| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/28/2009 | US7566587 Method and apparatus for packaging electronic components |
| 07/28/2009 | US7566010 Securities, chip mounting product, and manufacturing method thereof |
| 07/28/2009 | US7566001 IC card |
| 07/28/2009 | US7565738 Method for manufacturing circuit device |
| 07/28/2009 | US7565737 Manufacturing method of package substrate |
| 07/23/2009 | WO2009091440A1 Silsesquioxane resins |
| 07/23/2009 | WO2009090931A1 Semiconductor device and display apparatus |
| 07/23/2009 | WO2009090896A1 Electronic component |
| 07/23/2009 | WO2009090895A1 Piezoelectric device |
| 07/23/2009 | WO2009090693A1 Circuit board module and electronic apparatus |
| 07/23/2009 | WO2009090517A2 Redundant chain test structure for precise contact/via fail rate measurement |
| 07/23/2009 | WO2009090349A2 Method for making an electrically conducting mechanical interconnection member |
| 07/23/2009 | WO2009089996A1 Fabrication of compact semiconductor packages |
| 07/23/2009 | WO2009089806A1 Electric contacting of semiconductor components having low contact resistance |
| 07/23/2009 | WO2009073087A3 A semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding |
| 07/23/2009 | WO2009071982A3 Under bump routing layer method and apparatus |
| 07/23/2009 | WO2009056414A3 Module housing and method for producing a module housing |
| 07/23/2009 | WO2009037648A3 Integrated circuit stack and its thermal management |
| 07/23/2009 | WO2004053403A3 Method and system for cooling high power density devices |
| 07/23/2009 | US20090187872 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
| 07/23/2009 | US20090187268 Temperature regulating method, thermal processing system and semiconductor device manufacturing method |
| 07/23/2009 | US20090187095 Analyte Monitoring Device and Methods of Use |
| 07/23/2009 | US20090187094 Analyte Monitoring Device and Methods of Use |
| 07/23/2009 | US20090187093 Analyte Monitoring Device and Methods of Use |
| 07/23/2009 | US20090187092 Analyte Monitoring Device and Methods of Use |
| 07/23/2009 | US20090187091 Analyte Monitoring Device and Methods of Use |
| 07/23/2009 | US20090187090 Analyte Monitoring Device and Methods of Use |
| 07/23/2009 | US20090187089 Analyte Monitoring Device and Methods of Use |
| 07/23/2009 | US20090187088 Analyte Monitoring Device and Methods of Use |
| 07/23/2009 | US20090186955 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 07/23/2009 | US20090186425 Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus |
| 07/23/2009 | US20090186284 Reticle, and method of laying out wirings and vias |
| 07/23/2009 | US20090184756 Semiconductor Power Device with Bias Circuit |
| 07/23/2009 | US20090184431 Liquid epoxy resin composition and flip chip semiconductor device |
| 07/23/2009 | US20090184430 Semiconductor device and semiconductor module including semiconductor devices |
| 07/23/2009 | US20090184429 Integrated Circuit Comprising Conductive Lines and Contact Structures and Method of Manufacturing an Integrated Circuit |
| 07/23/2009 | US20090184428 Semiconductor device and method for manufacturing the same |
| 07/23/2009 | US20090184427 Flash memory device with word lines of uniform width and method for manufacturing thereof |
| 07/23/2009 | US20090184426 Contact plugs of semiconductor device and method for forming the same |
| 07/23/2009 | US20090184425 Conductive line structure and the method of forming the same |
| 07/23/2009 | US20090184424 Semiconductor device and a method of manufacturing the same |
| 07/23/2009 | US20090184423 Low resistance and inductance backside through vias and methods of fabricating same |
| 07/23/2009 | US20090184422 Method for forming metal line of semiconductor device without production of sidewall oxide in metal line forming region |
| 07/23/2009 | US20090184421 Semiconductor device with high reliability and manufacturing method thereof |
| 07/23/2009 | US20090184420 Post bump and method of forming the same |
| 07/23/2009 | US20090184419 Flip Chip Interconnect Solder Mask |
| 07/23/2009 | US20090184418 Wiring substrate, tape package having the same, and display device having the same |
| 07/23/2009 | US20090184417 Polyol photosensitizers, carrier gas uv laser ablation sensitizers, and other additives and methods for making and using same |
| 07/23/2009 | US20090184416 MCM packages |
| 07/23/2009 | US20090184415 Manufacturing method of a semiconductor device |
| 07/23/2009 | US20090184414 Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the same |
| 07/23/2009 | US20090184413 Insulative wiring board, semiconductor package using the same, and method for producing the insulative wiring board |
| 07/23/2009 | US20090184412 Resin-seal type semiconductor device |
| 07/23/2009 | US20090184411 Semiconductor packages and methods of manufacturing the same |
| 07/23/2009 | US20090184410 Semiconductor package apparatus having redistribution layer |
| 07/23/2009 | US20090184409 Semiconductor device including semiconductor chips with different thickness |
