| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/15/2009 | CN101483169A Bearing belt used for encapsulated chip and chip encapsulation construction thereof |
| 07/15/2009 | CN101483168A Molding mode SIM card encapsulation construction based on metal frame and encapsulation method thereof |
| 07/15/2009 | CN101483167A Conductive wire frame strip, glue sealing method and glue sealing structure thereof |
| 07/15/2009 | CN101483166A Conductive wire rack with downset spoiler connecting structure and semi-conductor encapsulation construction |
| 07/15/2009 | CN101483165A Tape carrier package on reel and plasma display device using the same |
| 07/15/2009 | CN101483164A Semi-conductor encapsulation structure |
| 07/15/2009 | CN101483163A Window type ball grid array encapsulation construction and substrate thereof |
| 07/15/2009 | CN101483162A Semiconductor apparatus and method for manufacturing the same |
| 07/15/2009 | CN101483161A 半导体芯片 Semiconductor chip |
| 07/15/2009 | CN101483160A 电子部件 Electronic components |
| 07/15/2009 | CN101483159A Chip construction and process thereof, chip stacking construction and process thereof |
| 07/15/2009 | CN101483158A Chip, chip manufacturing method and chip encapsulation construction |
| 07/15/2009 | CN101483157A Electromagnetic-wave suppressing radiator sheet and electronic apparatus |
| 07/15/2009 | CN101482918A Finger print detection device |
| 07/15/2009 | CN100514630C Multi-chip assembly and method for driving the same |
| 07/15/2009 | CN100514629C Wafer with mark |
| 07/15/2009 | CN100514628C Radio-frequency test key structure |
| 07/15/2009 | CN100514627C Semiconductor component and installation structure |
| 07/15/2009 | CN100514626C Semiconductor device and method for determining fuse state |
| 07/15/2009 | CN100514625C Interconnection structure and its making method |
| 07/15/2009 | CN100514624C Semiconductor device and manufacturing method therefor |
| 07/15/2009 | CN100514623C 半导体装置及引线框 Semiconductor device and lead frame |
| 07/15/2009 | CN100514622C Semiconductor packaging supported films and packaging construction for increasing pin intensity |
| 07/15/2009 | CN100514621C 半导体器件 Semiconductor devices |
| 07/15/2009 | CN100514620C Manufacturing method for magnetic sensor and lead frame therefor |
| 07/15/2009 | CN100514619C Integrated circuit for defining crystal particle function with below welding and its making method |
| 07/15/2009 | CN100514618C Electric element and method for sealing electric element |
| 07/15/2009 | CN100514617C Circuit base board, mounting structure for semiconductor device with bumps, and electro-optic device |
| 07/15/2009 | CN100514616C Internally burying type chip packaging manufacture process and circuit board having the same |
| 07/15/2009 | CN100514615C Producing method of micro link lug structure with stress buffer |
| 07/15/2009 | CN100514614C Surface mount electronic component and process for manufacturing the same |
| 07/15/2009 | CN100514613C Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 07/15/2009 | CN100514612C Window manufacture method of semiconductor package type printed circuit board |
| 07/15/2009 | CN100514611C Electronic package comprising semiconductor chip and its manufacture method |
| 07/15/2009 | CN100514584C Manufacturing method for semiconductor device, semiconductor device, circuit substrate and apparatus |
| 07/15/2009 | CN100514580C Reversible leadless package and stack thereof |
| 07/15/2009 | CN100514574C Method for forming film, method for manufacturing semiconductor device, semiconductor device and substrate treatment system |
| 07/15/2009 | CN100513485C Silicon rubber composition for electrode circuit protection, electrode circuit protection material and electric, electronic parts |
| 07/15/2009 | CN100512877C Germ-free medicinal compositions |
| 07/14/2009 | USRE40855 Integrated circuit having a reduced spacing between a bus and adjacent circuitry |
| 07/14/2009 | US7562318 Test structure for automatic dynamic negative-bias temperature instability testing |
| 07/14/2009 | US7561434 Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon |
| 07/14/2009 | US7561433 Apparatus and method for a clip device for coupling a heat sink plate system with a burn-in board system |
| 07/14/2009 | US7561425 Encapsulated multi-phase electronics heat-sink |
| 07/14/2009 | US7561390 Protection circuit in semiconductor circuit device comprising a plurality of chips |
| 07/14/2009 | US7560821 Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same |
| 07/14/2009 | US7560820 Integrated getter for vacuum or inert gas packaged LEDs |
| 07/14/2009 | US7560819 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 07/14/2009 | US7560818 Stacked structure of chips and water structure for making the same |
