| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/04/2009 | US20090140398 Hard mask patterns of a semiconductor device and a method for forming the same |
| 06/04/2009 | US20090140397 Semiconductor device and manufacturing method therefor |
| 06/04/2009 | US20090140395 Edge seal for thru-silicon-via technology |
| 06/04/2009 | US20090140394 Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die |
| 06/04/2009 | US20090140393 Wafer scribe line structure for improving ic reliability |
| 06/04/2009 | US20090140392 Warpage resistant semiconductor package and method for manufacturing the same |
| 06/04/2009 | US20090140391 Seal Ring in Semiconductor Device |
| 06/04/2009 | US20090140387 High-density 3-dimensional resistors |
| 06/04/2009 | US20090140384 Process for obtaining a thin, insulating, soft magnetic film of high magnetization, corresponding film and corresponding integrated circuit |
| 06/04/2009 | US20090140383 Method of creating spiral inductor having high q value |
| 06/04/2009 | US20090140382 Electric fuse device made of polysilicon silicide |
| 06/04/2009 | US20090140380 Device with gaps for capacitance reduction |
| 06/04/2009 | US20090140379 Semiconductor device and method for fabricating the same |
| 06/04/2009 | US20090140378 Flash memory device and method of fabricating the same |
| 06/04/2009 | US20090140377 Dielectric isolation type semiconductor device and manufacturing method therefor |
| 06/04/2009 | US20090140370 Semiconductor device |
| 06/04/2009 | US20090140355 Semiconductor pressure sensor and its fabrication method |
| 06/04/2009 | US20090140340 ESD protection device structure |
| 06/04/2009 | US20090140339 ESD Protection Device and Method for Manufacturing the Same |
| 06/04/2009 | US20090140303 Semiconductor device and method for manufacturing the same |
| 06/04/2009 | US20090140299 Memory with high dielectric constant antifuses adapted for use at low voltage |
| 06/04/2009 | US20090140284 Transparent Inorganic Oxide Dispersion and Iorganic Oxide Particle-Containing Resin Composition, Composition for Sealing Light Emitting Element and Light Emitting element, Hard Coat Film and Optical Functional Film and Optical Component, and Method for Producing Inorganic Oxide Pariticle-Containing Resin |
| 06/04/2009 | US20090140266 Package including oriented devices |
| 06/04/2009 | US20090140247 Semiconductor device and method of manufacturing semiconductor device |
| 06/04/2009 | US20090140246 Method and test structure for monitoring cmp processes in metallization layers of semiconductor devices |
| 06/04/2009 | US20090140244 Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding |
| 06/04/2009 | US20090139697 Heat transfer device and method of making same |
| 06/04/2009 | US20090139085 Circuit substrates, semiconductor device, semiconductor manufacturing apparatuses, methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices |
| 06/04/2009 | DE202009003583U1 Kühler für einen Speicher Coolers for memory |
| 06/04/2009 | DE10335622B4 Harzversiegelte Halbleiterbaugruppe The resin-sealed semiconductor device |
| 06/04/2009 | DE102008057982A1 Verfahren zur Herstellung eines Systems Process for the preparation of a system |
| 06/04/2009 | DE102008056846A1 Leistungshalbleitermodul mit Temperaturmessung Power semiconductor module with temperature measurement |
| 06/04/2009 | DE102008053427A1 Durchsubstratverbindungskontakt-Halbleiterkomponenten Substrate compound by contacting semiconductor components |
| 06/04/2009 | DE102008046729A1 Halbleiterbauelement mit leitendem Die-Attach-Material Semiconductor device with conductive die attach material |
| 06/04/2009 | DE102008042772A1 Flexible LED-Verbindung mittels Metallbahnen Flexible LED connection using metal tracks |
| 06/04/2009 | DE102008042197A1 In eine Wärmesenke integrierte elektrische Abschirmung In a heat sink integrated electrical shielding |
| 06/04/2009 | DE102008032175A1 Adressentreiber und Herstellungsverfahren sowie diesen verwendendes Anzeigebauelement Address drivers, processes and these display-use device |
| 06/04/2009 | DE102008005935A1 Halbleiteranordnung sowie Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device |
