Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2009
06/09/2009US7545005 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
06/09/2009US7545001 Semiconductor device having high drive current and method of manufacture therefor
06/09/2009US7544973 Miniature optical element for wireless bonding in an electronic instrument
06/09/2009US7544970 Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
06/09/2009US7544896 Forming a porous dielectric layer and structures formed thereby
06/09/2009US7544727 Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate
06/09/2009US7544607 Semiconductor device having thin film formed by atomic layer deposition and method for fabricating the same
06/09/2009US7544602 Method and structure for ultra narrow crack stop for multilevel semiconductor device
06/09/2009US7544541 Semiconductor package
06/09/2009US7544528 Method for manufacturing substrate of liquid crystal device
06/09/2009US7544522 Fabrication method of semiconductor integrated circuit device
06/09/2009US7544309 Illumination system comprising a radiation source and a fluorescent material
06/09/2009US7544268 Static electricity preventing method and member using the method
06/09/2009US7544263 Method of forming folded-stack packaged device using vertical progression folding tool
06/09/2009US7544049 Cooling device and centrifugal pump to be used in the same device
06/09/2009US7543961 LED light with active cooling
06/09/2009US7543377 Perimeter matrix ball grid array circuit package with a populated center
06/09/2009CA2195859C Microcomponent sheet architecture
06/04/2009WO2009070359A1 Stacked-die package for battery power management
06/04/2009WO2009070348A1 Wafer level packaging using flip chip mounting
06/04/2009WO2009069853A1 Heat slug for wafer level chip scale packages and method of manufacturing the same
06/04/2009WO2009069807A1 Optical device, sealing board and method for manufacturing optical device
06/04/2009WO2009069791A1 Wiring substrate, mounting structure, and method for manufacturing the wiring substrate
06/04/2009WO2009069696A1 Source driver, source driver manufacturing method, and liquid crystal module
06/04/2009WO2009069684A1 Heat dissipation structure, process for producing the heat dissipation structure, heat dissipation device using the heat dissipation structure, diamond heat sink, process for producing the diamond heat sink, heat dissipation device using the diamond heat sink, and heat dissipation method
06/04/2009WO2009069578A1 Liquid-cooled cooling device
06/04/2009WO2009069527A1 Ebullient cooling unit
06/04/2009WO2009069308A1 Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
06/04/2009WO2009069269A1 Method and device for cutting substrate
06/04/2009WO2009069020A1 Contact structure for an electronic circuit substrate and electronic circuit comprising said contact structure
06/04/2009WO2009068837A1 A semiconductor integrated circuit device including a revision number indicating the design version of said device and a method of prototyping a semiconductor chip
06/04/2009WO2009068374A1 Underbump metallurgy employing sputter-deposited nickel copper alloy
06/04/2009WO2009068373A1 Underbump metallurgy employing sputter-deposited nickel titanium alloy
06/04/2009WO2009068010A1 Laminated power electronics subassembly
06/04/2009WO2009055069A3 Multiple package module using a rigid flex printed circuit board
06/04/2009WO2009051679A3 Process for placing, securing and interconnecting electronic components
06/04/2009WO2009051440A3 Bump structure with multiple layers and method of manufacture
06/04/2009WO2009042546A3 Stacked dual-die packages, methods of making, and systems incorporating said packages
06/04/2009WO2009032539A3 Semiconductor assemblies and methods of manufacturing such assemblies
06/04/2009WO2009031057A3 Security chip
06/04/2009WO2009018589A3 Assembly of encapsulated electronic components to a printed circuit board
06/04/2009WO2009016407A3 Tiled light sensing array
06/04/2009WO2009016397A3 Electrostatic discharge protection circuit
06/04/2009WO2008133594A3 Cooling device for electronic components
06/04/2009WO2007001988A3 Structure and method for forming laterally extending dielectric layer in a trench-gate fet
06/04/2009WO2006138423A3 Chip connector
06/04/2009WO2005062998A3 Metal interconnect system and method for direct die attachment
06/04/2009WO2005059967A3 Multiple chip package module having inverted package stacked over die
