| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/05/2009 | CN100523310C Metal plating structure and method for production thereof |
| 08/05/2009 | CN100523293C Method of forming film, film forming apparatus |
| 08/05/2009 | CN100523287C Film-forming apparatus and film-forming method |
| 08/05/2009 | CN100523089C Organopolysiloxane composition and electronic part encapsulated therewith |
| 08/05/2009 | CN100523046C Encapsulation epoxy resin material and electronic component |
| 08/04/2009 | US7570297 Method for manufacturing camera module where a solid state imaging device is an assembly reference plane of an optical unit |
| 08/04/2009 | US7569941 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
| 08/04/2009 | US7569940 Method and device for connecting chips |
| 08/04/2009 | US7569939 Self alignment features for an electronic assembly |
| 08/04/2009 | US7569938 Interconnections for integrated circuits |
| 08/04/2009 | US7569937 Technique for forming a copper-based contact layer without a terminal metal |
| 08/04/2009 | US7569936 Semiconductor device and method of manufacturing the same |
| 08/04/2009 | US7569934 Copper interconnect |
| 08/04/2009 | US7569933 Housing for accommodating microwave devices having an insulating cup member |
| 08/04/2009 | US7569932 Rotary chip attach |
| 08/04/2009 | US7569931 Cooling semiconductor device and manufacturing method thereof |
| 08/04/2009 | US7569930 Semiconductor module and radiator plate |
| 08/04/2009 | US7569929 Semiconductor device |
| 08/04/2009 | US7569928 Assembly structure of electronic element and heat sink |
| 08/04/2009 | US7569927 RF power transistor package |
| 08/04/2009 | US7569926 Wafer level hermetic bond using metal alloy with raised feature |
| 08/04/2009 | US7569925 Module with built-in component |
| 08/04/2009 | US7569924 Semiconductor device and manufacturing method thereof |
| 08/04/2009 | US7569923 Recyclying faulty multi-die packages |
| 08/04/2009 | US7569922 Semiconductor device having a bonding wire and method for manufacturing the same |
| 08/04/2009 | US7569921 Semiconductor device and manufacturing method thereof |
| 08/04/2009 | US7569920 Electronic component having at least one vertical semiconductor power transistor |
| 08/04/2009 | US7569919 Multi-chip package for reducing test time |
| 08/04/2009 | US7569918 Semiconductor package-on-package system including integrated passive components |
| 08/04/2009 | US7569917 Semiconductor device |
| 08/04/2009 | US7569915 Shielding arrangement to protect a circuit from stray magnetic fields |
| 08/04/2009 | US7569907 Hybrid chip fuse assembly having wire leads and fabrication method therefor |
| 08/04/2009 | US7569890 Manufacturing method of CMOS type semiconductor device, and CMOS type semiconductor device |
| 08/04/2009 | US7569887 C-shaped dummy gate electrode semiconductor device and method of manufacturing the same |
| 08/04/2009 | US7569853 Test pads on leads unconnected with die pads |
| 08/04/2009 | US7569847 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
| 08/04/2009 | US7569495 Semiconductor devices and methods of manufacturing the same |
| 08/04/2009 | US7569486 Spin on glass (SOG) etch improvement method |
| 08/04/2009 | US7569476 Semiconductor integrated circuit device and a method of manufacturing the same |
| 08/04/2009 | US7569473 Methods of forming semiconductor assemblies |
| 08/04/2009 | US7569468 Method for forming a floating gate memory with polysilicon local interconnects |
| 08/04/2009 | US7569465 Use of voids between elements in semiconductor structures for isolation |
| 08/04/2009 | US7569458 Non-thermally annealed doped semiconductor material and methods related thereto |
| 08/04/2009 | US7569453 Contact structure |
| 08/04/2009 | US7569428 Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same |
| 08/04/2009 | US7569426 Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
| 08/04/2009 | US7569425 Method for manufacturing thermal interface material with carbon nanotubes |
| 08/04/2009 | US7569423 Wafer-level-chip-scale package and method of fabrication |
| 08/04/2009 | US7569409 Isolation structures for CMOS image sensor chip scale packages |
| 08/04/2009 | US7569177 Method of producing ceramic multilayer substrates, and green composite laminate |
