| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/02/2009 | US20090166819 Chipset package structure |
| 07/02/2009 | US20090166818 Positive Photosensitive Resin Composition, and Semiconductor Device and Display Therewith |
| 07/02/2009 | US20090166817 Extreme low-k dielectric film scheme for advanced interconnects |
| 07/02/2009 | US20090166816 Semiconductor device and method of fabricating the same |
| 07/02/2009 | US20090166810 Semiconductor Device Crack-Deflecting Structure and Method |
| 07/02/2009 | US20090166809 Semiconductor device and its manufacture |
| 07/02/2009 | US20090166808 Laser processing method and semiconductor chip |
| 07/02/2009 | US20090166803 Semiconductor device with fuse and method for fabricating the same |
| 07/02/2009 | US20090166802 Semiconductor device with fuse and method for fabricating the same |
| 07/02/2009 | US20090166797 High-voltage integrated circuit device including high-voltage resistant diode |
| 07/02/2009 | US20090166774 Wire bonding method and semiconductor device |
| 07/02/2009 | US20090166771 Device comprising a sensor module |
| 07/02/2009 | US20090166660 Lead frame for LED |
| 07/02/2009 | US20090166621 Resistance-based etch depth determination for sgt technology |
| 07/02/2009 | US20090166620 Semiconductor chip |
| 07/02/2009 | US20090166619 Test pattern of semiconductor device and manufacturing method thereof |
| 07/02/2009 | US20090166618 Test structure for monitoring process characteristics for forming embedded semiconductor alloys in drain/source regions |
| 07/02/2009 | US20090166617 Integrated circuit and method for operating |
| 07/02/2009 | US20090166011 Heat dissipation device having a mounting bracket |
| 07/02/2009 | US20090166010 Heat dissipation device having a fan holder |
| 07/02/2009 | US20090166008 Heat spreader with vapor chamber |
| 07/02/2009 | US20090166005 Vapor chamber |
| 07/02/2009 | DE202009001611U1 Halbleiter-Temperatursensor mit ESD-Schutz Semiconductor temperature sensor with ESD protection |
| 07/02/2009 | DE19755676B4 Verfahren zur Herstellung einer Schutzring-Anordnung einer Halbleitereinrichtung und Halbleitereinrichtung mit einer derartigen Schutzring-Anordnung A method for producing a protective ring arrangement of a semiconductor device and semiconductor device having such a protective ring arrangement |
| 07/02/2009 | DE19521150B4 Verdrahtungsstruktur eines Halbleiterbaulementes und Verfahren zu ihrer Herstellung Wiring structure of a semiconductor component Mentes and processes for their preparation |
| 07/02/2009 | DE102008061445A1 Halbleiter und Verfahren Semiconductors and procedures |
| 07/02/2009 | DE102008060615A1 Licht aussendende Diode Light emitting diode |
| 07/02/2009 | DE102008054502A1 ESD Schutzschaltung ESD protection circuit |
| 07/02/2009 | DE102008051443A1 Halbleiter-Bauelement Semiconductor component |
| 07/02/2009 | DE102008026839A1 Verfahren zum Herstellen eines optoelektronischen Bauelements in Dünnschichttechnik A method for producing an optoelectronic component in thin-film technology |
| 07/02/2009 | DE102007063308A1 Diode Diode |
| 07/02/2009 | DE102007063229A1 Teststruktur zur Überwachung von Prozesseigenschaften für die Herstellung eingebetteter Halbleiterlegierungen in Drain/Source-Gebieten Test structure for monitoring process suitable for the manufacture of embedded semiconductor alloys in drain / source regions |
| 07/02/2009 | DE102007062163A1 Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul Arrangement in pressure contact with a power semiconductor module |
| 07/02/2009 | DE102007061942A1 Schaltungsträger, Verfahren zur Herstellung eines Schaltungsträgers sowie Bondverfahren Circuit substrate, method of manufacturing a circuit substrate and bonding method |
| 07/02/2009 | DE102007061261A1 Leuchtkörper mit LED-DIEs und deren Herstellung Fixtures with LED DIEs and their preparation |
| 07/02/2009 | DE102006040820B4 Elektrische Leistungspackung mit zwei Substraten mit mehreren elektronischen Komponenten Electric power pack with two substrates with several electronic components |
| 07/02/2009 | DE102005046737B4 Nutzen zur Herstellung eines elektronischen Bauteils, Bauteil mit Chip-Durchkontakten und Verfahren Use for the manufacture of an electronic component, chip component with vias and methods |
| 07/02/2009 | DE102005039940B4 Leistungshalbleitermodul mit Bondverbindung der Leistungshalbleiterbauelemente Power semiconductor module with bonding connection of the power semiconductor components |
| 07/02/2009 | DE102005020453B4 Halbleiterbauteil mit einer Flachleiterstruktur und Verfahren zur Herstellung einer Flachleiterstruktur und Verfahren zur Herstellung eines Halbleiterbauteils A semiconductor device comprising a flat conductor structure and method of manufacturing a flat conductor structure and method of manufacturing a semiconductor device |
| 07/02/2009 | DE102005018116B4 Leistungshalbleitermodul The power semiconductor module |
| 07/02/2009 | DE102004041088B4 Halbleiterbauteil in Flachleitertechnik mit einem Halbleiterchip und Verfahren zu seiner Herstellung A semiconductor device in flat conductor technique with a semiconductor chip and method for its preparation |
