| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/17/2009 | CN100502178C Semiconductor laser equipment |
| 06/17/2009 | CN100502019C 光学装置 Optical device |
| 06/17/2009 | CN100501999C Semiconductor device and manufacturing method thereof |
| 06/17/2009 | CN100501991C An encapsulated chip and its encapsulation method for chip |
| 06/17/2009 | CN100501990C Substrate structure and manufacturing method thereof |
| 06/17/2009 | CN100501989C Electronic component mounting package and package assembled substrate |
| 06/17/2009 | CN100501988C Lead wire frame, semiconductor device and method of manufacture, and injection mold |
| 06/17/2009 | CN100501987C Die down ball grid array packages and method for making same |
| 06/17/2009 | CN100501986C Semiconductor device and its manufacturing method |
| 06/17/2009 | CN100501985C Chip structure with lug and manufacturing method thereof |
| 06/17/2009 | CN100501984C 半导体结构 The semiconductor structure |
| 06/17/2009 | CN100501983C 半导体芯片封装 The semiconductor chip package |
| 06/17/2009 | CN100501982C Wiring board with semiconductor component |
| 06/17/2009 | CN100501960C Lead solder indicator and method |
| 06/17/2009 | CN100501955C Solder composition and method of bump formation therewith |
| 06/17/2009 | CN100501929C Method of adjusting deviation of critical dimension of patterns |
| 06/17/2009 | CN100501912C 半导体芯片包装体 The semiconductor chip package |
| 06/17/2009 | CN100501910C Manufacturing method for a base piece made to adhere to an adhesive sheet, for a semiconductor wafer and for a semiconductor device |
| 06/17/2009 | CN100501767C 存储卡 Memory Card |
| 06/16/2009 | US7548643 Methods, objects and apparatus employing machine readable data |
| 06/16/2009 | US7548425 Heat-Receiving apparatus and electronic equipment |
| 06/16/2009 | US7547979 Semiconductor device and method of locating a predetermined point on the semiconductor device |
| 06/16/2009 | US7547978 Underfill and encapsulation of semiconductor assemblies with materials having differing properties |
| 06/16/2009 | US7547977 Semiconductor chip having bond pads |
| 06/16/2009 | US7547976 Electrode pad arrangement with open side for waste removal |
| 06/16/2009 | US7547975 Module with embedded semiconductor IC and method of fabricating the module |
| 06/16/2009 | US7547974 Wiring substrate with improvement in tensile strength of traces |
| 06/16/2009 | US7547973 Tamper-resistant semiconductor device |
| 06/16/2009 | US7547972 forming both the barrier layer of monomolcular organosilane compound and palladium catalyst, and the Cu as wiring layer only by electroless plating, which is a wet process; firm adhesion |
| 06/16/2009 | US7547971 Semiconductor integrated circuit device |
| 06/16/2009 | US7547970 Semiconductor device |
| 06/16/2009 | US7547969 Semiconductor chip with passivation layer comprising metal interconnect and contact pads |
| 06/16/2009 | US7547968 Semiconductor device |
| 06/16/2009 | US7547967 Semiconductor device and method of manufacturing the same |
| 06/16/2009 | US7547966 Power semiconductor module |
| 06/16/2009 | US7547965 Package and package module of the package |
| 06/16/2009 | US7547964 Device packages having a III-nitride based power semiconductor device |
| 06/16/2009 | US7547963 Semiconductor device and its wiring method |
| 06/16/2009 | US7547962 Chip package with a ring having a buffer groove that surrounds the active region of a chip |
| 06/16/2009 | US7547961 IC card with bonding wire connections of different lengths |
| 06/16/2009 | US7547960 Structure of a lead-frame matrix of photoelectron devices |
| 06/16/2009 | US7547956 Thick oxide P-gate NMOS capacitor for use in a low-pass filter of a circuit and method of making same |
| 06/16/2009 | US7547947 SRAM cell |
| 06/16/2009 | US7547935 Semiconductor devices including buried digit lines that are laterally offset from corresponding active-device regions |
| 06/16/2009 | US7547916 Electronic circuit |
| 06/16/2009 | US7547850 Semiconductor device assemblies with compliant spring contact structures |
| 06/16/2009 | US7547648 Fabricating nanoscale and atomic scale devices |
| 06/16/2009 | US7547630 Method for stacking semiconductor chips |
| 06/16/2009 | US7547608 Polysilicon hard mask for enhanced alignment signal |
| 06/16/2009 | US7547583 Light emitting diode package with direct leadframe heat dissipation |
| 06/16/2009 | US7547582 Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies |
| 06/16/2009 | US7547581 Manufacturing method of a semiconductor device to suppress generation of whiskers |
| 06/16/2009 | US7547580 Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region |