06/04/2009US20090142924 Reduced electromigration and stressed induced migration of cu wires by surface coating
06/04/2009US20090142883 Leaded Stacked Packages Having Elevated Die Paddle
06/04/2009US20090141758 Semiconductor laser equipment
06/04/2009US20090141578 Fuse box and semiconductor memory device including the same
06/04/2009US20090141498 Lead frame, method of making the same and light receiving/emitting device
06/04/2009US20090141493 Led system, led lamp and method for assembling a led system
06/04/2009US20090140757 Microdisplay Assemblies and Methods of Packaging Microdisplays
06/04/2009US20090140443 Microstructure with Enlarged Mass and Electrode Area for Kinetic to Electrical Energy Conversion
06/04/2009US20090140442 Wafer Level Package Integration and Method
06/04/2009US20090140441 Wafer Level Die Integration and Method
06/04/2009US20090140440 Multi-chip stack structure and method for fabricating the same
06/04/2009US20090140439 Method of manufacturing a chip and a chip stack
06/04/2009US20090140438 Semiconductor device and manufacturing method thereof
06/04/2009US20090140437 Semiconductor device and fabrication method thereof
06/04/2009US20090140436 Method for forming a via in a substrate and substrate with a via
06/04/2009US20090140435 Semiconductor integrated circuit device and a method of prototyping a semiconductor chip
06/04/2009US20090140434 Flexible column die interconnects and structures including same
06/04/2009US20090140433 MEMS chip-to-chip interconnects
06/04/2009US20090140432 Pad structure to provide improved stress relief
06/04/2009US20090140431 Hybrid contact structure with low aspect ratio contacts in a semiconductor device
06/04/2009US20090140430 Copper Alloy Sputtering Target and Semiconductor Element Wiring
06/04/2009US20090140429 Metal interconnection of a semiconductor device and method of manufacturing the same
06/04/2009US20090140428 Air gap structure having protective metal silicide pads on a metal feature
06/04/2009US20090140427 Metal foil interconnection of electrical devices
06/04/2009US20090140426 Flip chip package and method for manufacturing the same
06/04/2009US20090140425 Chip Package
06/04/2009US20090140424 Wafer level semiconductor package and method for manufacturing the same
06/04/2009US20090140423 Underbump metallurgy employing sputter-deposited nickel titanium alloy
06/04/2009US20090140422 Substrate for semiconductor package with improved bumping of chip bumps and contact pads and semiconductor package having the same
06/04/2009US20090140421 Semiconductor Device and Method of Making Integrated Passive Devices
06/04/2009US20090140420 Soft error rate mitigation by interconnect structure
06/04/2009US20090140419 Extended plating trace in flip chip solder mask window
06/04/2009US20090140418 Method for integrating porous low-k dielectric layers
06/04/2009US20090140417 Holistic Thermal Management System for a Semiconductor Chip
06/04/2009US20090140416 Cap member and semiconductor device employing same
06/04/2009US20090140415 Combination substrate
06/04/2009US20090140414 Semiconductor device
06/04/2009US20090140413 Semiconductor package structure, applications thereof and manufacturing method of the same
06/04/2009US20090140412 Semiconductor device having improved solder joint and internal lead lifetimes
06/04/2009US20090140411 Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device
06/04/2009US20090140410 Electronic part and method of producing the same
06/04/2009US20090140409 Semiconductor device
06/04/2009US20090140408 Integrated circuit package-on-package system with stacking via interconnect
06/04/2009US20090140407 Integrated circuit package-on-package system with anti-mold flash feature
06/04/2009US20090140406 Semiconductor Mount
06/04/2009US20090140405 Semiconductor device and resin adhesive used to manufacture the same
06/04/2009US20090140404 Hermetic seal and reliable bonding structures for 3d applications
06/04/2009US20090140403 Electronic device
06/04/2009US20090140402 Semiconductor device and method for manufacturing the same
06/04/2009US20090140401 System and Method for Improving Reliability of Integrated Circuit Packages
06/04/2009US20090140400 Method of Mid-Frequency Decoupling
06/04/2009US20090140399 Semiconductor Module with Switching Components and Driver Electronics
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