Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2009
08/06/2009DE19736962B4 Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben Arrangement comprising a carrier substrate for power components and a heat sink and method for manufacturing the same
08/06/2009DE10317328B4 Lichtemittierende Dioden umfassende Vorrichtungen Light-emitting diodes comprehensive devices
08/06/2009DE102009004097A1 Halbleiterkühlstruktur Semiconductor cooling structure
08/06/2009DE102008029210A1 Eingangs-/Ausgangs (I/O)-Zwischenspeicher Input / output (I / O) -Zwischenspeicher
08/06/2009DE102008006960A1 Selbstjustierte Kontaktstruktur in einem Halbleiterbauelement Self Tuned contact structure in a semiconductor device
08/06/2009DE102008000215A1 Laser-Beschriftungsvorrichtung Laser marking device
08/06/2009DE102008000174A1 Housing for use with device, particularly motor vehicle drive for receiving waste heat producing equipment, has unit for preventing improper fluid pressure, where housing is filled with fluid, particularly gas
08/06/2009DE102005024430B4 Verfahren zum Beschichten eines Siliziumwafers oder Siliziumchips A method of coating a silicon wafer or silicon chip
08/06/2009DE102005018344B4 Herstellungsverfahren für rekonfigurierbare Verbindung Production method of compound reconfigurable
08/06/2009DE10119502B4 Halbleitergerät mit gleichmäßigen Strompfaden und kleinem Aufbau Semiconductor device with uniform flow paths and small construction
08/06/2009DE10027870B4 Laminierter Kondensator und Montageanordnung Laminated capacitor and mounting arrangement
08/06/2009CA2742128A1 Semiconductor-based large-area flexible electronic devices
08/06/2009CA2712114A1 Conductive inks
08/05/2009EP2086306A1 Temperature control system for an electronic device
08/05/2009EP2086305A2 Heat-dissipating element and heat sink having the same
08/05/2009EP2086300A1 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
08/05/2009EP2086299A1 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
08/05/2009EP2086297A2 Printed circuit board and method of manufacturing the same
08/05/2009EP2086296A2 Printed circuit board and method of manufacturing the same
08/05/2009EP2086295A2 Printed circuit board and method of manufacturing the same
08/05/2009EP2085816A1 Electrode substrate having conductive layers with different properties made of conductive materials with different properties formed on transparent base material
08/05/2009EP2084744A2 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
08/05/2009EP2084743A2 Method of packaging a semiconductor device and a prefabricated connector
08/05/2009EP2084742A1 Method of manufacturing stacked chip packages
08/05/2009EP2084739A2 Flip chip semiconductor package with encapsulant retaining structure and strip
08/05/2009EP2084738A2 Enhanced interconnect structure
08/05/2009EP2084711A2 Electrical fuse and method of making the same
08/05/2009EP2006909A9 Heat dissipating wiring board and method for manufacturing same
08/05/2009EP1972010A4 Substrate and method for mounting silicon device
08/05/2009EP1806036A4 Packaging and manufacturing of an integrated circuit
08/05/2009EP1805798A4 Gate stacks
08/05/2009EP1754011A4 Hotspot spray cooling
08/05/2009EP1743380A4 Split-channel antifuse array architecture
08/05/2009EP1678762A4 Lateral high-voltage junction device
08/05/2009EP1509479B1 Ltcc tape composition
08/05/2009EP1389340A4 Raised on-chip inductor and method of manufacturing same
08/05/2009EP1372368B1 Radiating fin and radiating method using the radiating fin
08/05/2009EP1356520B1 Microelectronic substrate with integrated devices
08/05/2009EP0912999B1 SiC SEMICONDUCTOR DEVICE COMPRISING A pn JUNCTION WITH A VOLTAGE ABSORBING EDGE
08/05/2009EP0757884B1 Method of forming a fluorinated silicon oxide layer using plasma chemical vapor deposition
08/05/2009CN201286211Y Fast temperature equalizing heat transferring apparatus
08/05/2009CN201285766Y Optoelectronic component
08/05/2009CN201285765Y Half-finished product structure for novel integrated circuit semiconductor device mass production
08/05/2009CN201285764Y Semi-finished product structure for integrated circuit semiconductor device mass production
