| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/22/2009 | CN201278347Y A dielectric substance layer structure |
| 07/22/2009 | CN201278346Y Electric connecting semiconductor chip and substrate throwing structure |
| 07/22/2009 | CN201278345Y Wind guiding apparatus |
| 07/22/2009 | CN101490841A Cooling device and vehicle with the same |
| 07/22/2009 | CN101490840A EMI absorbing gap filling material |
| 07/22/2009 | CN101490839A Integrated circuit, transponder, method of producing an integrated circuit and method of producing a transponder |
| 07/22/2009 | CN101488496A Semiconductor device and power supply system |
| 07/22/2009 | CN101488493A Package for electronic component and method for manufacturing the same |
| 07/22/2009 | CN101488492A Semiconductor encapsulation structure having substrate identification code and manufacturing method thereof |
| 07/22/2009 | CN101488491A Lamella structured thin films with ultralow dielectric constants and high hardness and method for manufacturing the same |
| 07/22/2009 | CN101488490A Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
| 07/22/2009 | CN101488489A Conductive line structure and the method of forming the same |
| 07/22/2009 | CN101488488A Improved barrier structure for use in copper interconnect metallization and its forming method |
| 07/22/2009 | CN101488487A Board adapted to mount an electronic device, semiconductor module and manufacturing method therefore, and portable device |
| 07/22/2009 | CN101488486A Circuit substrate capable of opening slots |
| 07/22/2009 | CN101488485A Encapsulation structure in conductive wire shape |
| 07/22/2009 | CN101488484A Device mounting board, semiconductor module, and mobile device |
| 07/22/2009 | CN101488483A Semiconductor chip encapsulation structure |
| 07/22/2009 | CN101488482A Semi-conductor package structure and manufacturing method thereof |
| 07/22/2009 | CN101488481A Light-emitting device with improved brightness control and narrow frame and electronic apparatus with the light-emitting device |
| 07/22/2009 | CN101488480A Interlayer dielectric and pre-applied die attach adhesive materials |
| 07/22/2009 | CN101488473A Method for making semiconductor structures implementing sacrificial material |
| 07/22/2009 | CN101488464A Method for forming an encapsulated device and structure |
| 07/22/2009 | CN100518465C Cooling device for electronic apparatus |
| 07/22/2009 | CN100517895C Electrostatic discharge circuit and method therefor |
| 07/22/2009 | CN100517708C Hybrid integrated circuit device |
| 07/22/2009 | CN100517689C Static electricity damage preventor |
| 07/22/2009 | CN100517688C Alignment mark with improved resistance to dicing induced cracking and delamination in the scribe region |
| 07/22/2009 | CN100517687C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 07/22/2009 | CN100517686C Semiconductor device |
| 07/22/2009 | CN100517685C Interconnection structure of integrate circuit |
| 07/22/2009 | CN100517684C Semiconductor device and method for manufacturing same |
| 07/22/2009 | CN100517683C Semi-conductor apparatus and its pattern wiring method |
| 07/22/2009 | CN100517682C Semiconductor device and its producing method |
| 07/22/2009 | CN100517681C Package board having internal terminal interconnection and semiconductor package employing the same |
| 07/22/2009 | CN100517680C Wiring board, semiconductor device and display module |
| 07/22/2009 | CN100517679C Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same |
| 07/22/2009 | CN100517678C Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same |
| 07/22/2009 | CN100517677C Multiple chip packaged conductor frame, its producing method and its package structure |
| 07/22/2009 | CN100517676C Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device |
| 07/22/2009 | CN100517675C Copper bonding compatible bond pad structure and method |
| 07/22/2009 | CN100517674C Conductive structure for semiconductor integrated circuit and method for forming the same |
| 07/22/2009 | CN100517673C Solder bump structure for flip chip semiconductor devices and method of manufacture therefore |
| 07/22/2009 | CN100517672C Semiconductor device |
| 07/22/2009 | CN100517671C Solder lug and manufacturing method thereof |
| 07/22/2009 | CN100517670C 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 07/22/2009 | CN100517669C Semiconductor device |
| 07/22/2009 | CN100517668C Bond pad structure |
| 07/22/2009 | CN100517667C Radiating system of light-emitting diode |
