| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/10/2009 | CN101454896A Flexible joint methodology to attach a die on an organic substrate |
| 06/10/2009 | CN101454895A 半导体输入控制装置 The semiconductor input control device |
| 06/10/2009 | CN101452931A Integrated circuit device |
| 06/10/2009 | CN101452914A Electrostatic prevention protection device construction having silicon controlled rectifier triggering current added |
| 06/10/2009 | CN101452913A Device structure using silicon controlled rectifier as electrostatic protection |
| 06/10/2009 | CN101452912A Alignment for backside illumination sensor |
| 06/10/2009 | CN101452911A Test construction for detecting W plug chemical mechanical polishing process |
| 06/10/2009 | CN101452910A Test construction for transistor |
| 06/10/2009 | CN101452909A Contact hole interlayer film, manufacturing method thereof, and contact hole etching method |
| 06/10/2009 | CN101452908A Display apparatus and repairing method therefor |
| 06/10/2009 | CN101452907A Vertical interconnecting through-hole for three-dimensional systematic encapsulation, and preparation thereof |
| 06/10/2009 | CN101452906A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 06/10/2009 | CN101452905A Self-alignment contact hole interlayer film, manufacturing method, and contact hole etching method |
| 06/10/2009 | CN101452904A Lead frame, method of making the same and light receiving/emitting device |
| 06/10/2009 | CN101452903A Pin rack for pin less encapsulation and encapsulation structure thereof |
| 06/10/2009 | CN101452902A Semiconductor device and manufacturing method of the same |
| 06/10/2009 | CN101452901A Micro link lug structure with stress buffer and its producing method |
| 06/10/2009 | CN101452900A LCD driver ic and method for manufacturing the same |
| 06/10/2009 | CN101452899A Nitride semiconductor device and method of manufacturing the same |
| 06/10/2009 | CN101452898A Heat radiation element for fin type crystal |
| 06/10/2009 | CN101452897A Heat radiating device for LED |
| 06/10/2009 | CN101452896A Rubber pre-filling encapsulation construction, manufacturing and using method thereof |
| 06/10/2009 | CN101452895A Semiconductor device and resin adhesive used to manufacture the same |
| 06/10/2009 | CN101452894A Gaas semiconductor substrate , group III-v compound semiconductor device and method of manufacturing the same |
| 06/10/2009 | CN100499968C Connection substrate, multilayer wiring board using the connection substrate, substrate for semiconductor package, semiconductor package, and methods for manufacturing them |
| 06/10/2009 | CN100499367C Surface acoustic wave device, package for the device, and method of fabricating the device |
| 06/10/2009 | CN100499363C Package for piezoelectric resonator package, and piezoelectric resonator |
| 06/10/2009 | CN100499175C Semiconductor device and method for manufacturing the same |
| 06/10/2009 | CN100499144C Method for forming an image sensor having concave-shaped micro-lenses |
| 06/10/2009 | CN100499143C Solid camera device and method for manufacturing same |
| 06/10/2009 | CN100499142C Light sensitive chip packaging structure |
| 06/10/2009 | CN100499130C Structure and forming method |
| 06/10/2009 | CN100499111C Testing structure for MOS capacitor and location method for failure point |
| 06/10/2009 | CN100499110C Substrate of thin-film transistor |
| 06/10/2009 | CN100499109C Monolithically integrated circuit for radio frequency applications |
| 06/10/2009 | CN100499108C Interconnected lines structure and wafer |
| 06/10/2009 | CN100499107C Back-end metallation structure and manufacturing method thereof |
| 06/10/2009 | CN100499106C Semiconductor device |
| 06/10/2009 | CN100499105C Bonding pad having slotted metal pad and mesh type via pattern |
| 06/10/2009 | CN100499104C Flip chip contact(PCC) power package and package method |
| 06/10/2009 | CN100499103C Semiconductor interconnect structure and NOR type quickflashing memory and method of manufacture |
| 06/10/2009 | CN100499101C Thin film crystal-coated package structure with extended pin |
| 06/10/2009 | CN100499100C Wiring board and semiconductor device |
| 06/10/2009 | CN100499099C Lead frame for a semiconductor device |
| 06/10/2009 | CN100499098C Tape coiling type semiconductor packaging structure for electrostatic discharge protection when bonding chip |
| 06/10/2009 | CN100499097C High-frequency integrated circuit packaging construction for improving connectivity of embedded projection and manufacturing method thereof |
| 06/10/2009 | CN100499096C Encapsulation structure for high frequency integrated circuit and its making method |
| 06/10/2009 | CN100499095C Semiconductor device and method of manufacturing same |
| 06/10/2009 | CN100499094C Semiconductor element |
| 06/10/2009 | CN100499093C Chip packaging structure |