| 06/04/2009 | DE102007057728A1 Halbleiterbauelement mit einer Kurzschlussstruktur, die einen Teiltransistor des Halbleiterbauelements umfasst, der eine geringe Temperaturabhängigkeit aufweist und Verfahren zur Herstellung eines solchen Halbleiterbauelements A semiconductor device comprising a short-circuit structure, the transistor comprises part of the semiconductor device which has a small temperature dependence, and methods of manufacturing such a semiconductor device |
| 06/04/2009 | DE102007057709A1 Measuring-structures i.e. critical dimension-measuring-structures, positioning method for use during manufacture of e.g. integrated circuit, involves positioning additional structure elements in area, and forming structures above elements |
| 06/04/2009 | DE102007057689A1 Halbleiterbauelement mit einem Chipgebiet, das für eine aluminiumfreie Lothöckerverbindung gestaltet ist, und eine Teststruktur, die für eine aluminiumfreie Drahtverbindung gestaltet ist A semiconductor device having a chip area which is designed for an aluminum-free Lothöckerverbindung, and a test structure that is designed for an aluminum-free wire connection |
| 06/04/2009 | DE102007057684A1 Verfahren und Teststruktur zur Überwachung von CMP-Prozessen in Metallisierungsschichten von Halbleiterbauelementen The method and test structure for monitoring of CMP processes in metallization of semiconductor components |
| 06/04/2009 | DE102007057682A1 Hybridkontaktstruktur mit Kontakt mit kleinem Aspektverhältnis in einem Halbleiterbauelement Hybrid contact structure with contact with small aspect ratio in a semiconductor device |
| 06/04/2009 | DE102007057672A1 Optoelectronic semiconductor body e.g. thin film-LED chip, for use in headlight i.e. motor vehicle headlight, has Schottky contact formed between extension and n-type layer and operated in reverse direction during operation of active layer |
| 06/04/2009 | DE102007056952A1 Montagevorrichtung und Montageverfahren für einen Kühlkörper Mounting apparatus and mounting method for a heat sink |
| 06/04/2009 | DE102007051797B3 Korrosionsbeständige Mikrokanalwärmesenke Corrosion-resistant micro-channel heat sink |
| 06/04/2009 | DE102007005692B4 Elektrooptisches Leuchtmittel mit organischem lichtemittierendem Material Electro-optical bulb with organic light-emitting material |
| 06/04/2009 | DE102006008332B4 Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit A process for preparing a functional unit and functional unit |
| 06/04/2009 | DE102005048492B4 Elektrisches Modul Electrical module |
| 06/04/2009 | DE102005030247B4 Leistungshalbleitermodul mit Verbindungselementen hoher Stromtragfähigkeit Power semiconductor module with fasteners high current carrying capacity |
| 06/04/2009 | DE102005026703B4 Kühlanordnung für eine Anordnung von elektrischen Kondensatoren und Kühlanordnung für eine Anordnung von zylinderförmigen Bauelementen Cooling arrangement for an array of electrical capacitors and cooling arrangement for an array of cylindrical components |
| 06/04/2009 | DE102005011300B4 Vorspannungsschaltung, Festkörper-Abbildungssystem und zugehöriges Herstellungsverfahren Bias, solid-state imaging system and manufacturing method thereof |
| 06/04/2009 | DE102004064081B9 Gehäuse für einen optischen Empfänger Housing for an optical receiver |
| 06/04/2009 | DE102004031391B4 Elektronisches Bauteil mit Gehäuse zum ESD-Schutz Electronic component with housing for ESD protection |
| 06/04/2009 | DE102004027074B4 Verfahren zur Herstellung eines BGA (Ball Grid Array)-Bauteils mit einer dünnen metallischen Kühlfolie A method for preparing a BGA (Ball Grid Array) component with a thin metallic film cooling |
| 06/04/2009 | DE10136798B4 Eingangsschnittstellenschaltung für eine integrierte Halbleiterschaltungsvorrichtung Input interface circuit for a semiconductor integrated circuit device |
| 06/04/2009 | DE10019838B4 Mehrschichtkondensator, Verdrahtungssubstrat damit und Verwendung eines derartigen Mehrschichtkondensators Multi-layer capacitor wiring substrate and thus use of such a multilayer capacitor |
| 06/03/2009 | EP2066157A2 Wiring substrate and manufacturing method thereof |
| 06/03/2009 | EP2065935A1 Cooling apparatus |