| 07/14/2009 | US7560817 Interconnect including a pliable surface and use thereof |
| 07/14/2009 | US7560816 Small grain size, conformal aluminum interconnects and method for their formation |
| 07/14/2009 | US7560815 Device structures including ruthenium silicide diffusion barrier layers |
| 07/14/2009 | US7560814 Semiconductor device that improves electrical connection reliability |
| 07/14/2009 | US7560813 Chip-based thermo-stack |
| 07/14/2009 | US7560812 Cooling module against ESD and electronic package, assembly and system using the same |
| 07/14/2009 | US7560810 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
| 07/14/2009 | US7560809 Semiconductor device |
| 07/14/2009 | US7560807 Arrangement of semiconductor memory devices and semiconductor memory module comprising an arrangement of semiconductor memory devices |
| 07/14/2009 | US7560806 Memory card |
| 07/14/2009 | US7560805 Semiconductor package and method of manufacturing the same |
| 07/14/2009 | US7560804 Integrated circuit package and method of making the same |
| 07/14/2009 | US7560802 Electrical connections in substrates |
| 07/14/2009 | US7560801 Rewiring substrate strip with several semiconductor component positions |
| 07/14/2009 | US7560777 Protection element and method of manufacture |
| 07/14/2009 | US7560766 Nonvolatile semiconductor memory |
| 07/14/2009 | US7560764 SONOS memory device having curved surface and method for fabricating the same |
| 07/14/2009 | US7560739 Micro or below scale multi-layered heterostructure |
| 07/14/2009 | US7560738 Light-emitting diode array having an adhesive layer |
| 07/14/2009 | US7560501 comprising epoxy and cyanate ester resins, flexibilizers comprises bis(2,3-epoxy-2-methylpropyl)ether, a polyphenylene ether and silicon carbide fillers, having a higher fracture toughness, low viscosity and freeze resistance, used in electronic packages |
| 07/14/2009 | US7560372 Process for making a semiconductor device having a roughened surface |
| 07/14/2009 | US7560311 Robust leaded molded packages and methods for forming the same |
| 07/14/2009 | US7560307 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same |
| 07/14/2009 | US7560292 Voltage contrast monitor for integrated circuit defects |
| 07/09/2009 | WO2009086508A1 Solder wire construction |
| 07/09/2009 | WO2009086294A2 Leadframe receiver package for solar concentrator |
| 07/09/2009 | WO2009085609A2 3-d semiconductor die structure with containing feature and method |
| 07/09/2009 | WO2009085509A1 Selective electroless plating for electronic substrates |
| 07/09/2009 | WO2009085463A1 Electronic assembly manufacturing method |
| 07/09/2009 | WO2009085423A2 A heat sink and method of forming a heatsink using a wedge-lock system |
| 07/09/2009 | WO2009085409A1 In-situ cavity integrated circuit package |
| 07/09/2009 | WO2009085374A2 Formation of a hybrid integrated circuit device |
| 07/09/2009 | WO2009085012A1 Micro nozzle |
| 07/09/2009 | WO2009085009A1 Pre-heating system and method for silicon dies |
| 07/09/2009 | WO2009084701A1 Semiconductor package and camera module |
| 07/09/2009 | WO2009084700A1 Semiconductor package including through-hole electrode and light-transmitting substrate |
| 07/09/2009 | WO2009084597A1 Method for manufacturing semiconductor device, semiconductor device, method for manufacturing interim product of semiconductor device, interim product of semiconductor device, and lead frame |
| 07/09/2009 | WO2009084301A1 Interposer and interposer manufacturing method |
| 07/09/2009 | WO2009084300A1 Interposer and manufacturing method of the interposer |
| 07/09/2009 | WO2009084299A1 Interposer and manufacturing method of the interposer |
| 07/09/2009 | WO2009083582A1 Method for aligning and bonding elements and a device comprising aligned and bonded elements |
| 07/09/2009 | WO2009083293A1 Power circuit |
| 07/09/2009 | WO2009082865A1 Led plane light source for universial illumination |
| 07/09/2009 | WO2009057018A3 Rf-ic packaging method and circuits obtained thereby |
| 07/09/2009 | WO2009055554A3 Multi-layer chip carrier and process for making |
| 07/09/2009 | WO2009055032A3 All optical fast distributed arbitration in a computer system device |
| 07/09/2009 | WO2009055029A3 Three-dimensional die stacks with inter-device and intra-device optical interconnect |
| 07/09/2009 | WO2009032153A3 Memory device interface methods, apparatus, and systems |
| 07/09/2009 | WO2007122548A3 Thermal isolation of electronic devices in submount used for leds lighting applications |
| 07/09/2009 | US20090177066 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090177065 Analyte Monitoring Device and Methods of Use |