| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/08/2009 | EP1620294A4 Chemical vapor deposition epitaxial growth |
| 07/08/2009 | EP1412175B1 Insulating and functionalizing fine metal-containing particles with comformal ultra-thin films |
| 07/08/2009 | EP1384256B1 Ordered two-phase dielectric film, and semiconductor device containing the same |
| 07/08/2009 | EP1366512A4 A common ball-limiting metallurgy for i/o sites |
| 07/08/2009 | EP1356510B1 Wafer scale bonding of protective caps |
| 07/08/2009 | CN101479848A 供电网络 Supply network |
| 07/08/2009 | CN101479847A Hinged leadframe assembly for an electrical connector |
| 07/08/2009 | CN101479846A Flip-chip interconnection with formed couplings |
| 07/08/2009 | CN101479845A Flip-chip interconnection with a small passivation layer opening |
| 07/08/2009 | CN101479844A Method for encasing electronic components and integrated circuits |
| 07/08/2009 | CN101477978A Semiconductor apparatus |
| 07/08/2009 | CN101477977A Wafer stage encapsulation structure and lead pad electric signal leading process |
| 07/08/2009 | CN101477976A Display panel with signal reaction time homogenized and manufacturing method thereof |
| 07/08/2009 | CN101477975A SIM card encapsulation construction based on metal lead wire frame and encapsulation process thereof |
| 07/08/2009 | CN101477974A Conductive wire frame strip, glue sealing method and semiconductor encapsulation construction having the conductive wire frame |
| 07/08/2009 | CN101477973A Conductive wire frame strip, glue sealing method and glue sealing structure |
| 07/08/2009 | CN101477972A Lead frame, electronic component with the same, and manufacturing method thereof |
| 07/08/2009 | CN101477971A Semiconductor chip and its production method |
| 07/08/2009 | CN101477970A Circuit substrate and application thereof |
| 07/08/2009 | CN100512613C Power component cooling device |
| 07/08/2009 | CN100512594C Preferential ground and via exit structures for printed circuit boards |
| 07/08/2009 | CN100511853C Small array contact with precision working range |
| 07/08/2009 | CN100511681C Protection circuit for semiconductor device and semiconductor device including the same |
| 07/08/2009 | CN100511679C Semiconductor device |
| 07/08/2009 | CN100511677C Contact device |
| 07/08/2009 | CN100511676C Microelectronic package method and device |
| 07/08/2009 | CN100511672C Chip stacking semiconductor device |
| 07/08/2009 | CN100511668C Rectangular nitride semiconductor substrate with identified inner and outer surfaces |
| 07/08/2009 | CN100511667C Chip encapsulation structure and circuit board thereof |
| 07/08/2009 | CN100511666C Circuit board and circuit structure |
| 07/08/2009 | CN100511665C Substrate with non-welding cover defined metal spherical pad |
| 07/08/2009 | CN100511664C Chip encapsulation structure |
| 07/08/2009 | CN100511663C Mounting structure of electronic component |
| 07/08/2009 | CN100511662C 半导体器件 Semiconductor devices |
| 07/08/2009 | CN100511661C Microelectronic element with elastic conductive projection and method of manufacture |
| 07/08/2009 | CN100511660C Semiconductor device and method for designing the same |
| 07/08/2009 | CN100511659C Device comprising an electrical component and an electrical connecting lead for said component, and method for the production of said system |
| 07/08/2009 | CN100511658C Semiconductor element and producing method thereof, and semiconductor device and producing method thereof |
| 07/08/2009 | CN100511657C Cooling device for cooling two sides of semiconductor device |
| 07/08/2009 | CN100511656C Cooling device |
| 07/08/2009 | CN100511655C Semiconductor device, image read assembly and image forming appts. |
| 07/08/2009 | CN100511654C 可穿戴的硅芯片 Silicon wearable |
| 07/08/2009 | CN100511624C Device package and methods for the fabrication and testing thereof |
| 07/08/2009 | CN100511506C Ceramic electronic device and the production method thereof |
| 07/08/2009 | CN100511490C Conductive materials with electrical stability for use in electronics devices |
| 07/08/2009 | CN100510853C Display device and manufacturing method thereof |
| 07/08/2009 | CN100509987C Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
| 07/08/2009 | CN100509908C Encapsulating epoxy resin composition, and electronic parts device using the same |
