| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/21/2009 | US7563707 Laser process for reliable and low-resistance electrical contacts |
| 07/21/2009 | US7563706 Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device |
| 07/21/2009 | US7563705 Manufacturing method of semiconductor device |
| 07/21/2009 | US7563703 Microelectronic interconnect device comprising localised conductive pins |
| 07/21/2009 | US7563668 Semiconductor device and method of manufacturing same |
| 07/21/2009 | US7563651 Method of fabricating a substrate with a concave surface |
| 07/21/2009 | US7563650 Circuit board and the manufacturing method |
| 07/21/2009 | US7563648 Semiconductor device package and method for manufacturing same |
| 07/21/2009 | US7563647 Integrated circuit package system with interconnect support |
| 07/21/2009 | US7563645 Electronic package having a folded package substrate |
| 07/21/2009 | US7563644 Optical device and method for fabricating the same |
| 07/21/2009 | US7563640 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof |
| 07/21/2009 | US7563632 Methods for packaging and sealing an integrated circuit die |
| 07/21/2009 | US7563487 laminating a porous film made of polytetrafluoroethylene with elasticity suitable for elastic recovery and used as a base film, adhering conductive metal by electroless plating at plural positions of the base film; use in the burn-in test of semiconductor devices |
| 07/21/2009 | CA2450239C Hermetic feedthrough for an implantable device |
| 07/16/2009 | WO2009088869A2 Multiple access over proximity communication |
| 07/16/2009 | WO2009088803A1 Flexible contactless wire bonding structure anad methodology for semiconductor device |
| 07/16/2009 | WO2009088659A2 Micropad formation for a semiconductor |
| 07/16/2009 | WO2009088622A1 Migfet circuit with esd protection |
| 07/16/2009 | WO2009088592A1 Methods of forming high density metal wiring for fine line and space packaging applications and structures formed thereby |
| 07/16/2009 | WO2009088565A2 Method of forming a thermo pyrolytic graphite-embedded heatsink |
| 07/16/2009 | WO2009088522A2 Cobalt nitride layers for copper interconnects and methods for forming them |
| 07/16/2009 | WO2009088069A1 Manufacturing method for condenser-packaged device, and manufacturing method for condenser-packaged package |
| 07/16/2009 | WO2009088000A1 Wiring board, semiconductor device and method for manufacturing wiring board and semiconductor device |
| 07/16/2009 | WO2009087713A1 Semiconductor device and method for manufacturing the same |
| 07/16/2009 | WO2009087561A1 Semiconductor device |
| 07/16/2009 | WO2009087284A1 Structure comprising a getter layer and an adjusting sublayer, and fabrication process |
| 07/16/2009 | WO2009066192A3 Wafer level package device with an smd form factor |
| 07/16/2009 | WO2009039354A3 Hybrid organic-inorganic dielectric bragg mirrors, and methods of use thereof |
| 07/16/2009 | WO2008060447A8 Microcircuit package having ductile layer |
| 07/16/2009 | US20090182215 Analyte Monitoring Device and Methods of Use |
| 07/16/2009 | US20090182214 Analyte Monitoring Device and Methods of Use |
| 07/16/2009 | US20090182213 Analyte Monitoring Device and Methods of Use |
| 07/16/2009 | US20090182212 Analyte Monitoring Device and Methods of Use |
| 07/16/2009 | US20090181560 S&p3 cww2 connectors with wipe |
| 07/16/2009 | US20090181521 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
| 07/16/2009 | US20090180733 System package using flexible optical and electrical wiring and signal processing method thereof |
| 07/16/2009 | US20090179336 Electronic Module and a Method of Assembling Such a Module |
| 07/16/2009 | US20090179335 Printed circuit board and semiconductor package including the same |
| 07/16/2009 | US20090179334 Apparatus for facilitating proximity communication between chips |
| 07/16/2009 | US20090179333 Solder contacts and methods of forming same |
| 07/16/2009 | US20090179332 Semiconductor device and method of manufacturing the same |
| 07/16/2009 | US20090179331 Integrated circuit insulators and related methods |
| 07/16/2009 | US20090179330 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads |
| 07/16/2009 | US20090179329 Semiconductor Devices and Method of Fabricating the Same |
| 07/16/2009 | US20090179328 Barrier sequence for use in copper interconnect metallization |
| 07/16/2009 | US20090179327 Packaging structure, method for manufacturing the same, and method for using the same |
| 07/16/2009 | US20090179326 Semiconductor device package |
| 07/16/2009 | US20090179325 Leadless package |
| 07/16/2009 | US20090179324 Integrated circuit package and fabricating method thereof |
| 07/16/2009 | US20090179323 Local area semiconductor cooling system |
| 07/16/2009 | US20090179322 Electronic package method and structure with cure-melt hierarchy |
| 07/16/2009 | US20090179321 Power semiconductor device |
