| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/18/2009 | US20090152696 Semiconductor device |
| 06/18/2009 | US20090152695 Semiconductor component and method of manufacture |
| 06/18/2009 | US20090152694 Electronic device |
| 06/18/2009 | US20090152693 Semiconductor device |
| 06/18/2009 | US20090152692 Integrated circuit package system with offset stacking |
| 06/18/2009 | US20090152691 Leadframe having die attach pad with delamination and crack-arresting features |
| 06/18/2009 | US20090152690 Semiconductor Chip Substrate with Multi-Capacitor Footprint |
| 06/18/2009 | US20090152689 Integrated Circuit Package for High-Speed Signals |
| 06/18/2009 | US20090152688 Integrated circuit package system for shielding electromagnetic interference |
| 06/18/2009 | US20090152686 Film Forming Method for Dielectric Film |
| 06/18/2009 | US20090152683 Rounded die configuration for stress minimization and enhanced thermo-mechanical reliability |
| 06/18/2009 | US20090152676 Electronic device including an inductor |
| 06/18/2009 | US20090152673 Semiconductor device and method for forming the same |
| 06/18/2009 | US20090152672 Semiconductor Devices and Methods of Manufacture Thereof |
| 06/18/2009 | US20090152669 Si trench between bitline hdp for bvdss improvement |
| 06/18/2009 | US20090152668 Semiconductor apparatus |
| 06/18/2009 | US20090152667 Semiconductor with active component and method for manufacture |
| 06/18/2009 | US20090152639 Laminated Stress Overlayer Using In-SITU Multiple Plasma Treatments for Transistor Improvement |
| 06/18/2009 | US20090152615 Semiconductor device and method for manufacturing the same |
| 06/18/2009 | US20090152611 Semiconductor device and method for manufacturing the same |
| 06/18/2009 | US20090152595 Semiconductor devices and method of testing same |
| 06/18/2009 | US20090152581 Light reflecting material, package for light emitting element accommodation, light emitting device and process for producing package for light emitting element accomodation |
| 06/18/2009 | US20090152552 Pixel structure and repairing method thereof |
| 06/18/2009 | US20090152551 Semiconductor device and manufacturing method thereof |
| 06/18/2009 | US20090152548 Semiconductor Component |
| 06/18/2009 | US20090152547 Integrated circuit packaging system with leadframe interposer and method of manufacture thereof |
| 06/18/2009 | US20090152546 Wafer with scribe lanes comprising active circuits for die testing of complementary signal processing parts |
| 06/18/2009 | US20090152545 Feature Dimension Measurement |
| 06/18/2009 | US20090152544 Disguising test pads in a semiconductor package |
| 06/18/2009 | US20090152543 System, Structure and Method of Providing Dynamic Optimization of Integrated Circuits Using a Non-Contact Method of Selection, and a Design Structure |
| 06/18/2009 | US20090152542 Testing the quality of lift-off processes in wafer fabrication |
| 06/18/2009 | US20090152002 Optoisolator leadframe assembly |
| 06/18/2009 | US20090151910 Combination rack system for discharging hot air separately, and system and method for cooling data center using the combination rack system |
| 06/18/2009 | US20090151158 Technique for laminating multiple substrates |
| 06/18/2009 | DE19743767B4 Verfahren zum Herstellen eines Halbleiterchip-Gehäuses mit einem Halbleiterchip für Oberflächenmontage sowie ein daraus hergestelltes Halbleiterchip-Gehäuse mit Halbleiterchip A method of manufacturing a semiconductor die package with a semiconductor chip for surface mounting as well as a product manufactured therefrom semiconductor chip package with the semiconductor chip |
| 06/18/2009 | DE19743766B4 In vertikaler und horizontaler Ebene stapelbare Halbleiterchip-Gehäuse und Verfahren zu deren Herstellung In vertical and horizontal plane stackable semiconductor chip package and method of manufacture |
| 06/18/2009 | DE19706983B4 Oberflächenanbringungseinheit und Wandleranordnungen unter Verwendung der Oberflächenanbringungseinheit Surface mounting unit and transducer assemblies using the surface mounting unit |
| 06/18/2009 | DE19521712B4 Vorrichtung zum Erfassen einer physikalischen Größe A device for detecting a physical quantity |
| 06/18/2009 | DE10329843B4 Wasserdichtes Leistungmodul und Verfahren zur Herstellung eines wasserdichten Leistungsmoduls Waterproof power module and method for manufacturing a waterproof power module |
| 06/18/2009 | DE10308928B4 Verfahren zum Herstellen freitragender Kontaktierungsstrukturen eines ungehäusten Bauelements A method for producing a self-supporting contacting structures unpackaged device |
| 06/18/2009 | DE10258094B4 Verfahren zur Ausbildung von 3-D Strukturen auf Wafern A method for forming 3-D structures on wafers |
| 06/18/2009 | DE10206150B4 Prozesslinieninterne Detektionsvorrichtung für Defekte in selbstjustierten Kontakten und Verfahren zur Herstellung derselben Internal process line detection device for Defects in self-aligned contacts, and processes for making them |
| 06/18/2009 | DE102008061636A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 06/18/2009 | DE102008054564A1 Halbleitervorrichtung Semiconductor device |
| 06/18/2009 | DE102008052029A1 Halbleitermodul mit Schaltbauteilen und Treiberelektronik Semiconductor module with switching devices and drive electronics |
| 06/18/2009 | DE102008048505A1 Halbleitervorrichtung Semiconductor device |
