| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/30/2009 | US20090189291 Multi-chip module |
| 07/30/2009 | US20090189290 Clustered stacked vias for reliable electronic substrates |
| 07/30/2009 | US20090189289 Embedded constrainer discs for reliable stacked vias in electronic substrates |
| 07/30/2009 | US20090189288 Angled flying lead wire bonding process |
| 07/30/2009 | US20090189287 Noble metal cap for interconnect structures |
| 07/30/2009 | US20090189286 Fine pitch solder bump structure with built-in stress buffer |
| 07/30/2009 | US20090189285 On chip thermocouple and/or power supply and a design structure for same |
| 07/30/2009 | US20090189284 Semiconductor device having a reductant layer and manufacturing method thereof |
| 07/30/2009 | US20090189283 Aluminum metal line of a semiconductor device and method of fabricating the same |
| 07/30/2009 | US20090189282 Semiconductor device |
| 07/30/2009 | US20090189281 semiconductor package and a method for manufacturing the same |
| 07/30/2009 | US20090189280 Method of Forming a Non Volatile Memory Device |
| 07/30/2009 | US20090189279 Methods and systems for packaging integrated circuits |
| 07/30/2009 | US20090189278 Ultrasonic measuring method, electronic component manufacturing method, and semiconductor package |
| 07/30/2009 | US20090189277 Photosensitive compositions based on polycyclic polymers for low stress, high temperature films |
| 07/30/2009 | US20090189276 Semiconductor chip and semiconductor device |
| 07/30/2009 | US20090189275 Integrated circuit package system with wafer scale heat slug |
| 07/30/2009 | US20090189274 Tape wiring substrate and tape package using the same |
| 07/30/2009 | US20090189273 Multiphase synchronous buck converter |
| 07/30/2009 | US20090189272 Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the Same |
| 07/30/2009 | US20090189271 Printed circuit board, semiconductor package, card apparatus, and system |
| 07/30/2009 | US20090189270 Manufacturing process and structure for embedded semiconductor device |
| 07/30/2009 | US20090189269 Electronic Circuit Package |
| 07/30/2009 | US20090189268 Method of manufacturing semiconductor device |
| 07/30/2009 | US20090189267 Semiconductor chip with chip selection structure and stacked semiconductor package having the same |
| 07/30/2009 | US20090189266 Semiconductor package with stacked dice for a buck converter |
| 07/30/2009 | US20090189265 Method and apparatus for making semiconductor devices including a foil |
| 07/30/2009 | US20090189264 Semiconductor device and manufacturing method of the same |
| 07/30/2009 | US20090189263 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device |
| 07/30/2009 | US20090189262 Multiphase synchronous buck converter |
| 07/30/2009 | US20090189261 Ultra-Thin Semiconductor Package |
| 07/30/2009 | US20090189260 Semiconductor device |
| 07/30/2009 | US20090189259 Electronic device and method of manufacturing |
| 07/30/2009 | US20090189258 Method of integrated circuit fabrication |
| 07/30/2009 | US20090189256 Manufacturing process of semiconductor device and semiconductor device |
| 07/30/2009 | US20090189255 Wafer having heat dissipation structure and method of fabricating the same |
| 07/30/2009 | US20090189248 Semiconductor device and method of manufacturing the same |
| 07/30/2009 | US20090189246 Method of forming trench isolation structures and semiconductor device produced thereby |
| 07/30/2009 | US20090189245 Semiconductor device with seal ring |
| 07/30/2009 | US20090189244 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
| 07/30/2009 | US20090189241 Using floating fill metal to reduce power use for proximity communication |
| 07/30/2009 | US20090189240 Semiconductor device with at least one field plate |
| 07/30/2009 | US20090189238 Packaged microelectronic imagers and methods of packaging microelectronic imagers |
| 07/30/2009 | US20090189230 Method and system for packaging mems devices with incorporated getter |
| 07/30/2009 | US20090189229 Semiconductor devices and methods of fabricating the same |
| 07/30/2009 | US20090189196 Programmable nanotube interconnect |
| 07/30/2009 | US20090189182 Integrated RF ESD Protection for High Frequency Circuits |
| 07/30/2009 | US20090189180 Silicone resin composition |
| 07/30/2009 | US20090189178 Leadframe having a heat sink supporting part, fabricating method of a light emitting diode package using the same, and light emitting diode package fabricated by the method |
| 07/30/2009 | US20090189158 Semiconductor device |
| 07/30/2009 | US20090189157 Device for measuring or inspecting substrates of the semiconductor industry |
| 07/30/2009 | US20090188701 Inorganic powder, resin composition filled with the powder and use thereof |
| 07/30/2009 | DE19743737B4 Verfahren zur Bildung einer Drahtbondelektrode auf einer Dickschichtleiterplatte A method for forming a wire bonding electrode on a thick layer printed circuit board |
| 07/30/2009 | DE10345377B4 Halbleitermodul und Verfahren zur Herstellung eines Halbleitermoduls Semiconductor module and method for manufacturing a semiconductor module |
| 07/30/2009 | DE10327515B4 Verfahren zum Herstellen eines substratbasierten IC-Packages A method for producing a substrate-based IC packages |
| 07/30/2009 | DE102009006152A1 Elektronikbauelement und Verfahren zur Herstellung des Elektronikbauelements An electronics device and method for manufacturing the electronic component |
| 07/30/2009 | DE102008063806A1 Temperaturerfassung für ein Halbleiterbauelement Temperature detection for a semiconductor device |
| 07/30/2009 | DE102008063741A1 Bildsensor und Verfahren zu dessen Herstellung Image sensor and method for its production |
| 07/30/2009 | DE102008061165A1 Verfahren und Vorrichtung zum Herstellen von Halbleiterbauelementen mit einer Folie Method and apparatus for producing semiconductor devices with a foil |
