| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/24/2009 | EP1738127A4 Low-profile thermosyphon-based cooling system for computers and other electronic devices |
| 06/24/2009 | EP1721338A4 Reprogrammable metal-to-metal antifuse employing carbon-containing antifuse material |
| 06/24/2009 | EP1425798B1 Microelectronic system with integral cyrocooler |
| 06/24/2009 | CN201262954Y Packaging structure of integrated circuit |
| 06/24/2009 | CN201262953Y Leads frame structure of improved integrated circuit |
| 06/24/2009 | CN201262952Y Double-forcer leads of improved Schottky diode |
| 06/24/2009 | CN201262951Y 低应力片式二极管 Low stress chip diode |
| 06/24/2009 | CN101467250A A semiconductor fuse structure and a method of manufacturing a semiconductor fuse structure |
| 06/24/2009 | CN101467249A Method of making thermally enhanced substrate-based array package |
| 06/24/2009 | CN101467248A Heat dissipating wiring board and method for manufacturing same |
| 06/24/2009 | CN101467247A Method, apparatus, and system for thin die thin thermal interface material in integrated circuit packages |
| 06/24/2009 | CN101467246A Multilayer ceramic electronic device and method for manufacturing the same |
| 06/24/2009 | CN101465339A Structure for monitoring quality of forming metallic silicides |
| 06/24/2009 | CN101465338A Test pattern of semiconductor device and manufacturing method thereof |
| 06/24/2009 | CN101465337A Electrical test key and test method |
| 06/24/2009 | CN101465336A Semiconductor device and method of manufacturing same |
| 06/24/2009 | CN101465335A Inductor and manufacturing method threof |
| 06/24/2009 | CN101465334A Method and apparatus for packing small-scale integrated circuit capable of saving pin numeral |
| 06/24/2009 | CN101465333A Lead wire frame and producing method thereof |
| 06/24/2009 | CN101465332A Semiconductor chip, method of fabricating the same and semiconductor chip stack package |
| 06/24/2009 | CN101465331A Fixed device of radiating module |
| 06/24/2009 | CN101465330A Metal thermal interfacial material as well as radiating module and encapsulation microelectron containing the material |
| 06/24/2009 | CN101465329A Radiating plate for semiconductor package and electroplating method therefor |
| 06/24/2009 | CN101465328A Encapsulation of LED and method of manufacturing the same |
| 06/24/2009 | CN101465327A Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip |
| 06/24/2009 | CN101465211A Lead frame and electronic component with the same and manufacturing method thereof |
| 06/24/2009 | CN100505533C Frequency-independent voltage divider |
| 06/24/2009 | CN100505444C Electronic component and electronic component module |
| 06/24/2009 | CN100505353C Electronic device and method for charging the electronic device |
| 06/24/2009 | CN100505289C Organic electroluminescent display device and method of fabricating the same |
| 06/24/2009 | CN100505267C Nonvolatile semiconductor memory device having coupled strap region and fabricating method thereof |
| 06/24/2009 | CN100505254C Semiconductor device and its manufactureing method |
| 06/24/2009 | CN100505241C Semiconductor protection device |
| 06/24/2009 | CN100505240C Semiconductor device |
| 06/24/2009 | CN100505239C System for shielding integrated circuits |
| 06/24/2009 | CN100505238C Integrated circuit and method for manufacturing and judging same |
| 06/24/2009 | CN100505237C Analogue measurement of alignment between layers of a semiconductor device |
| 06/24/2009 | CN100505236C Electrically reprogrammable fuse device, its manufacturing method and integrated circuit device |
| 06/24/2009 | CN100505235C Metal line of semiconductor device and method of fabricating the same |
| 06/24/2009 | CN100505234C Memory cell array and memory cell |
| 06/24/2009 | CN100505233C Nonvolatile memory integrated circuits |
| 06/24/2009 | CN100505232C Wafer carrier and its encapsulation body |
| 06/24/2009 | CN100505231C Semiconductor integrated circuit and packaging conductor frame thereof |
| 06/24/2009 | CN100505230C Conducting wire frame and method for producing same |
| 06/24/2009 | CN100505229C Semiconductor package and lead frame therefor |
| 06/24/2009 | CN100505228C Package board, semiconductor package, and fabricating method thereof |
| 06/24/2009 | CN100505227C Base-plate structure for semiconductor package direct electric-connection |
| 06/24/2009 | CN100505226C Optical device and method of manufacturing the same |
| 06/24/2009 | CN100505225C Connected pad structure |
| 06/24/2009 | CN100505224C 半导体装置及半导体芯片 A semiconductor device and a semiconductor chip |
