Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2009
06/23/2009US7550826 Field device incorporating circuit card assembly as environmental and EMI/RFI shield
06/23/2009US7550825 Interlayer dielectric and pre-applied die attach adhesive materials
06/23/2009US7550824 Low k interconnect dielectric using surface transformation
06/23/2009US7550823 Nonvolatile memory cell, array thereof, fabrication methods thereof and device comprising the same
06/23/2009US7550819 Metal thin-film resistance element on an insulation film
06/23/2009US7550812 Camera module and method of fabricating the same
06/23/2009US7550806 Bondwire utilized for coulomb counting and safety circuits
06/23/2009US7550805 Stress-controlled dielectric integrated circuit
06/23/2009US7550788 Semiconductor device having fuse element arranged between electrodes formed in different wiring layers
06/23/2009US7550777 Light emitting device including adhesion layer
06/23/2009US7550763 Semiconductor integrated circuit device and manufacture thereof
06/23/2009US7550762 Isolation circuit
06/23/2009US7550386 Advanced seed layers for interconnects
06/23/2009US7550376 Semiconductor device capable of suppressing current concentration in pad and its manufacture method
06/23/2009US7550322 Manufacturing method for resin sealed semiconductor device
06/23/2009US7550321 Substrate having a functionally gradient coefficient of thermal expansion
06/23/2009US7550318 Interconnect for improved die to substrate electrical coupling
06/23/2009US7550317 Method for manufacture of wafer level package with air pads
06/23/2009US7550315 Method for fabricating semiconductor package with multi-layer die contact and external contact
06/23/2009US7550314 Patterned plasma treatment to improve distribution of underfill material
06/23/2009US7550303 Systems and methods for overlay shift determination
06/23/2009US7550097 Thermal conductive material utilizing electrically conductive nanoparticles
06/23/2009US7550046 Vapor deposition system using benzotriazole (BTA) and isopropyl alcohol for protecting copper interconnects
06/23/2009US7549790 Measuring apparatus for thermal resistance of heat dissipating device
06/23/2009US7549719 Method for the printing of homogeneous electronic material with a multi-ejector print head
06/23/2009US7549460 Thermal transfer devices with fluid-porous thermally conductive core
06/19/2009CA2648517A1 System and method for controlling the cooling of variable heat loads in heat generating devices
06/18/2009WO2009076494A2 Ceramic substrate having thermal via
06/18/2009WO2009076048A1 Method of forming a wire loop including a bend
06/18/2009WO2009075930A1 Semiconductor device thermal connection
06/18/2009WO2009075694A1 Hybrid microscale-nanoscale neuromorphic integrated circuit
06/18/2009WO2009075675A1 Chip identification using top metal layer
06/18/2009WO2009075320A1 Cooling device and method for manufacture thereof
06/18/2009WO2009075198A1 Anisotropic conductive joint package
06/18/2009WO2009075149A1 Semiconductor device
06/18/2009WO2009075052A1 Semiconductor device and method for manufacturing the same
06/18/2009WO2009074453A2 Semiconductor switching device with gate connection
06/18/2009WO2009074303A1 Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards
06/18/2009WO2009055365A3 Packaged microchip with spacer for mitigating electrical leakage between components
06/18/2009WO2009048861A3 Methods for forming a through via
06/18/2009WO2009043670A3 Electronic circuit composed of sub-circuits and method for producing the same
06/18/2009WO2009035907A4 Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
06/18/2009US20090156038 Connector structure
06/18/2009US20090155961 Integrated circuit package system with package integration
06/18/2009US20090155960 Integrated circuit package system with offset stacking and anti-flash structure
06/18/2009US20090155953 Semiconductor device fabricating method and fabricating apparatus
06/18/2009US20090154321 Semiconductor device and optical pickup device
06/18/2009US20090154217 High speed otp sensing scheme
06/18/2009US20090154131 Conductive connecting pin and package substrate
06/18/2009US20090154126 Semiconductor device and method for manufacturing the same
06/18/2009US20090154124 Microwave chip supporting structure
06/18/2009US20090153229 Method for Signal Transmission between Semiconductor Substrates, and Semiconductor Component Comprising Such Semiconductor Substrates
