| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/09/2009 | US20090177064 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090177063 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090177062 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090177061 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090177060 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090177059 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090177058 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090177057 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090177056 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090177055 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090177054 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | US20090176364 Semiconductor device having a refractory metal containing film and method for manufacturing the same |
| 07/09/2009 | US20090176357 Semiconductor device and method of manufacturing the same |
| 07/09/2009 | US20090176346 Monitor pattern of semiconductor device and method of manufacturing semiconductor device |
| 07/09/2009 | US20090176336 Method of Manufacturing a Semiconductor Device |
| 07/09/2009 | US20090176324 Method for encapsulating a substrate and method for fabricating a light emitting diode device |
| 07/09/2009 | US20090175104 Three dimensional structure memory |
| 07/09/2009 | US20090174085 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device |
| 07/09/2009 | US20090174084 Via offsetting to reduce stress under the first level interconnect (fli) in microelectronics packaging |
| 07/09/2009 | US20090174083 Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same |
| 07/09/2009 | US20090174081 Combination substrate |
| 07/09/2009 | US20090174080 Semiconductor device |
| 07/09/2009 | US20090174079 Plated pillar package formation |
| 07/09/2009 | US20090174078 Semiconductor device and method of manufacturing the same |
| 07/09/2009 | US20090174077 Method for Structuring a Substrate |
| 07/09/2009 | US20090174076 Semiconductor device and the method of manufacturing the same |
| 07/09/2009 | US20090174075 Simultaneous grain modulation for beol applications |
| 07/09/2009 | US20090174074 Semiconductor device |
| 07/09/2009 | US20090174073 Substrate for semiconductor package having coating film and method for manufacturing the same |
| 07/09/2009 | US20090174072 Semiconductor system having bga package with radially ball-depopulated substrate zones and board with radial via zones |
| 07/09/2009 | US20090174071 Semiconductor device including electrically conductive bump and method of manufacturing the same |
| 07/09/2009 | US20090174070 Three-dimensional stacked substrate arrangements |
| 07/09/2009 | US20090174069 I/o pad structure for enhancing solder joint reliability in integrated circuit devices |
| 07/09/2009 | US20090174068 Semiconductor device, circuit board, and electronic instrument |
| 07/09/2009 | US20090174067 Airgap-containing interconnect structure with patternable low-k material and method of fabricating |
| 07/09/2009 | US20090174066 Semiconductor device |
| 07/09/2009 | US20090174065 Semiconductor device and method of manufacturing the same |
| 07/09/2009 | US20090174064 Integrated circuit package system with heat slug |
| 07/09/2009 | US20090174063 Semiconductor Module |
| 07/09/2009 | US20090174062 Circuit board, semiconductor device, and manufacturing method of circuit board |
| 07/09/2009 | US20090174061 Semiconductor Device |
| 07/09/2009 | US20090174060 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 07/09/2009 | US20090174059 Method and manufacture of silicon based package and devices manufactured thereby |
| 07/09/2009 | US20090174058 Chip scale package |
| 07/09/2009 | US20090174057 Semiconductor device and programming method |
| 07/09/2009 | US20090174056 Semiconductor module |
| 07/09/2009 | US20090174055 Leadless Semiconductor Packages |
| 07/09/2009 | US20090174054 Module with Flat Construction and Method for Placing Components |
| 07/09/2009 | US20090174053 Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device |
| 07/09/2009 | US20090174052 Electronic component, semiconductor package, and electronic device |
| 07/09/2009 | US20090174051 Semiconductor package and semiconductor device |
| 07/09/2009 | US20090174050 In-plane silicon heat spreader and method therefor |
| 07/09/2009 | US20090174049 Ultra thin image sensor package structure and method for fabrication |
| 07/09/2009 | US20090174048 Die package including substrate with molded device |
| 07/09/2009 | US20090174047 Semiconductor Die Packages Having Overlapping Dice, System Using the Same, and Methods of Making the Same |
| 07/09/2009 | US20090174046 Semiconductor package with an embedded printed circuit board and stacked die |
| 07/09/2009 | US20090174045 Bump Pad Metallurgy Employing An Electrolytic Cu / Electorlytic Ni / Electrolytic Cu Stack |
| 07/09/2009 | US20090174044 Multi-chip package |
| 07/09/2009 | US20090174043 Flexible contactless wire bonding structure and methodology for semiconductor device |