| 07/02/2009 | CA2710450A1 Monolithically integrated antenna and receiver circuit for the detection of terahertz waves |
| 07/01/2009 | EP2075839A1 Method for evaluating semiconductor wafer |
| 07/01/2009 | EP2075837A2 Package for electronic component and method for manufacturing the same |
| 07/01/2009 | EP2075836A1 Microstructure and method of manufacturing the same |
| 07/01/2009 | EP2075835A2 Diode with stress reducing means |
| 07/01/2009 | EP2075834A1 Solder bumps for flip chip bonding with higher density |
| 07/01/2009 | EP2075833A2 Method of manufacturing semiconductor device |
| 07/01/2009 | EP2075280A1 White heat-curable silicone resin composition, optoelectric part case, and molding method |
| 07/01/2009 | EP2074654A1 High temperature, high voltage sic void-less electronic package |
| 07/01/2009 | EP2074653A2 Plastic surface mount large area power device |
| 07/01/2009 | EP1258040A4 Vertical conduction flip-chip device with bump contacts on single surface |
| 07/01/2009 | CN201266606Y Patch type semiconductor element |
| 07/01/2009 | CN201266605Y Circuit board with welding-proof layer |
| 07/01/2009 | CN201266604Y Radiating device |
| 07/01/2009 | CN101473435A High voltage valve set with enhanced disruptive strength |
| 07/01/2009 | CN101473434A Semiconductor device and method of manufacturing a semiconductor device |
| 07/01/2009 | CN101473433A Power amplifier assembly |
| 07/01/2009 | CN101473432A Heat sink and cooler |
| 07/01/2009 | CN101473431A Cooling and shielding of high voltage current changer |
| 07/01/2009 | CN101471417A Method for manufacturing glass plate containing fluophor and method for manufacturing light-emitting device |
| 07/01/2009 | CN101471345A Semiconductor device and photomask |
| 07/01/2009 | CN101471329A Semiconductor encapsulation part |
| 07/01/2009 | CN101471328A Substrate panel |
| 07/01/2009 | CN101471327A Copper wire, method for fabricating the same, and thin film transistor substrate with the same |
| 07/01/2009 | CN101471326A Semiconductor device and method of fabricating the same |
| 07/01/2009 | CN101471325A 半导体器件 Semiconductor devices |
| 07/01/2009 | CN101471324A Ultra-low K interconnection structure and method of manufacturing the same |
| 07/01/2009 | CN101471323A 多层印刷线路板 Multilayer printed circuit boards |
| 07/01/2009 | CN101471322A Routing layer for a microelectronic device, microelectronic package containing same, and method of forming a multi-thickness conductor in same for a microelectronic device |
| 07/01/2009 | CN101471321A Load bearing belt for packing chip and chip packaging structure |
| 07/01/2009 | CN101471320A Substrate encapsulation structure |
| 07/01/2009 | CN101471319A Non-planar surface substrate strip and semiconductor packaging method using the same |
| 07/01/2009 | CN101471318A LGA substrate and method of making same |
| 07/01/2009 | CN101471317A Leadframe package and leadframe |
| 07/01/2009 | CN101471316A Circuit substrate, circuit device and manufacturing process thereof |
| 07/01/2009 | CN101471315A Semiconductor encapsulation conformation throwing in multi-sinuosity connection finger |
| 07/01/2009 | CN101471314A Semiconductor encapsulation conformation and used substrate thereof |
| 07/01/2009 | CN101471313A Stereo electronic packaging structure containing conduction support base material |
| 07/01/2009 | CN101471312A Semiconductor device and method of fabricating the same |
| 07/01/2009 | CN101471311A Semiconductor chip package and its manufacturing method |
| 07/01/2009 | CN101471310A Smooth sunken surface structure of elastic projection and production process thereof |
| 07/01/2009 | CN101471309A CPU cooler |
| 07/01/2009 | CN101471308A Radiating module |
| 07/01/2009 | CN101471307A 半导体封装体及其制造方法 The semiconductor package manufacturing method thereof |
| 07/01/2009 | CN100508709C System and method for self-leveling heat sink for multiple height devices |
| 07/01/2009 | CN100508698C Ceramic circuit board, method for making the same, and power module |
| 07/01/2009 | CN100508201C Package for solid image pickup element and solid image pickup device |
| 07/01/2009 | CN100508181C Semiconductor device |
| 07/01/2009 | CN100508180C Semiconductor memory device and method of production |
| 07/01/2009 | CN100508179C Internal connection line structure |
| 07/01/2009 | CN100508178C Semiconductor device and method for establishing virtual assembly structure on it |
| 07/01/2009 | CN100508177C Semiconductor device |
| 07/01/2009 | CN100508176C TAB tape and method of manufacturing the same |
| 07/01/2009 | CN100508175C 半导体器件 Semiconductor devices |
| 07/01/2009 | CN100508174C Lead frame for semiconductor device |
| 07/01/2009 | CN100508173C Lead frame for semiconductor package and method of manufacturing the same |
| 07/01/2009 | CN100508172C Joining device for fin type heat radiator and heat spreader |
| 07/01/2009 | CN100508171C 半导体器件 Semiconductor devices |
| 07/01/2009 | CN100508162C Semiconductor device and method for manufacturing the same |