Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2009
08/11/2009US7572730 Method of manufacturing wiring substrate, liquid ejection head and image forming apparatus
08/11/2009US7572726 Method of forming a bond pad on an I/C chip and resulting structure
08/11/2009US7572725 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
08/11/2009US7572674 Method for manufacturing semiconductor device
08/11/2009US7572671 Stacked module systems and methods
08/11/2009US7572670 Methods of forming semiconductor packages
08/11/2009US7572650 Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing
08/11/2009US7572395 Organic species that facilitate charge transfer to or from nanostructures
08/11/2009US7572033 Light source module with high heat-dissipation efficiency
08/11/2009US7571759 Stacked type cooler
08/11/2009US7571617 Fan control apparatus and fan control method
08/06/2009WO2009097611A1 Enhancement of optical polarization of nitride light-emitting diodes by wafer off-axis cut
08/06/2009WO2009097304A1 On-chip integrated voltage-controlled variable inductor
08/06/2009WO2009097269A1 Conductive inks
08/06/2009WO2009096961A1 Nanostructures and methods of making the same
08/06/2009WO2009096568A1 Wiring board for high frequency, package for containing electronic component, electronic device and communication apparatus
08/06/2009WO2009096542A1 Connection terminal, package using the same and electronic device
08/06/2009WO2009096436A1 Thermally conductive silicone grease composition
08/06/2009WO2009096401A1 Poly(arylene sulfide) resin composition, process for production thereof, and surface mount electronic component
08/06/2009WO2009096400A1 Poly(arylene sulfide) resin composition, process for production thereof, and surface mount electronic component
08/06/2009WO2009096343A1 Siliceous powder, process for production of the same, and use thereof
08/06/2009WO2009096282A1 Holding member, mounting structure having the holding member mounted in electric circuit board, and electronic part having the holding member
08/06/2009WO2009096259A1 Plasma processing method and plasma processing system
08/06/2009WO2009096254A1 Semiconductor integrated circuit device, structure for mounting semiconductor integrated circuit device and method for manufacturing semiconductor integrated circuit device
08/06/2009WO2009096251A1 Method of aftertreatment of amorphous hydrocarbon film and method for manufacturing electronic device by using the aftertreatment method
08/06/2009WO2009096243A1 Electronic component and method of mounting the same
08/06/2009WO2009096241A1 Method for manufacturing electronic member, and electronic member
08/06/2009WO2009096240A1 Semiconductor chip package and manufacturing method thereof
08/06/2009WO2009096233A1 Crimp-type high power thyristor module
08/06/2009WO2009096203A1 Semiconductor device
08/06/2009WO2009096137A1 Driver module structure
08/06/2009WO2009095486A2 Semiconductor package
08/06/2009WO2009094829A1 A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly
08/06/2009WO2009060320A3 Method for integrating selective ruthenium deposition into manufacturing of a semiconductior device
08/06/2009WO2009060219A3 Ultra high thermal performance packaging for optoelectronics devices
08/06/2009WO2008117324A3 Thermoelectric heat pump with a mounting and heat dissipating device for electronic components of a control electronic circuit board
08/06/2009US20090198175 Analyte Monitoring Device and Methods of Use
08/06/2009US20090198116 Analyte Monitoring Device and Methods of Use
08/06/2009US20090198115 Analyte Monitoring Device and Methods of Use
08/06/2009US20090197393 Method for dividing semiconductor wafer and manufacturing method for semiconductor devices
08/06/2009US20090196085 Sram memory cell protected against current or voltage spikes
08/06/2009US20090196010 Device mounting board, and semiconductor module and manufacturing method therefor
08/06/2009US20090196009 Semiconductor module, wiring board , and wiring method
08/06/2009US20090195990 Heat sink
08/06/2009US20090195948 Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections
08/06/2009US20090195325 Differential internally matched wire-bond interface
08/06/2009US20090195296 Method for Recovering an On-State Forward Voltage and, Shrinking Stacking Faults in Bipolar Semiconductor Devices, and the Bipolar Semiconductor Devices
08/06/2009US20090194890 Integrated Circuit and Memory Module
08/06/2009US20090194889 Bond pad structure
08/06/2009US20090194888 Semiconductor device including wiring and manufacturing method thereof
