhesion film for manufacturing semiconductor packages |
| 05/28/2009 | WO2009001312A3 Packaged device for common mode filtering and esd protection |
| 05/28/2009 | WO2008054929A3 Methods and apparatus for a quad flat no-lead (qfn) package |
| 05/28/2009 | WO2007059193A3 Low profile image sensor package |
| 05/28/2009 | US20090137127 Plasma etching method and storage medium |
| 05/28/2009 | US20090137108 Semiconductor device, semiconductor wafer, and methods of producing the same device and wafer |
| 05/28/2009 | US20090137067 Method for forming an inductor |
| 05/28/2009 | US20090135878 Semiconductor light emitting device and method for manufacturing the same |
| 05/28/2009 | US20090134909 Programmable structured arrays |
| 05/28/2009 | US20090134902 Integrated circuit package having reversible esd protection |
| 05/28/2009 | US20090134901 Integrated circuit die structure simplifying ic testing and testing method thereof |
| 05/28/2009 | US20090134531 Overlay mark and method for forming the same |
| 05/28/2009 | US20090134530 Wiring substrate and method of manufacturing the same |
| 05/28/2009 | US20090134529 Circuit board module, electric device, and method for producing circuit board module |
| 05/28/2009 | US20090134528 Semiconductor package, electronic device including the semiconductor package, and method of manufacturing the semiconductor package |
| 05/28/2009 | US20090134527 Structure of three-dimensional stacked dice with vertical electrical self-interconnections and method for manufacturing the same |
| 05/28/2009 | US20090134526 Interconnect Structure to Reduce Stress Induced Voiding Effect |
| 05/28/2009 | US20090134525 Semiconductor device having a filling pattern around a storage structure and method of forming the same |
| 05/28/2009 | US20090134524 Semiconductor integrated circuit |
| 05/28/2009 | US20090134523 Semiconductor device and method of manufacturing the same |
| 05/28/2009 | US20090134521 Integrated circuit and manufacturing method of copper germanide and copper silicide as copper capping layer |
| 05/28/2009 | US20090134520 Process integration scheme to lower overall dielectric constant in beol interconnect structures |
| 05/28/2009 | US20090134519 Semiconductor device |
| 05/28/2009 | US20090134518 Semiconductor device and manufacturing method of semiconductor device |
| 05/28/2009 | US20090134517 Semiconductor device and method of manufacturing the same |
| 05/28/2009 | US20090134516 Method of manufacturing semiconductor device and semiconductor device |
| 05/28/2009 | US20090134515 Semiconductor package substrate |
| 05/28/2009 | US20090134514 Method for fabricating electrical bonding pads on a wafer |
| 05/28/2009 | US20090134513 Method and structures for fabricating mems devices on compliant layers |
| 05/28/2009 | US20090134512 Method of producing multiple semiconductor devices |
| 05/28/2009 | US20090134511 Multiple Size Package Socket |
| 05/28/2009 | US20090134510 Semiconductor package and method of fabricating the same, and electronic device using the semiconductor package |
| 05/28/2009 | US20090134509 Integrated circuit packaging system with carrier and method of manufacture thereof |