| 08/04/2009 | US7569162 electrically conductive passte including Cu powder, a glass frit, and acrylic resin vehicle, wherein an inorganic component such as alumina, which is not sintered at a sintering temperature capable of sintering the ceramic layer in the firing step, disposed on particle surfaces of the metal powder |
| 08/04/2009 | US7568519 Cooling device for heat source |
| 08/04/2009 | US7568390 Semiconductor acceleration sensor device and method for manufacturing the same |
| 07/30/2009 | WO2009094558A2 Method for reversibly mounting a device wafer to a carrier substrate |
| 07/30/2009 | WO2009094537A2 Nanoscale metal paste for interconnect and method of use |
| 07/30/2009 | WO2009094325A1 Method for integrating selective low-temperature ruthenium deposition into copper metallization of a semiconductor device |
| 07/30/2009 | WO2009094276A2 Vertical outgassing channels |
| 07/30/2009 | WO2009093825A2 Semiconductor package and fabricating method thereof |
| 07/30/2009 | WO2009093623A1 Semiconductor device and method of manufacturing semiconductor device |
| 07/30/2009 | WO2009093618A1 Corrugated-fin type radiator |
| 07/30/2009 | WO2009093483A1 Ulsi micro-interconnect member having ruthenium electroplating layer on barrier layer |
| 07/30/2009 | WO2009093248A1 Manufacture of a smart card |
| 07/30/2009 | WO2009092851A1 Method for arranging cooling for a component and a cooling element |
| 07/30/2009 | WO2009092841A1 Self-aligned metal mask assembly for selectively depositing thin films on microelectronic substrates and devices, and method of use |
| 07/30/2009 | WO2009092677A2 Construction of reliable stacked via in electronic substrates - vertical stiffness control method |
| 07/30/2009 | WO2009092480A1 Heat sink and method for producing a heat sink |
| 07/30/2009 | WO2009092410A1 Device and method for cooling an electric component for a vehicle |
| 07/30/2009 | WO2009076494A3 Ceramic substrate having thermal via |
| 07/30/2009 | WO2009056338A3 Heat sink module for electronic components or circuits, and method for the production thereof |
| 07/30/2009 | WO2008155085A8 Electric circuit with vertical contacts |
| 07/30/2009 | WO2008054785A8 Ball grid array resonator |
| 07/30/2009 | US20090193380 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
| 07/30/2009 | US20090193379 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
| 07/30/2009 | US20090193368 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
| 07/30/2009 | US20090192379 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090192378 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090192377 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090192376 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090192375 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090192374 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090192373 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090192372 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090192371 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090192370 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090192369 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090192368 Analyte Monitoring Device and Methods of Use |
| 07/30/2009 | US20090191704 Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane |
| 07/30/2009 | US20090191701 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 07/30/2009 | US20090191666 Method of manufacturing stacked-type semiconductor device |
| 07/30/2009 | US20090190320 Semiconductor device |
| 07/30/2009 | US20090190009 Solid-state image capturing apparatus, mounting method of solid-state image capturing apparatus, manufacturing method of solid-state image capturing apparatus, and electronic information device |
| 07/30/2009 | US20090189678 High temperature operating package and circuit design |
| 07/30/2009 | US20090189300 Sealing Film and a Semiconductor Device Using the Same |
| 07/30/2009 | US20090189299 Method of forming a probe pad layout/design, and related device |
| 07/30/2009 | US20090189298 Bonding pad structure and debug method thereof |
| 07/30/2009 | US20090189297 Semiconductor device |
| 07/30/2009 | US20090189296 Flip chip quad flat non-leaded package structure and manufacturing method thereof and chip package structure |
| 07/30/2009 | US20090189295 Stack chip package structure and manufacturing method thereof |
| 07/30/2009 | US20090189293 Semiconductor device |
| 07/30/2009 | US20090189292 Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module |