| 07/16/2009 | US20090179320 Integrated circuit incorporating wire bond inductance |
| 07/16/2009 | US20090179319 Stacked semiconductor package assembly having hollowed substrate |
| 07/16/2009 | US20090179318 Multi-channel stackable semiconductor device and method for fabricating the same, and stacking substrate applied to the semiconductor device |
| 07/16/2009 | US20090179317 Semiconductor device and method for manufacturing the same |
| 07/16/2009 | US20090179316 Flexible semiconductor device and fabrication method thereof |
| 07/16/2009 | US20090179315 Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same |
| 07/16/2009 | US20090179314 Integrated circuit package system with leadfinger support |
| 07/16/2009 | US20090179313 Flex clip connector for semiconductor device |
| 07/16/2009 | US20090179312 Integrated circuit package-on-package stacking system |
| 07/16/2009 | US20090179311 Semiconductor component and method for producing the same |
| 07/16/2009 | US20090179308 Method of Manufacturing a Semiconductor Device |
| 07/16/2009 | US20090179307 Integrated circuit system employing feed-forward control |
| 07/16/2009 | US20090179306 ADVANCED LOW k CAP FILM FORMATION PROCESS FOR NANO ELECTRONIC DEVICES |
| 07/16/2009 | US20090179305 Substrate and manufacturing method of the same |
| 07/16/2009 | US20090179304 Semiconductor device and method of manufacturing the same |
| 07/16/2009 | US20090179302 Programmable electronic fuse |
| 07/16/2009 | US20090179300 Trench Sidewall Protection by a Carbon-Rich Layer in a Semiconductor Device |
| 07/16/2009 | US20090179292 Molybdenum-doped indium oxide structures and methods |
| 07/16/2009 | US20090179287 Functional device and manufacturing method thereof |
| 07/16/2009 | US20090179270 Electrostatic Discharge Protection Pattern for High Voltage Applications |
| 07/16/2009 | US20090179230 Wiring Substrate, Semiconductor Device and Manufacturing Method Thereof |
| 07/16/2009 | US20090179204 Crystal display |
| 07/16/2009 | US20090178835 Multileveled printed circuit board unit including substrate interposed between stacked bumps |
| 07/16/2009 | DE102008063982A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 07/16/2009 | DE102008009510B3 Verfahren zum Niedertemperatur-Drucksintern Method for low temperature pressure sintering |
| 07/16/2009 | DE102008004615A1 Cooling tube manufacturing method for electronic component, involves cutting cooling tube to desired length, closing closed end and closed section and forming larger contact area by contact section |
| 07/16/2009 | DE102008004140A1 Heat dissipating device has heat sink with heat conducting grain and ribbed unit, where ribbed unit is combined thermally with heat conducting grain |
| 07/16/2009 | DE102008003788A1 Elektrische Schaltungsanordnung mit mindestens einem Leistungshalbleiter und Verfahren zu deren Herstellung An electrical circuit arrangement having at least one power semiconductor and process for their preparation |
| 07/16/2009 | DE102008003785A1 Method for producing or manufacturing enclosure of electronic element, involves surrounding electronic element in hollow space by wall, where definite shape or geometry is inserted in shaping device |
| 07/16/2009 | DE102006057248B4 Halbleitermodul Semiconductor module |
| 07/16/2009 | DE10149580B4 Halbleitervorrichtung Semiconductor device |
| 07/16/2009 | CA2701363A1 Structure comprising a getter layer and an adjusting sublayer, and fabrication process |
| 07/15/2009 | EP2079291A1 Printed circuit board and method of manufacturing printed circuit board |
| 07/15/2009 | EP2079289A2 Printed wiring board and printed substrate unit |
| 07/15/2009 | EP2079107A1 Method for manufacturing a card-shaped data carrier and data carrier manufactured by means of this method |
| 07/15/2009 | EP2078308A2 Potted integrated circuit device with aluminum case |
| 07/15/2009 | EP2006906A9 Electronic component and method for manufacturing same |
| 07/15/2009 | EP1856735A4 Low k dielectric cvd film formation process with in-situ imbedded nanolayers to improve mechanical properties |
| 07/15/2009 | EP1825510B1 Method for collectively producing a superimposed element microstructure |
| 07/15/2009 | EP1792526B1 Electronic device provided with an integrated heat spreader |
| 07/15/2009 | EP1371094A4 sUPER-THIN HIGH SPEED FLIP CHIP PACKAGE |
| 07/15/2009 | CN101484992A Cooling semiconductor-based devices arranged in a greenhouse |
| 07/15/2009 | CN101484991A Integrated circuit heat dissipation device |
| 07/15/2009 | CN101484990A Semiconductor module and semiconductor module manufacturing method |
| 07/15/2009 | CN101483172A Semiconductor structure and its production method |
| 07/15/2009 | CN101483171A Airgap-containing interconnect structure with patternable low-K material and method of fabricating |
| 07/15/2009 | CN101483170A Semiconductor device |