06/18/2009US20090153177 Separate testing of continuity between an internal terminal in each chip and an external terminal in a stacked semiconductor device
06/18/2009US20090153174 Simple and effective method to detect poly residues in locos process
06/18/2009US20090153163 Circuit board having bypass pad
06/18/2009US20090152992 Airtight terminal
06/18/2009US20090152743 Routing layer for a microelectronic device, microelectronic package containing same, and method of forming a multi-thickness conductor in same for a microelectronic device
06/18/2009US20090152742 Method of manufacturing semiconductor package and semiconductor plastic package using the same
06/18/2009US20090152741 Chip structure and fabrication process thereof and flip chip package structure and fabrication process thereof
06/18/2009US20090152740 Integrated circuit package system with flip chip
06/18/2009US20090152739 Method and system for filters embedded in an integrated circuit package
06/18/2009US20090152738 Integrated circuit package having bottom-side stiffener
06/18/2009US20090152736 Semiconductor device and method of fabricating the same
06/18/2009US20090152735 Metal Interconnection and Method for Manufacturing the Same in a Semiconductor Device
06/18/2009US20090152734 Super-Self-Aligned Contacts and Method for Making the Same
06/18/2009US20090152733 Deep contacts of integrated electronic devices based on regions implanted through trenches
06/18/2009US20090152732 Semiconductor device and method of manufacturing the same
06/18/2009US20090152731 Semiconductor package
06/18/2009US20090152730 Interconnected structure for TFT-array substrate
06/18/2009US20090152729 Semiconductor device
06/18/2009US20090152728 Semiconductor apparatus
06/18/2009US20090152727 Bonding pad for anti-peeling property and method for fabricating the same
06/18/2009US20090152726 Metal line of semiconductor device and method for fabricating the same
06/18/2009US20090152725 Thick metal interconnect with metal pad caps at selective sites and process for making the same
06/18/2009US20090152724 Ic interconnect for high current
06/18/2009US20090152723 Interconnect structure and method of making same
06/18/2009US20090152722 Synergy Effect of Alloying Materials in Interconnect Structures
06/18/2009US20090152721 Semiconductor package and method for making the same
06/18/2009US20090152720 Multilayer chip scale package
06/18/2009US20090152719 Methods of fluxless micro-piercing of solder balls, and resulting devices
06/18/2009US20090152718 Structure with die pad pattern
06/18/2009US20090152717 Method of forming stacked die package
06/18/2009US20090152716 Wiring substrate and electronic component mounting structure
06/18/2009US20090152715 Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-applied Protective Layer
06/18/2009US20090152714 Semiconductor device and method for manufacturing the same
06/18/2009US20090152713 Integrated circuit assembly including thermal interface material comprised of oil or wax
06/18/2009US20090152712 Packaging apparatus for optical-electronic semiconductors and a packaging method therefor
06/18/2009US20090152711 Rectification chip terminal structure
06/18/2009US20090152710 Quad flat no-lead (qfn) packages
06/18/2009US20090152709 Semiconductor device
06/18/2009US20090152708 Substrate for high speed semiconductor package and semiconductor package having the same
06/18/2009US20090152707 Methods and systems for packaging integrated circuits
06/18/2009US20090152706 Integrated circuit package system with interconnect lock
06/18/2009US20090152705 Micromechanical Component and Method for Fabricating a Micromechanical Component
06/18/2009US20090152704 Integrated circuit packaging system with interposer
06/18/2009US20090152703 Semiconductor Components Having Through Interconnects And Backside Redistribution Conductors
06/18/2009US20090152701 Integrated circuit package system with package integration
06/18/2009US20090152700 Mountable integrated circuit package system with mountable integrated circuit die
06/18/2009US20090152698 Integrated matching networks and rf devices that include an integrated matching network
06/18/2009US20090152697 Semiconductor device and manufacturing method of the same
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