| 07/07/2009 | USRE40819 Semiconductor device with improved bond pads |
| 07/07/2009 | US7558066 System and method for cooling a module |
| 07/07/2009 | US7557899 Liquid crystal display device and method of fabricating the same |
| 07/07/2009 | US7557596 Test assembly including a test die for testing a semiconductor product die |
| 07/07/2009 | US7557501 Flat panel display device having molybdenum conductive layer |
| 07/07/2009 | US7557455 System and apparatus that reduce corrosion of an integrated circuit through its bond pads |
| 07/07/2009 | US7557454 Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads |
| 07/07/2009 | US7557453 Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device |
| 07/07/2009 | US7557452 Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same |
| 07/07/2009 | US7557451 Electro-optical device and electronic apparatus |
| 07/07/2009 | US7557450 Wiring substrate and electronic parts packaging structure |
| 07/07/2009 | US7557449 Flexible via design to improve reliability |
| 07/07/2009 | US7557448 High-aspect-ratio metal-polymer composite structures for nano interconnects |
| 07/07/2009 | US7557447 Semiconductor device and method for manufacturing same |
| 07/07/2009 | US7557446 Semiconductor device and a fabrication process thereof |
| 07/07/2009 | US7557445 Multilayer substrate and the manufacturing method thereof |
| 07/07/2009 | US7557444 Power-via structure for integration in advanced logic/smart-power technologies |
| 07/07/2009 | US7557443 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices |
| 07/07/2009 | US7557442 Power semiconductor arrangement |
| 07/07/2009 | US7557441 Package of MEMS device and method for fabricating the same |
| 07/07/2009 | US7557440 Wiring board and ceramic chip to be embedded |
| 07/07/2009 | US7557439 Layered chip package that implements memory device |
| 07/07/2009 | US7557438 Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same |
| 07/07/2009 | US7557437 Fan out type wafer level package structure and method of the same |
| 07/07/2009 | US7557436 Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes |
| 07/07/2009 | US7557435 Micro-device encapsulation having light and moisture control |
| 07/07/2009 | US7557434 Power electronic package having two substrates with multiple electronic components |
| 07/07/2009 | US7557432 Thermally enhanced power semiconductor package system |
| 07/07/2009 | US7557431 Microwave surface mount hermetically sealed package and method of forming the same |
| 07/07/2009 | US7557430 Semiconductor seal ring |
| 07/07/2009 | US7557429 Semiconductor device with resistor element and dummy active region |
| 07/07/2009 | US7557427 Semiconductor device |
| 07/07/2009 | US7557424 Reversible electric fuse and antifuse structures for semiconductor devices |
| 07/07/2009 | US7557423 Semiconductor structure with a discontinuous material density for reducing eddy currents |
| 07/07/2009 | US7557413 Serpentine ballasting resistors for multi-finger ESD protection device |
| 07/07/2009 | US7557412 Semiconductor device and method of manufacturing the same |
| 07/07/2009 | US7557408 Semiconductor device and method of manufacturing the same |
| 07/07/2009 | US7557405 High-density nonvolatile memory |
| 07/07/2009 | US7557029 Semiconductor device and fabrication process thereof |
| 07/07/2009 | US7557014 Semiconductor system-in-package |
| 07/07/2009 | US7556993 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus |
| 07/07/2009 | US7556987 Method of fabricating an integrated circuit with etched ring and die paddle |
| 07/07/2009 | US7556985 Method of fabricating semiconductor device |
| 07/07/2009 | US7556975 Method for manufacturing backside-illuminated optical sensor |
| 07/07/2009 | US7556916 Method for burying resist and method for manufacturing semiconductor device |
| 07/07/2009 | US7556406 Led light with active cooling |
| 07/07/2009 | US7556086 Orientation-independent thermosyphon heat spreader |
| 07/07/2009 | US7555949 Angular velocity measuring device |
| 07/07/2009 | US7555835 Fabricating a monolithic microwave integrated circuit |
| 07/07/2009 | US7555830 Broken die detect sensor |
| 07/07/2009 | CA2480338C Substrate and method for measuring the electrophysiological properties of cell membranes |
| 07/02/2009 | WO2009082516A2 Adhesive applications using alkali silicate glass for electronics |