| 06/03/2009 | EP2065934A2 Heat dissipation apparatus |
| 06/03/2009 | EP2065933A2 Heat dissipation apparatus |
| 06/03/2009 | EP2065932A1 Thermal interface structure and method for manufacturing the same |
| 06/03/2009 | EP2065931A1 Semiconductor device member, liquid for forming semiconductor device member, method for manufacturing semiconductor device member, and liquid for forming semiconductor device member using the method, phosphor composition, semiconductor light emitting device, illuminating apparatus and image display apparatus |
| 06/03/2009 | EP2065930A1 Semiconductor device vacuum package and manufacturing process thereof |
| 06/03/2009 | EP2065929A1 Semiconductor sensor device and method for manufacturing same |
| 06/03/2009 | EP2065928A2 Semiconductor device and manufacturing method thereof |
| 06/03/2009 | EP2065927A1 Integration and manufacturing method of Cu germanide and Cu silicide as Cu capping layer |
| 06/03/2009 | EP2065430A1 Resin for optical-semiconductor-element encapsulation containing polyaluminosiloxane and optical semiconductor device obtained with the same |
| 06/03/2009 | EP2065429A1 Resin for optical-semiconductor-element encapsulation and optical semiconductor device obtained with the same |
| 06/03/2009 | EP2065283A1 Cooling device for mobile body |
| 06/03/2009 | EP2064932A2 Heatsink attachment mechanism |
| 06/03/2009 | EP2064740A1 Semiconductor device and manufacturing method thereof |
| 06/03/2009 | EP2064737A1 CuSiN/SiN DIFFUSION BARRIER FOR COPPER IN INTEGRATED-CIRCUIT DEVICES |
| 06/03/2009 | EP2064260A2 Benzoxazine-containing formulations polymerizable/curable at low temperature |
| 06/03/2009 | EP1303898A4 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| 06/03/2009 | CN201252096Y Structure for achieving functional insulation of transistor fixed on radiator |
| 06/03/2009 | CN201252095Y Heat conduction structure for the compression joint of a CPU and a heat pipe of a notebook |
| 06/03/2009 | CN201252094Y High-efficiency heat conduction structure for the compression joint of a CPU of a notebook and a heat pipe |
| 06/03/2009 | CN101449376A Contact surrounded by passivation and polymide and method therefor |
| 06/03/2009 | CN101449375A A device, a system and a method applied to the connection without leads in the encapsulation of an integrate circuit |
| 06/03/2009 | CN101449374A Highly heat conductive, flexible sheet |
| 06/03/2009 | CN101449373A Semiconductor device, electronic parts module, and method for manufacturing the semiconductor device |
| 06/03/2009 | CN101449372A Flip chip MLP with folded heat sink |
| 06/03/2009 | CN101449371A Resin-coated semiconductor device and electronic devices using the semiconductor device |
| 06/03/2009 | CN101448382A Thermal interconnect system and method of production thereof |
| 06/03/2009 | CN101447640A Semiconductor light emitting device and method for manufacturing the same |
| 06/03/2009 | CN101447492A Semiconductor display device |
| 06/03/2009 | CN101447473A Integrated circuit layout structure and manufacturing method thereof |
| 06/03/2009 | CN101447472A Etch stop layer, double-mosaic structure and forming method thereof |
| 06/03/2009 | CN101447471A Substrate for semiconductor package and semiconductor package having the same |
| 06/03/2009 | CN101447470A Semiconductor apparatus |
| 06/03/2009 | CN101447469A Wafer level semiconductor package and method for manufacturing the same |
| 06/03/2009 | CN101447468A Nitride semiconductor device and method of manufacturing the same |
| 06/03/2009 | CN101447467A Seed gas bubble micro heat exchanger and seed gas bubble micro heat exchanger system |
| 06/03/2009 | CN101447466A Boiling enhanced heat exchange structure of chips and fabrication method thereof |
| 06/03/2009 | CN101447465A Metal carrier band for packaging noncontact module with large size |
| 06/03/2009 | CN101447464A Vacuum package and manufacturing process thereof |
| 06/03/2009 | CN101447463A Semiconductor wafer having a multi-layer wiring structure |
| 06/03/2009 | CN101447462A 半导体装置 Semiconductor device |
| 06/03/2009 | CN101447461A Semiconductor device package having a back side protective scheme and method thereof |