| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/29/2009 | CN101494216A Structure for testing reliability analysis of integrated circuit inner layer dielectric |
| 07/29/2009 | CN101494215A Semiconductor device with high reliability and manufacturing method thereof |
| 07/29/2009 | CN101494214A Memory card |
| 07/29/2009 | CN101494213A Substrate for mounting device, semiconductor module and method for producing the same, and portable apparatus |
| 07/29/2009 | CN101494212A Bonding pad structure and semiconductor device including the bonding pad structure |
| 07/29/2009 | CN101494211A Semiconductor device and circuit board |
| 07/29/2009 | CN101494210A Conductor frame and encapsulation structure |
| 07/29/2009 | CN101494209A Conductor frame and chip encapsulation body |
| 07/29/2009 | CN101494208A Semiconductor component package body |
| 07/29/2009 | CN101494207A Semiconductor chip and stacked semiconductor package having the same |
| 07/29/2009 | CN101494206A Thyristor group valve acaleph matching tube and manufacturing technology |
| 07/29/2009 | CN101494205A Integrated circuit package body and method of manufacturing the same |
| 07/29/2009 | CN101494204A Semiconductor device and method of manufacturing the same |
| 07/29/2009 | CN101494203A Chip capable of gain in strength and method of manufacturing the same |
| 07/29/2009 | CN100521887C Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly |
| 07/29/2009 | CN100521869C Nanoparticle filled underfill |
| 07/29/2009 | CN100521868C Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 07/29/2009 | CN100521470C Surface mounted power supply circuit apparatus and method for manufacturing the same |
| 07/29/2009 | CN100521385C Contact structure of card connector |
| 07/29/2009 | CN100521256C Electronic part and method of producing the same |
| 07/29/2009 | CN100521215C Semiconductor device and its manufacturing method |
| 07/29/2009 | CN100521205C Integrated circuit device |
| 07/29/2009 | CN100521196C Semiconductor device |
| 07/29/2009 | CN100521191C Semiconductor device, method of authentifying and system |
| 07/29/2009 | CN100521190C Pixel structure having concave-convex line structures and method for making the same |
| 07/29/2009 | CN100521189C Thin film transistor array panel and method for manufacturing the same |
| 07/29/2009 | CN100521188C Copper metallized barrier layer structure of integrated circuit or semiconductor device and its preparing method |
| 07/29/2009 | CN100521187C Conductor track arrangement and associated production method |
| 07/29/2009 | CN100521186C Semiconductor device |
| 07/29/2009 | CN100521185C Interconnection structures for semicondcutor devices and methods of forming the same |
| 07/29/2009 | CN100521184C Semiconductor device packaging substrate and semiconductor device packaging structure |
| 07/29/2009 | CN100521183C Chip carrier with signal collecting film and manufacturing method thereof |
| 07/29/2009 | CN100521182C Lead frame encapsulation structure with the high-density pin array |
| 07/29/2009 | CN100521181C Method of electrically connecting connection points of elements to related connection points of circuit |
| 07/29/2009 | CN100521180C Semiconductor packaging structure with intensification layer and encapsulation method thereof |
| 07/29/2009 | CN100521179C Stackable semi-conductor packaging structure |
| 07/29/2009 | CN100521178C Board having electronic parts mounted by using under-fill material and method for producing the same |
| 07/29/2009 | CN100521177C Optical device cavity structure, optical device, and method for manufacturing an optical device cavity structure |
| 07/29/2009 | CN100521176C 半导体芯片及半导体装置 The semiconductor chip and semiconductor device |
| 07/29/2009 | CN100521175C 半导体装置 Semiconductor device |
| 07/29/2009 | CN100521174C Semiconductor device |
| 07/29/2009 | CN100521173C Semiconductor chip having minuteness space projection and its projection |
| 07/29/2009 | CN100521172C Semiconductor device and method of manufacturing the same |
| 07/29/2009 | CN100521171C Package bonding structure of element |
| 07/29/2009 | CN100521170C Circuit component |
| 07/29/2009 | CN100521169C Stacked electronic component, electronic device and method for manufacturing stacked electronic component |
| 07/29/2009 | CN100521168C Intermediate substrate |