| 06/16/2009 | US7547412 Heat sink for semiconductor; copper molybdenum composite; low cost, high thermoconductivity, thermal expansion coefficient can be matched with silicon and gallium arsenide (GaAs) |
| 06/16/2009 | US7546675 Method and system for manufacturing a wireless communication device |
| 06/11/2009 | WO2009073728A1 Secure connector grid array package |
| 06/11/2009 | WO2009073428A1 Robust mems flow die with integrated protective flow channel |
| 06/11/2009 | WO2009073359A1 Interconnect structure for a microelectronic device, method of manfacturing same, and microelectronic structure containing same |
| 06/11/2009 | WO2009073231A1 Embedded package security tamper mesh |
| 06/11/2009 | WO2009073087A2 A semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding |
| 06/11/2009 | WO2009072632A1 Curable composition, coating composition for optical device, led sealing material, and method for producing the same |
| 06/11/2009 | WO2009072544A1 Electrode structure, method for manufacturing the electrode structure, and circuit board and semiconductor module |
| 06/11/2009 | WO2009072432A1 Method for manufacturing package, package, electronic device, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled clock |
| 06/11/2009 | WO2009072358A1 Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device and atomic clock |
| 06/11/2009 | WO2009072096A1 A method for attaching a semiconductor die to a leadframe, and a semiconductor device |
| 06/11/2009 | WO2009072052A1 Semiconductor device and wafer with a test structure and method for assessing adhesion of under-bump metallization |
| 06/11/2009 | WO2009072046A1 Cooling device utilizing internal synthetic jets |
| 06/11/2009 | WO2009071982A2 Under bump routing layer method and apparatus |
| 06/11/2009 | WO2009071645A2 Silicon-ceramic composite substrate |
| 06/11/2009 | WO2009070998A1 Polysilicon silicide electrical fuse device |
| 06/11/2009 | WO2009035972A3 Packaged integrated circuits and methods to form a stacked integrated circuit package |
| 06/11/2009 | WO2007078325A3 Attachment of deep drawn resonator shell |
| 06/11/2009 | WO2006036358A3 Power led package |
| 06/11/2009 | WO2002078781A3 Method and apparatus for providing hermetic electrical feedthrough |
| 06/11/2009 | US20090149034 Semiconductor module and method of manufacturing the same |
| 06/11/2009 | US20090149031 Method of making a semiconductor device with residual amine group free multilayer interconnection |
| 06/11/2009 | US20090149018 Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases |
| 06/11/2009 | US20090148963 Metal Wiring and Method of Manufacturing the Same, and Metal Wiring Substrate and Method of Manufacturing the Same |
| 06/11/2009 | US20090147490 Substrate for wiring, semiconductor device for stacking using the same, and stacked semiconductor module |
| 06/11/2009 | US20090147203 Active matrix type liquid crystal display having aluminum and silver metal layers |
| 06/11/2009 | US20090147169 Thin film transistor and liquid crystal display including the same |
| 06/11/2009 | US20090146326 Method and Structures for Indexing Dice |
| 06/11/2009 | US20090146325 Alignment for backside illumination sensor |
| 06/11/2009 | US20090146324 Phenoxyphenyl polysiloxane composition and method for making and using same |
| 06/11/2009 | US20090146322 Method of eliminating a lithography operation |
| 06/11/2009 | US20090146321 Wire bonding personalization and discrete component attachment on wirebond pads |
| 06/11/2009 | US20090146320 Fabricated adhesive microstructures for making an electrical connection |
| 06/11/2009 | US20090146319 Semiconductor device |
| 06/11/2009 | US20090146318 Multilayer wiring board and semiconductor device |
| 06/11/2009 | US20090146317 Package substrate having electrically connecting structure |
| 06/11/2009 | US20090146316 Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening |
| 06/11/2009 | US20090146315 Integrated circuit package-on-package stacking system and method of manufacture thereof |
| 06/11/2009 | US20090146314 Semiconductor Device |
| 06/11/2009 | US20090146313 Semiconductor device |
| 06/11/2009 | US20090146312 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
| 06/11/2009 | US20090146311 Interconnect structure |
| 06/11/2009 | US20090146310 Semiconductor device and manufacturing method thereof |
| 06/11/2009 | US20090146309 Semiconductor device and method of manufacturing the same |
| 06/11/2009 | US20090146307 Top layers of metal for high performance IC's |
| 06/11/2009 | US20090146306 Semiconductor device with epitaxial C49-titanium silicide (TiSi2) layer and method for fabricating the same |