| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/02/2009 | WO2009082431A2 Integrated circuit system with contact integration |
| 07/02/2009 | WO2009082062A1 Method of injecting molten solder into cavities of a template and apparatus for performing the same |
| 07/02/2009 | WO2009081874A1 Film-like resin composition for encapsulation filling, method for manufacturing semiconductor package or semiconductor device using the same, and semiconductor device |
| 07/02/2009 | WO2009081763A1 Semiconductor device and method for manufacturing the same |
| 07/02/2009 | WO2009081723A1 Semiconductor device and method for manufacturing the same |
| 07/02/2009 | WO2009081705A1 Substrate provided with pin, and pin |
| 07/02/2009 | WO2009081518A1 Semiconductor device and multilayer wiring board |
| 07/02/2009 | WO2009081494A1 Semiconductor device and manufacturing method thereof |
| 07/02/2009 | WO2009081459A1 Manufacturing method of packaged micro moving element and the packaged micro moving element |
| 07/02/2009 | WO2009081356A2 Non-substrate type package with embedded power line |
| 07/02/2009 | WO2009080573A2 Monolithically integrated antenna- and receiver circuit for the detection of terahertz waves |
| 07/02/2009 | WO2009079772A1 Method for stacking serially-connected integrated circuits and multi-chip device made from same |
| 07/02/2009 | WO2009079749A1 Data storage and stackable configurations |
| 07/02/2009 | WO2009061751A3 Semiconductor device having through-silicon vias for high current, high frequency, and heat dissipation |
| 07/02/2009 | WO2009050130A3 Chip cooling device having wedge element |
| 07/02/2009 | WO2009046962A3 Chip module for chip card |
| 07/02/2009 | US20090171179 Analyte Monitoring Device and Methods of Use |
| 07/02/2009 | US20090171013 White heat-curable silicone resin composition, optoelectronic part case, and molding method |
| 07/02/2009 | US20090170342 Dielectric nanostructure and method for its manufacture |
| 07/02/2009 | US20090170240 Optimized Circuit Design Layout for High Performance Ball Grid Array Packages |
| 07/02/2009 | US20090170226 Package for a Semiconductor Light Emitting Device |
| 07/02/2009 | US20090167334 Controlled Impedance Structures for High Density Interconnections |
| 07/02/2009 | US20090166899 Method of Creating an Alignment Mark on a Substrate and Substrate |
| 07/02/2009 | US20090166898 Method of increasing reliability of packaged semiconductor integrated circuit dice |
| 07/02/2009 | US20090166897 Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same |
| 07/02/2009 | US20090166896 Semiconductor device and method of manufacturing semiconductor device |
| 07/02/2009 | US20090166895 Circuit substrate, circuit device and manufacturing process thereof |
| 07/02/2009 | US20090166894 Semiconductor integrated circuit |
| 07/02/2009 | US20090166893 Semiconductor device |
| 07/02/2009 | US20090166892 Circuit board for semiconductor package having a reduced thickness, method for manufacturing the same, and semiconductor package having the same |
| 07/02/2009 | US20090166891 Cutting and molding in small windows to fabricate semiconductor packages |
| 07/02/2009 | US20090166890 Flip-chip package |
| 07/02/2009 | US20090166889 Packaged integrated circuits having surface mount devices and methods to form packaged integrated circuits |
| 07/02/2009 | US20090166888 3-d semiconductor die structure with containing feature and method |
| 07/02/2009 | US20090166887 Semiconductor package including flip chip controller at bottom of die stack |
| 07/02/2009 | US20090166886 Mountable integrated circuit package system with intra-stack encapsulation |
| 07/02/2009 | US20090166885 Integrated circuit package with improved connections |
| 07/02/2009 | US20090166884 Semiconductor device and method for manufacturing the same |
| 07/02/2009 | US20090166882 Method for forming metal line in semiconductor device |
| 07/02/2009 | US20090166881 Air-gap ild with unlanded vias |
| 07/02/2009 | US20090166880 Electrical bonding pad |
| 07/02/2009 | US20090166879 Semiconductor package |
| 07/02/2009 | US20090166878 Semiconductor Device and Method of Fabricating the Same |
| 07/02/2009 | US20090166877 electro-optic device and a method for producing the same |
| 07/02/2009 | US20090166876 Semiconductor device and die bonding material |
| 07/02/2009 | US20090166875 Methods for preparing and devices with treated dummy moats |
| 07/02/2009 | US20090166874 Semiconductor Device and Method of Fabricating the Same |
| 07/02/2009 | US20090166873 Inter-connecting structure for semiconductor device package and method of the same |
