| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/01/2009 | CN100508152C Manufacture method of semiconductor device |
| 07/01/2009 | CN100508148C Semiconductor package with contact support layer and method to produce the package |
| 07/01/2009 | CN100508147C Method for galvanization and forming a contact boss |
| 07/01/2009 | CN100508140C Manufacturing method for a semiconductor device |
| 07/01/2009 | CN100508108C Small volume process chamber with hot inner surfaces |
| 07/01/2009 | CN100507925C Esd test array and corresponding method |
| 07/01/2009 | CN100507429C Flat plate heat transfer device |
| 07/01/2009 | CN100507068C Aluminum alloy thin film, wiring circuit having the thin film and target material depositing the thin film |
| 07/01/2009 | CN100506969C Substrate and method for measuring the electrophysiological properties of cell membranes |
| 07/01/2009 | CN100506943C 热界面材料 Thermal interface material |
| 07/01/2009 | CN100506877C Curable resin composition, overcoats, and process for formation thereof |
| 06/30/2009 | US7555328 Implantable substrate sensor with back-to-back electrodes |
| 06/30/2009 | US7554810 Mounting apparatus for securing heat dissipation module to circuit board |
| 06/30/2009 | US7554809 Heatsink assembly structure |
| 06/30/2009 | US7554808 Heat sink with thermoelectric module |
| 06/30/2009 | US7554806 Interface module-mounted LSI package |
| 06/30/2009 | US7554788 Capacitor for a semiconductor device |
| 06/30/2009 | US7554432 Fuse element with trigger assistance |
| 06/30/2009 | US7554337 Semiconductor device, method of authentifying and system |
| 06/30/2009 | US7554242 Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same |
| 06/30/2009 | US7554211 Semiconductor wafer and manufacturing process for semiconductor device |
| 06/30/2009 | US7554210 Semiconductor device with semiconductor chip mounted in package |
| 06/30/2009 | US7554209 Semiconductor device having a metal plate conductor |
| 06/30/2009 | US7554208 Wirebond pad for semiconductor chip or wafer |
| 06/30/2009 | US7554207 Method of forming a lamination film pattern and improved lamination film pattern |
| 06/30/2009 | US7554206 Microelectronic packages and methods therefor |
| 06/30/2009 | US7554205 Flip-chip type semiconductor device |
| 06/30/2009 | US7554204 Die offset die to die bonding |
| 06/30/2009 | US7554202 Semiconductor integrated circuit device |
| 06/30/2009 | US7554201 alloy solder interposed between and connecting a gold bump of a semiconductor chip and metal wiring of a substrate |
| 06/30/2009 | US7554200 Semiconductor devices including porous insulators |
| 06/30/2009 | US7554199 Substrate for evaluation |
| 06/30/2009 | US7554198 Flexible joint methodology to attach a die on an organic substrate |
| 06/30/2009 | US7554197 High frequency IC package and method for fabricating the same |
| 06/30/2009 | US7554196 Plastic package and semiconductor component comprising such a plastic package, and method for its production |
| 06/30/2009 | US7554195 Engine with cable direct to outboard memory |
| 06/30/2009 | US7554194 Thermally enhanced semiconductor package |
| 06/30/2009 | US7554193 Semiconductor device |
| 06/30/2009 | US7554192 Semiconductor device having filler with thermal conductive particles |
| 06/30/2009 | US7554191 Semiconductor device having a heatsink plate with bored portions |
| 06/30/2009 | US7554190 Liquid metal thermal interface material system |
| 06/30/2009 | US7554189 Wireless communication module |
| 06/30/2009 | US7554188 Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes |
| 06/30/2009 | US7554187 Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure |
| 06/30/2009 | US7554186 Semiconductor device |
| 06/30/2009 | US7554185 Flip chip and wire bond semiconductor package |
| 06/30/2009 | US7554184 Image sensor chip package |
| 06/30/2009 | US7554183 Semiconductor device |
| 06/30/2009 | US7554182 Semiconductor device and package, and method of manufacturer therefor |
| 06/30/2009 | US7554181 Semiconductor device with non-overlapping chip mounting sections |
| 06/30/2009 | US7554180 Package having exposed integrated circuit device |
| 06/30/2009 | US7554179 Multi-leadframe semiconductor package and method of manufacture |
