H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2009
08/12/2009	EP1795548B1 Curable diamantane compound
08/12/2009	CN201290212Y 散热器结构 Radiator structure
08/12/2009	CN201290211Y Buckling frame of radiator
08/12/2009	CN201290207Y Buckling seat of radiator
08/12/2009	CN201289865Y Patch light-emitting diode
08/12/2009	CN201289863Y Surface adhered light-emitting diode stent
08/12/2009	CN201289850Y 像素结构 Pixel structure
08/12/2009	CN201289849Y Pentagon LED die set with lamp cup
08/12/2009	CN201289848Y Square LED die set
08/12/2009	CN201289847Y Device using plastic package material part to replace leads frame material
08/12/2009	CN201289846Y IC chip terminal structure
08/12/2009	CN201289845Y Radiating device of side-buckling type memory
08/12/2009	CN201289844Y Radiating interface die set
08/12/2009	CN201289055Y High power LED lamp heat radiator
08/12/2009	CN201289054Y LED lamp
08/12/2009	CN201289053Y LED lamp with power supply chip heat radiating device
08/12/2009	CN201289052Y Wind tunnel type heat radiation tunnel lighting lamp
08/12/2009	CN201289051Y Heat radiation structure and led lamp with the heat radiation structure
08/12/2009	CN201289048Y LED lamp heat radiation structure
08/12/2009	CN201289047Y LED lamp and heat radiation structure thereof
08/12/2009	CN201289020Y High-capacity LED light source module packaging structure
08/12/2009	CN201289003Y LED lamp with scatter and direct projection effect
08/12/2009	CN201288988Y LED light-supplement electric stroboscopic lamp
08/12/2009	CN201288973Y LED road lamp
08/12/2009	CN201288969Y led灯灯条 led lights light bar
08/12/2009	CN201288953Y Encapsulation structure of ultra high power LED light source
08/12/2009	CN201288950Y LED lamp
08/12/2009	CN101507374A Semiconductor device and multilayer wiring board
08/12/2009	CN101507373A Wiring board, semiconductor device using wiring board and their manufacturing methods
08/12/2009	CN101507360A Method and apparatus for reducing thermal stress in light-emitting elements
08/12/2009	CN101506979A Bulk resistance control technique
08/12/2009	CN101506974A Latch-up free vertical TVS diode array structure using trench isolation
08/12/2009	CN101506973A Testing for correct undercutting of an electrode during an etching step
08/12/2009	CN101506972A An integrated circuit device having at least one bond pad with a selectable plurality of input-output functionalities
08/12/2009	CN101506971A Semiconductor component and assembly with projecting electrode
08/12/2009	CN101506970A Reducing stress between a substrate and a projecting electrode on the substrate
08/12/2009	CN101506969A Semiconductor device member, liquid for forming semiconductor device member, method for manufacturing semiconductor device member, and liquid for forming semiconductor device member using the method,
08/12/2009	CN101506968A Shielding floating gate tunneling element structure
08/12/2009	CN101506965A Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
08/12/2009	CN101506954A Multilayer film for wiring and wiring circuit
08/12/2009	CN101506949A Apparatus and method for processing substrate, method of manufacturing semiconductor device, and recording medium
08/12/2009	CN101506788A Microcontroller with low noise peripheral
08/12/2009	CN101506309A Curable orgnopolysiloxane composition and semiconductor device
08/12/2009	CN101505579A Heat radiation module and support member thereof
08/12/2009	CN101505167A Audio encoding and decoding module for mobile terminal
08/12/2009	CN101505166A Audio encoding and decoding module for mobile terminal
08/12/2009	CN101505165A Audio encoding and decoding module for mobile terminal
08/12/2009	CN101505164A Audio encoding and decoding module for mobile terminal
08/12/2009	CN101504963A Large power heating radiation and lighting integrated tube for LED
08/12/2009	CN101504953A Pressing type automobile rectifying diode enclosed by plastic case
08/12/2009	CN101504949A Resistor converting memory and manufacturing method thereof
08/12/2009	CN101504946A Semiconductor device
08/12/2009	CN101504943A 半导体集成电路 The semiconductor integrated circuit
08/12/2009	CN101504942A Improved SOT encapsulation structure
08/12/2009	CN101504941A Improved SOT encapsulation structure for multi-chip dual basement
08/12/2009	CN101504940A Semico.nductor package, and method of manufacturing semiconductor package
08/12/2009	CN101504939A 半导体器件 Semiconductor devices
08/12/2009	CN101504938A LED encapsulation structure and LED encapsulation method
08/12/2009	CN101504937A Method of manufacturing semiconductor device
08/12/2009	CN101504936A Electric apparatus substrate, image forming control panel and image forming apparatus
08/12/2009	CN101504935A Bond pad structure
08/12/2009	CN101504932A Semiconductor device and manufacturing method
08/12/2009	CN101504919A Encapsulation structure and method for semi-conductor
08/12/2009	CN101504689A Radiator optimizing parameter confirming method and radiator with optimizing parameter
08/12/2009	CN101504676A Method of designing semiconductor integrated circuit device, designing apparatus, and semiconductor integrated circuit device
08/12/2009	CN101504503A Pixel array, LCD panel and optoelectronic device
08/12/2009	CN101504499A Data cable lead wire section structure of TFT-LCD and method for producing the same
08/12/2009	CN101504133A Cooling structure of energy-saving type high power LED illumination device
08/12/2009	CN100527108C Memory system and memory module
08/12/2009	CN100526901C Probe card for probing wafers with raised contact elements
08/12/2009	CN100526360C Resin composition for encapsulating semiconductor chip and semiconductor device therewith
08/12/2009	CN100526078C Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method
08/11/2009	US7573727 Connecting device for contacting a semiconductor component
08/11/2009	US7573142 Alignment key structure in a semiconductor device and method of forming the same
08/11/2009	US7573141 Semiconductor package with a chip on a support plate
08/11/2009	US7573140 Semiconductor device and method for manufacturing the same
08/11/2009	US7573139 Packed system of semiconductor chips having a semiconductor interposer
08/11/2009	US7573138 Stress decoupling structures for flip-chip assembly
08/11/2009	US7573137 Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
08/11/2009	US7573136 Semiconductor device assemblies and packages including multiple semiconductor device components
08/11/2009	US7573135 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
08/11/2009	US7573133 Interconnect structures and methods for their fabrication
08/11/2009	US7573131 Die-up integrated circuit package with grounded stiffener
08/11/2009	US7573130 Crack trapping and arrest in thin film structures
08/11/2009	US7573129 Contrast interposer stacking system and method
08/11/2009	US7573128 Semiconductor module in which a semiconductor package is bonded on a mount substrate
08/11/2009	US7573126 Matching circuits on optoelectronic devices
08/11/2009	US7573125 Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods
08/11/2009	US7573124 Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same
08/11/2009	US7573119 Semiconductor device
08/11/2009	US7573115 Structure and method for enhancing resistance to fracture of bonding pads
08/11/2009	US7573102 ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad
08/11/2009	US7573081 Method to fabricate horizontal air columns underneath metal inductor
08/11/2009	US7573080 Transient suppression semiconductor device
08/11/2009	US7573067 Semiconductor display device
08/11/2009	US7573066 Semiconductor substrate, substrate inspection method, semiconductor device manufacturing method, and inspection apparatus
08/11/2009	US7573065 Semiconductor device evaluation method
08/11/2009	US7573064 Dielectric actuator or sensor structure and method of making it
08/11/2009	US7573006 Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing
08/11/2009	US7572984 Electronic module with dual connectivity

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