08/05/2009CN201285763Y 集成电路半导体器件 The semiconductor integrated circuit device
08/05/2009CN201285762Y Electronic heat radiation apparatus based on phase change energy accumulation nano capsule
08/05/2009CN201285017Y Cooling device used for LED road lamp
08/05/2009CN201285016Y Lamp and its radiator
08/05/2009CN201285015Y Road lamp radiation fin structure
08/05/2009CN201285014Y Section bar used for LED lamp body
08/05/2009CN201285013Y Lamp cooling device and LED lamp
08/05/2009CN201285012Y LED light projector
08/05/2009CN201285011Y Lamp cooling device
08/05/2009CN201285010Y LED radiating module
08/05/2009CN201285009Y Cooling effect improved LED road lamp
08/05/2009CN201285001Y Wafer-level LED packaging structure used for increasing conductive and cooling area
08/05/2009CN201284968Y Road lamp with cooling function
08/05/2009CN201284959Y LED light source illuminating device
08/05/2009CN201284940Y Energy-saving bulb
08/05/2009CN201284939Y Led灯具 Led lighting
08/05/2009CN101501873A LED device and back panel of liquid crystal display
08/05/2009CN101501846A Deformable integrated circuit device
08/05/2009CN101501845A Transistor formed with self-aligned contacts
08/05/2009CN101501844A Integrated circuit having pads and input/output (I/O) cells
08/05/2009CN101501843A Molded housing used in force fit method
08/05/2009CN101501842A Semiconductor package and manufacturing method thereof
08/05/2009CN101501841A Semiconductor device and method for manufacturing a semiconductor device
08/05/2009CN101501840A Chip attack protection
08/05/2009CN101501830A Method for producing an electric functional layer on a surface of a substrate
08/05/2009CN101501820A Method for forming conductive film, thin film transistor, panel with thin film transistor, and method for manufacturing thin film transistor
08/05/2009CN101500397A Fastening structure for radiator
08/05/2009CN101500396A Fastener and heat radiating device assembly using the same
08/05/2009CN101500395A Stack radiator and its radiation fin
08/05/2009CN101500394A Straight-fin heat expansion reinforced structure minuteness scale composite phase-change heat fetching apparatus
08/05/2009CN101500393A Heat radiating module
08/05/2009CN101500392A Electronic apparatus, heat radiation fan module thereof
08/05/2009CN101500391A Heat radiation assembly, chip comprising the heat radiation assembly and heat radiating method for the chip
08/05/2009CN101500372A Electronic appliance and heat radiation substrate
08/05/2009CN101499508A LED device and its production method
08/05/2009CN101499488A Semiconductor devices and methods of fabricating the same
08/05/2009CN101499486A Organic light emitting display and method for manufacturing the same
08/05/2009CN101499481A Electromagnetic wave detecting element
08/05/2009CN101499480A 半导体芯片及半导体装置 The semiconductor chip and semiconductor device
08/05/2009CN101499478A Liquid crystal display device using thin film transistor
08/05/2009CN101499474A Semiconductor device
08/05/2009CN101499473A Semiconductor device having insulated gate semiconductor element, and insulated gate bipolar transistor
08/05/2009CN101499472A Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus
08/05/2009CN101499471A Anti-electrostatic discharge input resistance and its production method
08/05/2009CN101499470A Power layout of integrated circuit and its design method
08/05/2009CN101499469A Gallium nitride wafer
08/05/2009CN101499465A Thermoelectric module and manufacturing method thereof
08/05/2009CN101499462A Ultra-high-power LED die set light source bracket
08/05/2009CN101499460A Electronic packaging circuit board assembly with strutting member
08/05/2009CN101499459A Packaging structure
08/05/2009CN101499458A Test structure and method for detecting disc trap and corrosion caused by CMP
08/05/2009CN101499457A Semiconductor device and manufacturing method thereof
08/05/2009CN101499456A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/05/2009CN101499455A Power supply structure used for structural special application integrated circuit
08/05/2009CN101499454A Printed circuit board and method of manufacturing the same
08/05/2009CN101499453A Printed circuit board and method of manufacturing the same