| 06/30/2009 | US7554178 Semiconductor device |
| 06/30/2009 | US7554176 Integrated circuits having a multi-layer structure with a seal ring |
| 06/30/2009 | US7554169 Semiconductor device and method of manufacturing the same |
| 06/30/2009 | US7554166 Airdome enclosure for components |
| 06/30/2009 | US7554160 Semiconductor device |
| 06/30/2009 | US7554159 Electrostatic discharge protection device and method of manufacturing the same |
| 06/30/2009 | US7554136 Micro-switch device and method for manufacturing the same |
| 06/30/2009 | US7554135 Device for detecting a gas or gas mixture |
| 06/30/2009 | US7554134 Integrated CMOS porous sensor |
| 06/30/2009 | US7554133 Pad current splitting |
| 06/30/2009 | US7554128 Light-emitting apparatus |
| 06/30/2009 | US7554039 Electronic device |
| 06/30/2009 | US7553901 Of use when electric and electronic parts having a copper, silver or other metal portion on their surface are encapsulated or sealed therewith, to prevent or retard the parts from corrosion with sulfur-containing gases |
| 06/30/2009 | US7553890 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer |
| 06/30/2009 | US7553769 Method for treating a dielectric film |
| 06/30/2009 | US7553766 Method of fabricating semiconductor integrated circuit device |
| 06/30/2009 | US7553754 Electronic device, method of manufacture of the same, and sputtering target |
| 06/30/2009 | US7553751 Method of forming solder bump with reduced surface defects |
| 06/30/2009 | US7553739 Integration control and reliability enhancement of interconnect air cavities |
| 06/30/2009 | US7553703 Methods of forming an interconnect structure |
| 06/30/2009 | US7553700 Chemical-enhanced package singulation process |
| 06/30/2009 | US7553699 Method of fabricating microelectronic devices |
| 06/30/2009 | US7553698 Semiconductor package having semiconductor constructing body and method of manufacturing the same |
| 06/30/2009 | US7553697 Multiple chip semiconductor package |
| 06/30/2009 | US7553696 Method for implementing component placement suspended within grid array packages for enhanced electrical performance |
| 06/30/2009 | US7553688 Methods for packaging image sensitive electronic devices |
| 06/30/2009 | US7553433 Producing large quantities of a high quality, dense aerosol for spray pyrolysis operations; multi-phase small particles for use in manufacturing electrically-conductive metallic films for electronic products; powder coatings for thick films |
| 06/30/2009 | US7553355 Methods and materials for the reduction and control of moisture and oxygen in OLED devices |
| 06/30/2009 | US7553165 Spring interconnect structures |
| 06/30/2009 | US7553028 Projection LED cooling |
| 06/30/2009 | US7552532 Method for hermetically encapsulating a component |
| 06/30/2009 | US7552530 Method of manufacturing a PCB having improved cooling |
| 06/30/2009 | CA2302957C Circuit chip connector and method of connecting a circuit chip |
| 06/25/2009 | WO2009079654A1 Low cost high frequency device package and methods |
| 06/25/2009 | WO2009079651A2 Electronic device package and method of formation |
| 06/25/2009 | WO2009079512A2 Double bonded heat dissipation |
| 06/25/2009 | WO2009079458A1 Structure and method for forming power devices with carbon-containing region |
| 06/25/2009 | WO2009079327A1 Backplane structures for electronic devices |
| 06/25/2009 | WO2009079179A2 Placement of an integrated circuit |
| 06/25/2009 | WO2009079122A1 Method of coating fine wires and curable composition therefor |
| 06/25/2009 | WO2009079114A2 Thermal mechanical flip chip die bonding |
| 06/25/2009 | WO2009078767A1 A device for reducing thermal stress on connection points |
| 06/25/2009 | WO2009078301A1 Photosemiconductor package sealing resin material |
| 06/25/2009 | WO2009078289A2 Cooling fin and manufacturing method of the cooling fin |
| 06/25/2009 | WO2009078255A1 Substrate and method for manufacturing the same |
| 06/25/2009 | WO2009078254A1 Substrate and method for manufacturing the same |
| 06/25/2009 | WO2009078215A1 Semiconductor device manufacturing method and semiconductor device |
| 06/25/2009 | WO2009078126A1 In-vacuum welding treatment apparatus |