| 06/10/2009 | CN100499092C Semiconductor device having terminal |
| 06/10/2009 | CN100499091C Method, device and system for cooling heat source |
| 06/10/2009 | CN100499090C Liquid cooling thermolysis device |
| 06/10/2009 | CN100499089C Radiator |
| 06/10/2009 | CN100499088C Fastener of radiator |
| 06/10/2009 | CN100499087C Column adsorption head and column loading method |
| 06/10/2009 | CN100499086C High wet sensitive electronic device element and its manufacturing method |
| 06/10/2009 | CN100499067C Method and device for forming interconnection |
| 06/10/2009 | CN100499056C Process for fabricating semiconductor integrated circuit device |
| 06/10/2009 | CN100499053C Power semiconductor wiring technology for electric insulation material layer that follows the surface contours |
| 06/10/2009 | CN100499052C Planar grid array packaged device and method of forming same |
| 06/10/2009 | CN100497473C Molding compositions containing quaternary organophosphonium salts |
| 06/10/2009 | CN100496858C Methods of drilling through-holes in homogenous and non-homogeneous substrates |
| 06/10/2009 | CN100496763C Deck stain applicator |
| 06/09/2009 | US7546557 Systems and methods for reducing IR-drop noise |
| 06/09/2009 | US7545970 Visual inspection method and visual inspection apparatus |
| 06/09/2009 | US7545648 Cooling structure using rigid movable elements |
| 06/09/2009 | US7545647 Compliant thermal interface structure utilizing spring elements |
| 06/09/2009 | US7545646 Cooling assembly |
| 06/09/2009 | US7545253 Electronic fuse with conformal fuse element formed over a freestanding dielectric spacer |
| 06/09/2009 | US7545059 Chip-scale coils and isolators based thereon |
| 06/09/2009 | US7545051 nanowires comprise ZnO, TiO2, SnO2 or combination and the semiconductor material is CuI or CuSCN; isothiocyanato)bis(2,2'-bipyridyl-4,4'-dicarboxylato)-ruthenium(II) dye; fluorine doped SnO2 or IT conductive layer; photovoltic cells; cost efficiency |
| 06/09/2009 | US7545050 Design structure for final via designs for chip stress reduction |
| 06/09/2009 | US7545049 Electronic parts packaging structure |
| 06/09/2009 | US7545048 Stacked die package |
| 06/09/2009 | US7545047 Semiconductor device with a wiring substrate and method for producing the same |
| 06/09/2009 | US7545046 Semiconductor devices having a trench in a side portion of a conducting line pattern and methods of forming the same |
| 06/09/2009 | US7545044 Semiconductor device and radiation detector employing it |
| 06/09/2009 | US7545043 multi-layered thin film consisting of a tantalum nitride or nickel-chromium or tatalum-silicon oxide first layer, a tantalum layer covering the first layer, and a gold thin film formed on the tantalum layer; silicon or galss substrate; |
| 06/09/2009 | US7545042 Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure |
| 06/09/2009 | US7545041 Techniques for patterning features in semiconductor devices |
| 06/09/2009 | US7545040 Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device |
| 06/09/2009 | US7545039 Structure for reducing stress for vias and fabricating method thereof |
| 06/09/2009 | US7545038 Bumping process and bump structure |
| 06/09/2009 | US7545037 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same |
| 06/09/2009 | US7545036 Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
| 06/09/2009 | US7545035 Semiconductor device having several assembled integrated-circuit chips and method of assembling and electrically connecting the integrated-circuit chips |
| 06/09/2009 | US7545034 Thermal energy removal structure and method |
| 06/09/2009 | US7545033 Low cost power semiconductor module without substrate |
| 06/09/2009 | US7545032 Integrated circuit package system with stiffener |
| 06/09/2009 | US7545031 Multipackage module having stacked packages with asymmetrically arranged die and molding |
| 06/09/2009 | US7545030 Article having metal impregnated within carbon nanotube array |
| 06/09/2009 | US7545029 Stack microelectronic assemblies |
| 06/09/2009 | US7545028 Solder ball assembly for a semiconductor device and method of fabricating same |
| 06/09/2009 | US7545027 Wafer level package having redistribution interconnection layer and method of forming the same |
| 06/09/2009 | US7545026 Electronic device comprising an integrated circuit |
| 06/09/2009 | US7545025 Semiconductor device |
| 06/09/2009 | US7545024 Laser beam processing apparatus for processing semiconductor wafer in production of semiconductor devices, laser beam processing method executed therein, and such semiconductor wafer processed thereby |
| 06/09/2009 | US7545021 Apparatus and method for making integrated circuit packages having integrated circuits mounted onto passive electrical components |
| 06/09/2009 | US7545009 Word lines for memory cells |