| 07/09/2009 | US20090174042 Radio frequency over-molded leadframe package |
| 07/09/2009 | US20090174041 Ultraviolet blocking structure and method for semiconductor device |
| 07/09/2009 | US20090174040 Sacrificial pillar dielectric platform |
| 07/09/2009 | US20090174029 Semiconductor device and method of fabricating the same |
| 07/09/2009 | US20090174028 Fuse in a Semiconductor Device and Method for Forming the Same |
| 07/09/2009 | US20090174027 Integrated circuit including isolation regions substantially through substrate |
| 07/09/2009 | US20090174024 Image sensor and method for manufacturing the same |
| 07/09/2009 | US20090174004 Semiconductor device and fabricating method thereof |
| 07/09/2009 | US20090174000 Semiconductor device including insulated-gate field-effect transistor |
| 07/09/2009 | US20090173953 Package with overlapping devices |
| 07/09/2009 | US20090173945 Method for forming conductive film, thin-film transistor, panel with thin-film transistor, and method for manufacturing thin-film transistor |
| 07/09/2009 | US20090173628 Analyte Monitoring Device and Methods of Use |
| 07/09/2009 | DE4443424B4 Anordnungen aus einem mehrschichtigen Substrat und einem Leistungselement und Verfahren zu ihrer Herstellung Arrays of a multi-layer substrate and a power element and process for their preparation |
| 07/09/2009 | DE202009003306U1 Kühlmodul Cooling module |
| 07/09/2009 | DE19609118B4 Widerstandspaste, Glasüberzugsspaste und ein diese verwendendes keramisches Schaltungssubstrat Resistor paste this Glasüberzugsspaste and a ceramic-use circuit substrate |
| 07/09/2009 | DE112007001992T5 Halbleiterchip-Package mit gestapelten Chips und Wärmesenkenaufbauten Semiconductor chip package with stacked chips and heat sink assemblies |
| 07/09/2009 | DE112007001599T5 Anwendung von Smart-Polymer-Verbunden beim Packaging von integrierten Schaltungen Application of smart polymer composites in packaging of integrated circuits |
| 07/09/2009 | DE112004001530B4 Versiegelte Poren in Damascene-Strukturen mit Low-k-Material Sealed pores in damascene structures with low-k material |
| 07/09/2009 | DE10303103B4 Halbleiterbauteil, insbesondere Leistungshalbleiterbauteil Semiconductor component, in particular power semiconductor component |
| 07/09/2009 | DE102008064373A1 Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device |
| 07/09/2009 | DE102008063979A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation |
| 07/09/2009 | DE102008063633A1 Verfahren zum Herstellen eines Halbleiterbauelements A method of manufacturing a semiconductor device |
| 07/09/2009 | DE102008063208A1 Halbleiterbauelement, Verfahren zum Betrieb eines Halbleiterbauelements und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device, method for operating a semiconductor device and method of manufacturing a semiconductor device |
| 07/09/2009 | DE102007063268A1 Drahtverbindung mit aluminiumfreien Metallisierungsschichten durch Oberflächenkonditionierung Wire bonding with aluminum-free metallization layers by surface conditioning |
| 07/09/2009 | DE102007061882B3 Verfahren zur Herstellung einer integrierten Schaltung mit vergrabenem Kanal und integrierte Schaltung mit vergrabenem Kanal A method of fabricating an integrated circuit with buried channel and integrated circuit with buried channel |
| 07/09/2009 | DE102006052620B4 Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist. Circuit arrangement having a power module that is combined with a circuit board. |
| 07/09/2009 | DE102006022360B4 Abschirmvorrichtung Screening |
| 07/09/2009 | DE102004057421B4 Druckkontaktiertes Leistungshalbleitermodul für hohe Umgebungstemperaturen und Verfahren zu seiner Herstellung Pressure-contacted power semiconductor module for high ambient temperatures and process for its preparation |
| 07/09/2009 | DE102004046806B4 Leistungshalbleitermodul The power semiconductor module |
| 07/09/2009 | DE10156357B4 Anbringen von akustischen Filmvolumenresonatoren in Mikrowellengehäusen unter Verwendung einer Flip-Chip-Bondtechnik Attachment of film bulk acoustic resonators in microwave enclosures using a flip-chip bonding technique |
| 07/09/2009 | CA2704707A1 Formation of a hybrid integrated circuit device |
| 07/08/2009 | EP2077703A1 Printed circuit board and method of manufacturing printed circuit board |
| 07/08/2009 | EP2077579A1 Twin chip-mounted diode |
| 07/08/2009 | EP2077420A1 A semiconductor light-emitting module |
| 07/08/2009 | EP2077065A1 Use of an adhesive composition for die-attaching high power semiconductors |
| 07/08/2009 | EP2076922A1 Semiconductor device having low dielectric insulating film and manufacturing method of the same |
| 07/08/2009 | EP2076921A2 One-time-programmable logic bit with multiple logic elements |
| 07/08/2009 | EP1866963A4 Multilayer, multicomponent high-k films and methods for depositing the same |
| 07/08/2009 | EP1756949A4 Semiconductor device and method of forming the same |
| 07/08/2009 | EP1683278B1 Processor component for contactless signal transmission |
| 07/08/2009 | EP1629533B1 Semiconductor device and method of fabricating the same |