| 07/29/2009 | CN100521148C Method for designing semiconductor device and method for evaluating reliability thereof |
| 07/29/2009 | CN100521147C Electrode structure for use in an integrated circuit |
| 07/29/2009 | CN100521130C Method for forming a flip chip on leadframe semiconductor package |
| 07/29/2009 | CN100521125C aMethod of manufacturing semiconductor device |
| 07/29/2009 | CN100520538C Encapsulated display devices |
| 07/29/2009 | CN100520411C Semiconductor acceleration sensor device and method for manufacturing the same |
| 07/29/2009 | CN100519650C Encapsulating epoxy resin composition, and electronic parts device using the same |
| 07/29/2009 | CN100519623C Fluorinated aromatic polymer and use thereof |
| 07/29/2009 | CN100519619C 环氧树脂组合物及半导体装置 Epoxy resin composition and semiconductor device |
| 07/29/2009 | CN100519046C Method of joining metallic members and radiation member |
| 07/29/2009 | CN100519045C Method of joining metallic members and process for manufacturing radiation member |
| 07/28/2009 | US7567598 Semiconductor laser equipment |
| 07/28/2009 | US7567597 Semiconductor device with a cooling element |
| 07/28/2009 | US7567235 Self-aligning optical sensor package |
| 07/28/2009 | US7566978 Semiconductor device and programming method |
| 07/28/2009 | US7566977 Semiconductor device and method for manufacturing the same |
| 07/28/2009 | US7566976 Semiconductor device and method for fabricating the same |
| 07/28/2009 | US7566975 Semiconductor device and method for manufacturing the same |
| 07/28/2009 | US7566974 Doped polysilicon via connecting polysilicon layers |
| 07/28/2009 | US7566973 Semiconductor device and method of manufacturing the same |
| 07/28/2009 | US7566972 Semiconductor device and method for manufacturing the semiconductor device |
| 07/28/2009 | US7566970 Stacked bump structure and manufacturing method thereof |
| 07/28/2009 | US7566969 Semiconductor device with improved arrangement of a through-hole in a wiring substrate |
| 07/28/2009 | US7566968 Biosensor with smart card configuration |
| 07/28/2009 | US7566967 Semiconductor package structure for vertical mount and method |
| 07/28/2009 | US7566966 Integrated circuit package-on-package system with anti-mold flash feature |
| 07/28/2009 | US7566965 Semiconductor module |
| 07/28/2009 | US7566964 Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures |
| 07/28/2009 | US7566963 Stacked assembly of semiconductor packages with fastening lead-cut ends of leadframe |
| 07/28/2009 | US7566962 Semiconductor package structure and method for manufacturing the same |
| 07/28/2009 | US7566961 Multi-stacked package and method of manufacturing the same |
| 07/28/2009 | US7566960 Interposing structure |
| 07/28/2009 | US7566959 Planar array contact memory cards |
| 07/28/2009 | US7566958 Multi-chip package for reducing parasitic load of pin |
| 07/28/2009 | US7566957 Support device with discrete getter material microelectronic devices |
| 07/28/2009 | US7566956 Semiconductor composite device and method of manufacturing the same |
| 07/28/2009 | US7566955 High-frequency chip packages |
| 07/28/2009 | US7566954 Bonding configurations for lead-frame-based and substrate-based semiconductor packages |
| 07/28/2009 | US7566953 Leadframe designs for plastic overmold packages |
| 07/28/2009 | US7566952 On-chip circuit pad structure |
| 07/28/2009 | US7566950 Flexible pixel array substrate |
| 07/28/2009 | US7566946 Precision passive circuit structure |
| 07/28/2009 | US7566935 ESD structure without ballasting resistors |
| 07/28/2009 | US7566906 Thin film transistor array panel and manufacturing method thereof |
| 07/28/2009 | US7566836 Potting shell |
| 07/28/2009 | US7566834 Wiring board and semiconductor package using the same |
| 07/28/2009 | US7566656 Method and apparatus for providing void structures |
| 07/28/2009 | US7566649 Compressible films surrounding solder connectors |
| 07/28/2009 | US7566638 Method of dicing a semiconductor device into plural chips |
| 07/28/2009 | US7566636 Method of scribing stuck mother substrate and method of dividing stuck mother substrate |
| 07/28/2009 | US7566590 Low voltage drop and high thermal performance ball grid array package |
| 07/28/2009 | US7566589 Apparatus and method for signal bus line layout in semiconductor device |
| 07/28/2009 | US7566588 Semiconductor device with a resin-sealed optical semiconductor element |