| 07/23/2009 | US20090184408 Semiconductor device for fingerprint recognition |
| 07/23/2009 | US20090184407 Method to recover underfilled modules by selective removal of discrete components |
| 07/23/2009 | US20090184406 Semiconductor package having insulated metal substrate and method of fabricating the same |
| 07/23/2009 | US20090184405 Package structure |
| 07/23/2009 | US20090184404 Electromagnetic shilding structure and manufacture method for multi-chip package module |
| 07/23/2009 | US20090184403 Method of forming a semiconductor package and structure thereof |
| 07/23/2009 | US20090184402 Method of fabricating a shallow trench isolation structure including forming a second liner covering the corner of the trench and first liner. |
| 07/23/2009 | US20090184401 Semiconductor device and method for manufacturing the same |
| 07/23/2009 | US20090184400 Via gouging methods and related semiconductor structure |
| 07/23/2009 | US20090184394 High performance system-on-chip inductor using post passivation process |
| 07/23/2009 | US20090184391 Semiconductor devices having fuses and methods of forming the same |
| 07/23/2009 | US20090184390 Semiconductor device and method of manufacturing the same |
| 07/23/2009 | US20090184353 Semiconductor device and method of manufacturing the same |
| 07/23/2009 | US20090184345 Contacts for cmos imagers and method of formation |
| 07/23/2009 | US20090184335 Optical semiconductor device |
| 07/23/2009 | DE202009006542U1 Elektrisches Kontaktierungselement für photovoltaische Zellen Electrical contacting element for photovoltaic cells |
| 07/23/2009 | DE10324190B4 Wärmetauscher Heat exchanger |
| 07/23/2009 | DE10301510B4 Verfahren zur Herstellung eines Verkleinerten Chippakets Process for the preparation of a reduced chip package |
| 07/23/2009 | DE10297047B4 Lötfreie Leiterplatten-Baugruppe Solderless PCB assembly |
| 07/23/2009 | DE10223763B4 Halbleitervorrichtung Semiconductor device |
| 07/23/2009 | DE102008063724A1 Busbar assembly for use with vehicular inverter module, has several continuous channels through which dielectric coolant liquid flows for absorbing and dissipating heat generated by power semiconductor modules mounted on busbar |
| 07/23/2009 | DE102008063196A1 Halbleiter-Gehäuse und Verfahren zur Befestigung von Halbleiterchips an Substraten Semiconductor package and method for attaching semiconductor chips to substrates |
| 07/23/2009 | DE102008062498A1 Elektronikbauelement und Verfahren Electronic device and method |
| 07/23/2009 | DE102008046380A1 Halbleitervorrichtung und Herstellungsverfahren derselben A semiconductor device and manufacturing method thereof |
| 07/23/2009 | DE102008044381A1 Lötkontakte und Verfahren zur Herstellung solcher Lötkontakte Solder pads and methods of making such solder |
| 07/23/2009 | DE102008034448A1 Alignment accuracy determining method for use during connection of microelectromechanical system wafers, involves deriving alignment accuracy from measured electrical characteristics of lower contact-structure and upper contact structure |
| 07/23/2009 | DE102008005529A1 Kühlkörper und Verfahren zur Herstellung eines Kühlkörpers Heat sink and method for manufacturing a heat sink |
| 07/23/2009 | DE102008005353A1 Vorrichtung und Verfahren zur Kühlung eines elektrischen Bauelements für ein Fahrzeug Apparatus and method for cooling an electrical component for a vehicle |
| 07/23/2009 | DE102008004961A1 Cooling body for electrical switch of e.g. grinder, has area resting and/or assigned to heat source, and another area turned to cooling agent, where material for former area has heat conductivity higher than material for latter area |
| 07/23/2009 | DE102008004053A1 Spitzenlast-Kühlung von elektronischen Bauteilen durch phasenwechselnde Materialien Peak load cooling of electronic components by phase-change materials |
| 07/23/2009 | DE102005047106B4 Leistungshalbleitermodul und Verfahren zur Herstellung The power semiconductor module and process for preparing |
| 07/22/2009 | EP2081419A2 Printed circuit board and method of manufacturing printed circuit board |
| 07/22/2009 | EP2081225A2 Isolated thermal interface |
| 07/22/2009 | EP2081221A1 A manufacturing method for a radiator and a structure thereof |
| 07/22/2009 | EP2081220A2 Method for manufacturing heat sink having heat-dissipating fins and structure of the same |
| 07/22/2009 | EP2081179A2 Organic light emitting display |
| 07/22/2009 | EP2080978A2 Liquid-cooled-type cooling device |
| 07/22/2009 | EP2080734A1 Method for manufacturing air cavities in microstructures |
| 07/22/2009 | EP2080223A1 Lighting device package |
| 07/22/2009 | EP2079475A2 A sealed photovoltaic apparatus |
| 07/22/2009 | EP1955372A4 Nitrogen based implants for defect reduction in strained silicon |
| 07/22/2009 | EP1911090A4 Dual function composite system and method of making same |
| 07/22/2009 | EP1706900A4 A method for manufacturing a superjunction device with wide mesas |
| 07/22/2009 | EP1528593B1 Semiconductor device and method for manufacturing the same |