| 07/22/2009 | CN100517666C Electronic assemblies with fluid cooling and associated methods |
| 07/22/2009 | CN100517665C Heat-pipe radiating apparatus |
| 07/22/2009 | CN100517664C Apparatus, system and method to secure a heat sink |
| 07/22/2009 | CN100517663C Radiator |
| 07/22/2009 | CN100517662C Semiconductor device having high cooling efficiency and method for manufacturing the same |
| 07/22/2009 | CN100517661C Preparation method of heat radiator |
| 07/22/2009 | CN100517660C Heat abstractor |
| 07/22/2009 | CN100517659C Semiconductor device, semiconductor device manufacturing method thereof and lid frame |
| 07/22/2009 | CN100517658C Semiconductor chip having island dispersion structure and method for manufacturing the same |
| 07/22/2009 | CN100517625C Electronic component, semiconductor device, methods of manufacturing the same |
| 07/22/2009 | CN100517590C Semiconductor device and its manufacturing method |
| 07/22/2009 | CN100517422C Distributing structure, its manufacturing method and optical equipment |
| 07/22/2009 | CN100516914C Integrated circuit and associated packaged integrated circuit |
| 07/22/2009 | CN100516883C Acceleration sensor and method of manufacturing acceleration sensor |
| 07/22/2009 | CA2647863A1 Mcm packages |
| 07/21/2009 | US7564690 Method for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers |
| 07/21/2009 | US7564689 Clip for heat sink |
| 07/21/2009 | US7564164 Drive circuit for piezoelectric pump and cooling system that uses this drive circuit |
| 07/21/2009 | US7564142 Electronic device and method of manufacturing the same, circuit board, and electronic instrument |
| 07/21/2009 | US7564141 Apparatus and method for preventing configurable system-on-a-chip integrated circuits from becoming I/O limited |
| 07/21/2009 | US7564140 Semiconductor package and substrate structure thereof |
| 07/21/2009 | US7564139 Semiconductor device and method for manufacturing the same |
| 07/21/2009 | US7564138 Method for attaching chips in a flip-chip arrangement |
| 07/21/2009 | US7564137 Stackable integrated circuit structures and systems devices and methods related thereto |
| 07/21/2009 | US7564136 Integration scheme for Cu/low-k interconnects |
| 07/21/2009 | US7564135 Semiconductor device having self-aligned contact and method of fabricating the same |
| 07/21/2009 | US7564134 Circuit wiring layout in semiconductor memory device and layout method |
| 07/21/2009 | US7564133 Semiconductor device and method for fabricating the same |
| 07/21/2009 | US7564132 Semiconductor chip |
| 07/21/2009 | US7564131 Semiconductor package and method of making a semiconductor package |
| 07/21/2009 | US7564130 Power micro surface-mount device package |
| 07/21/2009 | US7564129 Power semiconductor module, and power semiconductor device having the module mounted therein |
| 07/21/2009 | US7564128 Fully testable surface mount die package configured for two-sided cooling |
| 07/21/2009 | US7564127 Memory module that is capable of controlling input/output in accordance with type of memory chip |
| 07/21/2009 | US7564126 Integrated circuit package |
| 07/21/2009 | US7564125 Electronic array and methods for fabricating same |
| 07/21/2009 | US7564124 Semiconductor die package including stacked dice and heat sink structures |
| 07/21/2009 | US7564123 Semiconductor package with fastened leads |
| 07/21/2009 | US7564122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant |
| 07/21/2009 | US7564121 Semiconductor device having shield structure |
| 07/21/2009 | US7564120 Electrical passivation of silicon-containing surfaces using organic layers |
| 07/21/2009 | US7564119 Adhesive sheet for laser dicing and its manufacturing method |
| 07/21/2009 | US7564118 Chip and wafer integration process using vertical connections |
| 07/21/2009 | US7564104 Low ohmic layout technique for MOS transistors |
| 07/21/2009 | US7564101 Semiconductor device for protecting a circuit formed on a semiconductor chip from destruction caused by an electrostatic discharge |
| 07/21/2009 | US7564051 Thin-film transistor including organic semiconductor and inorganic particles, and manufacturing method therefor |
| 07/21/2009 | US7563991 All weather housing assembly for electronic components |
| 07/21/2009 | US7563990 Electronic product, a body and a method of manufacturing |
| 07/21/2009 | US7563988 Circuit device |
| 07/21/2009 | US7563987 Electronic parts packaging structure and method of manufacturing the same |
| 07/21/2009 | US7563730 Hafnium lanthanide oxynitride films |