| 07/30/2009 | DE102008028299B3 System support for e.g. micro-electro-mechanical system component, has flexible support with upper side, and conductor paths guided to connecting contacts on upper side of components, which is turned away from flexible support |
| 07/30/2009 | DE102008020327A1 Component or bond connection unit fixing method for use in circuit arrangement e.g. semiconductor arrangement, involves applying force on contact surface, such that component or connection units is fixed to surface with reaction forces |
| 07/30/2009 | DE102008005818A1 Semiconductor unit e.g. LED, has semiconductor elements heated in operation and arranged in interior of housing, and free surface of semiconductor elements staying in contact with cooling media that is highly volatile fluid |
| 07/30/2009 | DE102008005748A1 Power electronic module comprises cooling body which has number of cooling channels for cooling medium, where ceramic layer is provided on lower side and upper side of cooling body |
| 07/30/2009 | DE102008005747A1 Power electronics module for use with radiator box of vehicle in automotive engineering, has plates connected among each other and sink connected with layers, where one layer comprises component based on low-temperature connection process |
| 07/30/2009 | DE102008004927A1 Integrierte Schaltung mit Leiterbahnen und Kontaktstrukturen sowie Verfahren zur Herstellung einer derartigen integrierten Schaltung An integrated circuit including conductor tracks and contact structures and methods for producing such an integrated circuit |
| 07/30/2009 | DE102007061599A1 Carrier structure for electronic conducting component, has radiator box with radiator box upper side, and electrically isolating carrier layer is provided with carrier layer lower surface |
| 07/30/2009 | DE102007061598A1 Carrier structure for electronic power component e.g. semiconductor component such as diode, has fixed connection existing between base plate and carrier layer, where connection is frictional, form-fitting or material closure connection |
| 07/30/2009 | DE102007004867B4 Verfahren zum Erhöhen der Zuverlässigkeit von kupferbasierten Metallisierungsstrukturen in einem Mikrostrukturbauelement durch Anwenden von Aluminiumnitrid A method for increasing the reliability of copper-based metallization in a microstructure device by applying aluminum nitride |
| 07/30/2009 | DE102006052619B4 Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist Circuit arrangement having a power module that is combined with a printed circuit board |
| 07/30/2009 | DE102005019574B4 Kontaktierungsanordnung für ein Halbleiterbauelement Contacting arrangement for a semiconductor component |
| 07/30/2009 | DE102004063149B4 Verfahren zur Herstellung eines Halbleiter-Bauelements A process for producing a semiconductor device |
| 07/30/2009 | DE102004061908B4 Verfahren zum Herstellen einer Schaltungsanordnung auf einem Substrat A method for manufacturing a circuit arrangement on a substrate |
| 07/30/2009 | DE102004040465B4 Gehäuseanordnung für elektronische Bauelemente und Verfahren zum Verpacken elektronischer Bauelemente Housing assembly for electronic devices and methods for packaging electronic components |
| 07/30/2009 | DE102004036971B4 Technik zur Bewertung lokaler elektrischer Eigenschaften in Halbleiterbauelementen Technique for assessing local electrical properties in semiconductor devices |
| 07/30/2009 | DE102004033357B4 Schaltung und Verfahren zur Temperatursensierung Circuit and method for Temperatursensierung |
| 07/30/2009 | DE10129006B4 Elektronische Baugruppe Electronic assembly |
| 07/30/2009 | DE10119474B4 Halbleitergerät mit nivelliert ausgebildeten Strompfadlängen Semiconductor device formed leveled current path lengths |
| 07/30/2009 | CA2711266A1 Method for reversibly mounting a device wafer to a carrier substrate |
| 07/30/2009 | CA2700756A1 Device and method for cooling an electric component for a vehicle |
| 07/29/2009 | EP2083443A1 Carrier board structure with embedded semiconductor chip and fabrication method thereof |
| 07/29/2009 | EP2083442A1 Semiconductor device and fabrication method of the semiconductor device |
| 07/29/2009 | EP2083344A1 Memory card |
| 07/29/2009 | EP2082424A1 Encapsulated metal resistor |
| 07/29/2009 | EP2082423A1 Board on chip package and process for making same |
| 07/29/2009 | EP2082422A2 Formation of through-wafer electrical interconnections and other structures using an etch stop layer |
| 07/29/2009 | EP2013907A4 Package-on-package secure module having bga mesh cap |
| 07/29/2009 | EP1614326B1 High frequency heating apparatus |
| 07/29/2009 | CN201282141Y Diode with specs chromatic circle identification |
| 07/29/2009 | CN201282140Y High-current snowslip type diode |
| 07/29/2009 | CN201282139Y High-current diode support |
| 07/29/2009 | CN201282138Y 电子封装结构 Electronic packaging structure |
| 07/29/2009 | CN101496168A Substrate and process for semiconductor flip chip package |
| 07/29/2009 | CN101496167A Semiconductor devices including voltage switchable materials for over-voltage protection |
| 07/29/2009 | CN101496166A Semiconductor interconnect having adjacent reservoir for bonding and method for formation |
| 07/29/2009 | CN101496165A Electronic component storing package and electronic device |
| 07/29/2009 | CN101496164A Electronic chip contact structure |
| 07/29/2009 | CN101496163A Thermally conductive thermoplastics for die-level packaging of microelectronics |
| 07/29/2009 | CN101496162A Wafer level package including a device wafer integrated with a passive component |
| 07/29/2009 | CN101496161A Sip module with a single sided lid |
| 07/29/2009 | CN101496160A Electronic assembly having graded wire bonding |