Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2009
08/05/2009CN101499452A Printed circuit board and method of manufacturing the same
08/05/2009CN101499451A Printed circuit board, semiconductor package, card apparatus, and system
08/05/2009CN101499450A Semiconductor device and manufacturing method of the same
08/05/2009CN101499449A Semiconductor packaging construction on pin for wafer
08/05/2009CN101499448A 半导体装置及其制造方法 Semiconductor device and manufacturing method
08/05/2009CN101499447A Circuit structure and photomask used for defining the same
08/05/2009CN101499446A Wire frame tablet, packaging structure and LED packaging structure
08/05/2009CN101499445A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/05/2009CN101499444A Cooling type multi-punch semiconductor packaging construction
08/05/2009CN101499443A Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same
08/05/2009CN101499432A Stacked semiconductor device and method
08/05/2009CN101499429A Metal mold for injection molding and semiconductor package formed therewith and method of manufacturing semiconductor package
08/05/2009CN101498434A LED lamp
08/05/2009CN101498433A LED lamp
08/05/2009CN101498432A Heat radiation die set
08/05/2009CN101498428A Illuminating apparatus
08/05/2009CN101497774A Semiconductor chip liquid encapsulation material
08/05/2009CN100525600C Fan device and heat-emitting element cooling apparatus
08/05/2009CN100525599C Module heat dissipating structure and control device using the same
08/05/2009CN100525591C Manufacturing method of laminated substrate, and semiconductor device for module and manufacturing apparatus
08/05/2009CN100525578C Method for increasing a routing density for a circuit board and such a circuit board
08/05/2009CN100525000C Static discharge protection circuit and structure for part charging mode
08/05/2009CN100524864C LED encapsulation structure and its making method
08/05/2009CN100524829C Method and structure for operating memory devices on fringes of control gate
08/05/2009CN100524807C Organic light emitting display device and a method of manufacturing thereof
08/05/2009CN100524806C Organic light-emitting display device and method for fabricating the same
08/05/2009CN100524805C Flat panel display device and method of making the same
08/05/2009CN100524804C Flat panel display device and method of making the same
08/05/2009CN100524798C Organic light emitting display device
08/05/2009CN100524789C Structure of package for semiconductor image pickup device and fabrication method thereof
08/05/2009CN100524788C Solid-state image sensing device
08/05/2009CN100524784C Pixel structure and manufacture method of liquid crystal panel possessing same
08/05/2009CN100524781C Pixel structure of a thin film transistor LCD and its making method
08/05/2009CN100524777C Mask-programmable logic macro
08/05/2009CN100524771C Asymmetric floating grid NAND flash memory
08/05/2009CN100524770C Layout structure of non-volatile memory
08/05/2009CN100524758C SCR antistatic protection structure
08/05/2009CN100524757C Chip for reducing ohm voltage drop and method thereof
08/05/2009CN100524756C Esd protection circuit
08/05/2009CN100524755C Microelectronic structure and method for making same
08/05/2009CN100524754C Pixel structure of display device and pixel structure
08/05/2009CN100524753C Semiconductor device and method for fabricating the same
08/05/2009CN100524752C Semiconductor device and correlation product thereof
08/05/2009CN100524751C Semiconductor device having multiple-layered interconnect
08/05/2009CN100524747C Mounting structure in integrated circuit module
08/05/2009CN100524745C Method for packaging organic light emitting display with frit seal and reinforcing structure
08/05/2009CN100524744C Semiconductor device of laminated chips
08/05/2009CN100524743C Oganic light-emitting display device and method for fabricating the same
08/05/2009CN100524742C Power semiconductor device
08/05/2009CN100524741C Stack packaging structure
08/05/2009CN100524740C Stack type package
08/05/2009CN100524739C Semiconductor device and fabrication method thereof
08/05/2009CN100524738C Multi-chip stacking package structure
08/05/2009CN100524737C Power module, Phase leg, and three-phase inverter
08/05/2009CN100524736C A stacking type wafer packaging structure
08/05/2009CN100524735C Semiconductor device
08/05/2009CN100524734C Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same
08/05/2009CN100524732C Electromagnetic noise suppressor and electromagnetic noise suppressing method
08/05/2009CN100524731C Method and apparatus for precise marking and placement of an object
08/05/2009CN100524730C Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
08/05/2009CN100524729C Semiconductor package security features using thermochromatic inks and three-dimensional identification coding
08/05/2009CN100524728C Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor
08/05/2009CN100524727C Tape carrier type semiconductor device and method of producing the same
08/05/2009CN100524726C Semiconductor structure and its manufacturing method
08/05/2009CN100524725C Semiconductor device and manufacturing method of the same
08/05/2009CN100524724C Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same
08/05/2009CN100524723C Carrier tape
08/05/2009CN100524722C Outer pin-free wire holder packaging structure
08/05/2009CN100524721C Chip packaging structure
08/05/2009CN100524720C Outer down-lead assembly of multimodule spliced long alignment infrared focal plane detector
08/05/2009CN100524719C Array packaging substrate and method for judging cutting mode of packaging array
08/05/2009CN100524718C Structure and making method of the base plate integrating the embedded parts
08/05/2009CN100524717C Chip buried-in modularize structure
08/05/2009CN100524716C Semiconductor device
08/05/2009CN100524715C Semiconductor device and method for manufacturing the same
08/05/2009CN100524714C Semiconductor device
08/05/2009CN100524713C Semiconductor device, method of manufacturing the same, circuit board, and method of manufacturing the same
08/05/2009CN100524712C Wiring patterns formed by selective metal plating
08/05/2009CN100524711C Semiconductor device using etched lead frame and method for manufacturing semiconductor package
08/05/2009CN100524710C Focal plane device with lowered indium pin pad stress
08/05/2009CN100524709C Semiconductor heat-dissipating substrate, and manufacturing method and assembly therefor
08/05/2009CN100524708C Substrate for direct-underground type surface source module and heat exchanger having the substrate
08/05/2009CN100524707C Underfill film for printed wiring assemblies
08/05/2009CN100524706C Semiconductor device manufacturing method
08/05/2009CN100524705C Semiconductor package and manufacturing method thereof
08/05/2009CN100524704C Semiconductor device and method for making the same
08/05/2009CN100524703C Semiconductor device using semiconductor chip
08/05/2009CN100524696C Storage node contact forming method
08/05/2009CN100524680C Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line
08/05/2009CN100524676C Blanking type encapsulation constitution without external pin and manufacturing method thereof
08/05/2009CN100524669C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/05/2009CN100524644C Dummy structures to reduce metal recess in electropolishing process
08/05/2009CN100524636C Pixel electrode, method for forming the same, electrooptical device, and electronic apparatus
08/05/2009CN100524627C Semiconductor structure processing using multiple laser beam spots
08/05/2009CN100524524C Nand type multi-bit charge storage memory array and methods for operating and fabricating the same
08/05/2009CN100524351C Flexible semiconductor device and identification label
08/05/2009CN100524148C Parameter correction circuit and parameter correction method
08/05/2009CN100523932C TCP automatic-exchanging operation method
08/05/2009CN100523898C LSI package provided with interface module and method of mounting the same
08/05/2009CN100523697C Systems for low cost liquid cooling
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