| 06/18/2009 | DE102008022352A1 Stapelartige Chip-Package-Struktur Stack-type chip package structure |
| 06/18/2009 | DE102007061161A1 Electronic packing structure e.g. electronic three dimensional package, for manufacturing e.g. micro electronic, signal contact formed on side of structure connected with contact to form canal between contact and inner switching circuit |
| 06/18/2009 | DE102007060249A1 Kühlkörper wenigstens eines elektrischen Bauteils Heat sink at least one electrical component |
| 06/18/2009 | DE102004063824B4 Leuchtdioden-Baugruppe mit antiparallelem Diodenchip Light-emitting diode assembly with antiparallel diode chip |
| 06/18/2009 | DE102004058946B4 Leistungshalbleitermodul mit Hilfsanschluss Power semiconductor module with auxiliary port |
| 06/18/2009 | DE102004037656B4 Elektronikmodul mit optimierter Montagefähigkeit und Bauteilanordnung mit einem Elektronikmodul Electronics module with optimized assembly capability and component assembly with an electronic module |
| 06/18/2009 | DE102004027960B4 Elektrische Leistungs-Halbleitervorrichtung Electrical power semiconductor device |
| 06/18/2009 | DE102004018476B4 Leistungshalbleiteranordnung mit kontaktierender Folie und Anpressvorrichtung Power semiconductor device having contacted foil and pressing device |
| 06/17/2009 | EP2071671A1 Method and system for a transformer in an integrated circuit package |
| 06/17/2009 | EP2071663A1 Phased array antenna embedded in an integrated circuit package |
| 06/17/2009 | EP2071625A1 Chip carrier with ferro/ferrimagnetic layers |
| 06/17/2009 | EP2071624A1 Device for measuring the squared resistivity and thickness of interconnection lines |
| 06/17/2009 | EP2071623A2 Metallization structure for high power microelectronic devices |
| 06/17/2009 | EP2071622A2 Package for semiconductor device and method of manufacturing the same |
| 06/17/2009 | EP2071621A1 Semiconductor switching device with gate connection |
| 06/17/2009 | EP2071620A1 Heat sink having enhanced heat dissipation capacity |
| 06/17/2009 | EP2071619A1 Semiconductor package and method for producing semiconductor package |
| 06/17/2009 | EP2071618A2 Method of manufacturing flexible semiconductor assemblies |
| 06/17/2009 | EP2070962A1 Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
| 06/17/2009 | EP2070127A2 Electronic device module comprising an ethylene multi-block copolymer |
| 06/17/2009 | EP2070120A1 Solid-state image sensor |
| 06/17/2009 | EP2070114A1 Flip-chip interconnection through chip vias |
| 06/17/2009 | EP2070113A2 Semiconductor device and method for manufacturing a semiconductor device |
| 06/17/2009 | EP2070109A2 Wafer-level interconnect for high mechanical reliability applications |
| 06/17/2009 | EP2070106A1 Design rules for on-chip inductors |
| 06/17/2009 | EP2070017A1 Method of connecting an antenna to a transponder chip and corresponding transponder inlay |
| 06/17/2009 | EP2070016A1 Method of connecting an antenna to a transponder chip and corresponding inlay substrate |
| 06/17/2009 | EP2070014A2 Method and apparatus for making a radio frequency inlay |
| 06/17/2009 | EP2069945A2 Microcontroller with low noise peripheral |
| 06/17/2009 | CN201259890Y Semiconductor apparatus having re-laid conductive contact point |
| 06/17/2009 | CN201259889Y Heat radiator used for electric electronic thyristor |
| 06/17/2009 | CN101461060A Improved metal-insulator-metal capacitors |
| 06/17/2009 | CN101461059A Cooler |
| 06/17/2009 | CN101461058A Thermal resistor, semiconductor device using the same, and electric device |
| 06/17/2009 | CN101461057A Electronic package and method of preparing same |
| 06/17/2009 | CN101461056A Semiconductor package, its manufacturing method, semiconductor device, and electronic device |
| 06/17/2009 | CN101459172A 半导体器件 Semiconductor devices |
| 06/17/2009 | CN101459165A Electronic component wafer module, manufacturing method thereof and electronic information device |
| 06/17/2009 | CN101459159A 半导体器件 Semiconductor devices |
| 06/17/2009 | CN101459158A Semiconductor device and method of manufacturing the same |
| 06/17/2009 | CN101459157A Semiconductor device and method for fabricating the same |
| 06/17/2009 | CN101459156A 半导体器件 Semiconductor devices |
| 06/17/2009 | CN101459155A Circuit board having bypass pad |
| 06/17/2009 | CN101459154A Conductive wire rack and encapsulation construction applying the conductive wire rack |
| 06/17/2009 | CN101459153A 电子器件 Electronic devices |
| 06/17/2009 | CN101459152A Stack type semi-conductor encapsulation construction having metal contact point guiding pore |
| 06/17/2009 | CN101459151A Welding substrate, electronic package construction applying the welding substrate and package method thereof |
| 06/17/2009 | CN101459150A Multilayered wiring structure and process for forming multilayered wiring structure |
| 06/17/2009 | CN101459149A 半导体封装 The semiconductor package |
| 06/17/2009 | CN101459148A A diode needle contact piece used for rectifying and detection |
| 06/17/2009 | CN101459147A Heat radiation fin, encapsulation piece comprising the heat radiation fin and encapsulation method |
| 06/17/2009 | CN101459146A Semiconductor packages and method for manufacturing same |
| 06/17/2009 | CN100502631C Semiconductor device, noise reduction method, and shield cover |
| 06/17/2009 | CN100502621C Connection structure of inner conductor and multilayer substrate |