08/06/2009US20090194887 Embedded die package on package (pop) with pre-molded leadframe
08/06/2009US20090194886 Pass through via technology for use during teh manufacture of a semiconductor device
08/06/2009US20090194885 Semiconductor device having wiring line and manufacturing method thereof
08/06/2009US20090194884 Power semiconductor module including a contact element
08/06/2009US20090194883 Data line structure in lead region and manufacturing method thereof
08/06/2009US20090194882 Electronic device
08/06/2009US20090194881 Method for Manufacturing a Wafer Level Package
08/06/2009US20090194880 Wafer level chip scale package and process of manufacture
08/06/2009US20090194879 Semiconductor device and manufacturing method thereof
08/06/2009US20090194878 Semiconductor device and method for manufacturing the same
08/06/2009US20090194877 Semiconductor device having soi structure
08/06/2009US20090194876 INTERCONNECT STRUCTURE AND METHOD FOR Cu/ULTRA LOW k INTEGRATION
08/06/2009US20090194875 HIGH PURITY Cu STRUCTURE FOR INTERCONNECT APPLICATIONS
08/06/2009US20090194874 Semiconductor chip package and method for manufacturing thereof
08/06/2009US20090194873 integrated circuit device and a method of making the integrated circuit device
08/06/2009US20090194872 Depopulating integrated circuit package ball locations to enable improved edge clearance in shipping tray
08/06/2009US20090194871 Semiconductor package and method of attaching semiconductor dies to substrates
08/06/2009US20090194870 Method and Apparatus for Solid State Cooling System
08/06/2009US20090194869 Heat sink package
08/06/2009US20090194868 Panel level methods and systems for packaging integrated circuits with integrated heat sinks
08/06/2009US20090194867 Integrated circuit package system with internal stacking module adhesive
08/06/2009US20090194866 Semiconductor device having wiring line and manufacturing method thereof
08/06/2009US20090194865 Method for manufacturing a semiconductor device, method for detecting a semiconductor substrate and semiconductor chip package
08/06/2009US20090194864 Integrated module for data processing system
08/06/2009US20090194863 Semiconductor package and method for making the same
08/06/2009US20090194862 Semiconductor module and method of manufacturing the same
08/06/2009US20090194861 Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level
08/06/2009US20090194860 Chip Housing Having Reduced Induced Vibration
08/06/2009US20090194859 Semiconductor package and methods of fabricating the same
08/06/2009US20090194858 Hybrid carrier and a method for making the same
08/06/2009US20090194857 Thin Compact Semiconductor Die Packages Suitable for Smart-Power Modules, Methods of Making the Same, and Systems Using the Same
08/06/2009US20090194856 Molded package assembly
08/06/2009US20090194855 Folded leadframe multiple die package
08/06/2009US20090194854 Semiconductor device package and method of making a semiconductor device package
08/06/2009US20090194853 Shielded stacked integrated circuit packaging system and method of manufacture thereof
08/06/2009US20090194852 Semiconductor device packages with electromagnetic interference shielding
08/06/2009US20090194851 Semiconductor device packages with electromagnetic interference shielding
08/06/2009US20090194850 Crack Stops for Semiconductor Devices
08/06/2009US20090194842 Semiconductor device and method of manufacturing the same
08/06/2009US20090194829 MEMS Packaging Including Integrated Circuit Dies
08/06/2009US20090194817 CMOS Integrated Circuit Devices Having Stressed NMOS and PMOS Channel Regions Therein
08/06/2009US20090194803 Semiconductor device and method for manufacturing the same
08/06/2009US20090194792 Semiconductor device and manufacturing method therefor
08/06/2009US20090194787 Vertical outgassing channels
08/06/2009US20090194771 Semiconductor device and method for manufacturing the same
08/06/2009US20090194768 Vertical system integration
08/06/2009US20090194325 Electronic component package
08/06/2009US20090194151 Semiconductor substrate, method for forming electrode, and method for fabricating solar cell
08/06/2009DE202009006898U1 Erkennungsanordnung einer Solarzelle Recognition arrangement of a solar cell
08/06/2009DE19804568B9 Vorrichtung bestehend aus einem Feldeffekttransistor (FET) in Verbindung mit einer Vorspannungs-Versorgungseinrichtung und einem kapazitiven Element und Verfahren zu deren Ansteuerung Device consisting of a field effect transistor (FET) in conjunction with a bias supply means, and a capacitive element and driving method thereof
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