| 07/02/2009 | US20090166872 Memory Word lines with Interlaced Metal Layers |
| 07/02/2009 | US20090166871 Metal line of semiconductor device without production of high resistance compound due to metal diffusion and method for forming the same |
| 07/02/2009 | US20090166870 Metal line of semiconductor device and method for forming the same |
| 07/02/2009 | US20090166869 Semiconductor device and method of forming metal interconnection layer thereof |
| 07/02/2009 | US20090166868 Semiconductor devices including metal interconnections and methods of fabricating the same |
| 07/02/2009 | US20090166867 Metal interconnect structures for semiconductor devices |
| 07/02/2009 | US20090166866 Contact metallization for semiconductor devices |
| 07/02/2009 | US20090166865 Manufacturable reliable diffusion-barrier |
| 07/02/2009 | US20090166864 Method to prevent copper migration in a semiconductor package |
| 07/02/2009 | US20090166863 Semiconductor device and method of manufacturing the same |
| 07/02/2009 | US20090166862 Semiconductor device and method of manufacturing the same |
| 07/02/2009 | US20090166861 Wire bonding of aluminum-free metallization layers by surface conditioning |
| 07/02/2009 | US20090166860 Flexible film and display device comprising the same |
| 07/02/2009 | US20090166859 Semiconductor device and method of manufacturing the same |
| 07/02/2009 | US20090166858 Lga substrate and method of making same |
| 07/02/2009 | US20090166857 Method and System for Providing an Aligned Semiconductor Assembly |
| 07/02/2009 | US20090166856 Semiconductor Device |
| 07/02/2009 | US20090166855 Cooling solutions for die-down integrated circuit packages |
| 07/02/2009 | US20090166854 Thermal Interface with Non-Tacky Surface |
| 07/02/2009 | US20090166853 Multi-layer stacked wafer level semiconductor package module |
| 07/02/2009 | US20090166852 Semiconductor packages with thermal interface materials |
| 07/02/2009 | US20090166851 Power semiconductor module |
| 07/02/2009 | US20090166850 High-Power Semiconductor Die Packages With Integrated Heat-Sink Capability and Methods of Manufacturing the Same |
| 07/02/2009 | US20090166849 Semiconductor chip |
| 07/02/2009 | US20090166848 Method for Enhancing the Adhesion of a Passivation Layer on a Semiconductor Device |
| 07/02/2009 | US20090166847 Semiconductor chip package |
| 07/02/2009 | US20090166846 Pass-through 3d interconnect for microelectronic dies and associated systems and methods |
| 07/02/2009 | US20090166845 Integrated circuit package system with extended corner leads |
| 07/02/2009 | US20090166844 Metal cover on flip-chip matrix-array (fcmx) substrate for low cost cpu assembly |
| 07/02/2009 | US20090166843 Semiconductor device and method for manufacturing a semiconductor device |
| 07/02/2009 | US20090166842 Leadframe for semiconductor package |
| 07/02/2009 | US20090166841 Package substrate embedded with semiconductor component |
| 07/02/2009 | US20090166840 Wafer-level stack package |
| 07/02/2009 | US20090166839 Semiconductor stack device and mounting method |
| 07/02/2009 | US20090166838 Laminated mounting structure and memory card |
| 07/02/2009 | US20090166837 Combination of chip package units |
| 07/02/2009 | US20090166836 Stacked wafer level package having a reduced size |
| 07/02/2009 | US20090166835 Integrated circuit package system with interposer |
| 07/02/2009 | US20090166834 Mountable integrated circuit package system with stacking interposer |
| 07/02/2009 | US20090166833 Semiconductor unit which includes multiple chip packages integrated together |
| 07/02/2009 | US20090166831 Sensor semiconductor package and method for fabricating the same |
| 07/02/2009 | US20090166830 Metallic cover of miniaturization module |
| 07/02/2009 | US20090166829 Semiconductor memory device |
| 07/02/2009 | US20090166828 Etched surface mount islands in a leadframe package |
| 07/02/2009 | US20090166827 Mechanical isolation for mems devices |
| 07/02/2009 | US20090166826 Lead frame die attach paddles with sloped walls and backside grooves suitable for leadless packages |
| 07/02/2009 | US20090166825 System and Apparatus for Wafer Level Integration of Components |
| 07/02/2009 | US20090166824 Leadless package system having external contacts |
| 07/02/2009 | US20090166823 Integrated circuit package system with lead locking structure |
| 07/02/2009 | US20090166822 Integrated circuit package system with shielding |
| 07/02/2009 | US20090166821 Leadframe Design for QFN Package with Top Terminal Leads |
| 07/02/2009 | US20090166820 Tsop leadframe strip of multiply encapsulated packages |