| 06/24/2009 | CN100505223C Multilayered covering barrier in microelectronic interconnect structures |
| 06/24/2009 | CN100505222C Light-emitting diode radiating substrate and production thereof |
| 06/24/2009 | CN100505190C Integrated circuit package and its forming mehtod |
| 06/24/2009 | CN100505189C Method for handling electroplating lead layout of IC packaging base plate and electroplating lead structure |
| 06/24/2009 | CN100504558C Active matrix substrate and display device |
| 06/24/2009 | CN100504553C Thin film transistor array panel and liquid crystal display including the panel |
| 06/24/2009 | CN100503879C Support for microelectronic, microoptoelectronic or micromechanical devices |
| 06/24/2009 | CN100503507C Low temperature sintered 99 aluminium oxide ceramic and its production method and use |
| 06/24/2009 | CN100503030C Water-absorbing agent for organic el device and organic el device |
| 06/23/2009 | USRE40790 Method for making electrical contact with an active area through sub-micron contact openings and a semiconductor device |
| 06/23/2009 | US7552404 Semiconductor integrated device and apparatus for designing the same |
| 06/23/2009 | US7551972 Audio signal processing apparatus |
| 06/23/2009 | US7551447 Resilient fastener and heat dissipation apparatus incorporating the same |
| 06/23/2009 | US7551446 Thermal management device attachment |
| 06/23/2009 | US7551438 Information processing blade and information processing apparatus using the same |
| 06/23/2009 | US7551435 Heat-absorbing member, cooling device, and electronic apparatus |
| 06/23/2009 | US7551038 Multi-phase voltage-control oscillator |
| 06/23/2009 | US7550990 Method and apparatus for testing integrated circuits for susceptibility to latch-up |
| 06/23/2009 | US7550859 System and method for hermetically sealing a package |
| 06/23/2009 | US7550858 Random sequence generation using alpha particle emission |
| 06/23/2009 | US7550857 Stacked redistribution layer (RDL) die assembly package |
| 06/23/2009 | US7550856 Grooved substrates for uniform underfilling solder ball assembled electronic devices |
| 06/23/2009 | US7550855 Vertically spaced plural microsprings |
| 06/23/2009 | US7550854 Integrated interconnect arrangement |
| 06/23/2009 | US7550853 Electrical isolation of monolithic circuits using a conductive through-hole in the substrate |
| 06/23/2009 | US7550852 Composite metal column for mounting semiconductor device |
| 06/23/2009 | US7550851 low resistivity connection between a tungsten layer and Si surface with high adherence of the tungsten to the silicon; very thin layer of Si-NH2 is formed on the silicon surface, serving an adhesion layer. WNx layer is formed over the Si-NH2 layer, W layer over WNx layer, nitriding to form WNx layers |
| 06/23/2009 | US7550850 Semiconductor device |
| 06/23/2009 | US7550849 Conductive structures including titanium-tungsten base layers |
| 06/23/2009 | US7550848 Semiconductor constructions comprising particle-containing materials |
| 06/23/2009 | US7550847 Packaged microelectronic devices and methods for packaging microelectronic devices |
| 06/23/2009 | US7550846 Conductive bump with a plurality of contact elements |
| 06/23/2009 | US7550845 Ball grid array package with separated stiffener layer |
| 06/23/2009 | US7550843 Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member |
| 06/23/2009 | US7550842 Integrated circuit assembly |
| 06/23/2009 | US7550841 Methods of forming a diamond micro-channel structure and resulting devices |
| 06/23/2009 | US7550840 Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof |
| 06/23/2009 | US7550839 Integrated circuit package and system interface |
| 06/23/2009 | US7550838 Semiconductor device |
| 06/23/2009 | US7550837 Semiconductor device and voltage regulator |
| 06/23/2009 | US7550836 Structure of package on package and method for fabricating the same |
| 06/23/2009 | US7550835 Chip stack package utilizing a dummy pattern die between stacked chips for reducing package size |
| 06/23/2009 | US7550834 Stacked, interconnected semiconductor packages |
| 06/23/2009 | US7550833 Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof |
| 06/23/2009 | US7550832 Stackable semiconductor package |
| 06/23/2009 | US7550831 Electronic device and semiconductor device |
| 06/23/2009 | US7550830 Stacked semiconductor package having fan-out structure through wire bonding |
| 06/23/2009 | US7550829 Electronic package and semiconductor device using the same |
| 06/23/2009 | US7550828 Leadframe package for MEMS microphone assembly |
| 06/23/2009 | US7550827 Conductor frame for an electronic component and method for the production thereof |