Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2009
08/13/2009WO2009099500A2 Electrostatic discharge protection
08/13/2009WO2009099198A1 Copper alloy material for electric and electronic components
08/13/2009WO2009099023A1 Heatsink, cooling module, and coolable electronic board
08/13/2009WO2009099012A1 Semiconductor device and method for manufacturing the same
08/13/2009WO2009098949A1 Cooling device and electric vehicle using the cooling device
08/13/2009WO2009098948A1 Electric vehicle, and method for cooling vehicular dc/dc-converter
08/13/2009WO2009098875A1 Solid-state imaging device and method for manufacturing the same
08/13/2009WO2009098865A1 Heat spreader, and method for manufacturing the same
08/13/2009WO2009098746A1 Semiconductor device and method for manufacturing the same
08/13/2009WO2009098745A1 Semiconductor device and method for manufacturing the same
08/13/2009WO2009098248A2 Doped tin tellurides for thermoelectric applications
08/13/2009WO2009098151A1 Interconnect structure and method for cu/ultra low k integration
08/13/2009WO2009098120A1 Interconnect structure with high leakage resistance
08/13/2009WO2009097941A1 Metal housing part and method for producing the housing part
08/13/2009WO2009097722A1 Semiconductor epitaxial thin film package with vertical structure and the fabricating method thereof
08/13/2009WO2009079179A3 Placement of an integrated circuit
08/13/2009WO2009079114A3 Thermal mechanical flip chip die bonding
08/13/2009WO2009061450A3 Heat transfer composite, associated device and method
08/13/2009WO2009034461A3 Semiconductor device and wire bonding method
08/13/2009WO2009033837A3 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias
08/13/2009US20090203978 Analyte Monitoring Device and Methods of Use
08/13/2009US20090203210 Manufacturing method of semiconductor device
08/13/2009US20090203209 Semiconductor device and method of manufacturing the same
08/13/2009US20090203208 Copper alloy for wiring, semiconductor device, method for forming wiring, and method for manufacturing semiconductor device
08/13/2009US20090203172 Enhanced Die-Up Ball Grid Array and Method for Making the Same
08/13/2009US20090202141 Visual inspection method and visual inspection apparatus
08/13/2009US20090201657 Wiring substrate for use in semiconductor apparatus, method for fabricating the same, and semiconductor apparatus using the same
08/13/2009US20090201505 Tunable Alignment Geometry
08/13/2009US20090201325 Method For The Printing Of Homogeneous Electronic Material With A Multi-Ejector Print Head
08/13/2009US20090201043 Crack Sensors for Semiconductor Devices
08/13/2009US20090200686 Electrical connecting structure and bonding structure
08/13/2009US20090200685 Electronic packaging method and apparatus
08/13/2009US20090200684 Flip chip package with shelf and method of manufactguring there of
08/13/2009US20090200683 Interconnect structures with partially self aligned vias and methods to produce same
08/13/2009US20090200682 Via in via circuit board structure
08/13/2009US20090200681 Forming Compliant Contact Pads For Semiconductor Packages
08/13/2009US20090200680 Semiconductor device
08/13/2009US20090200679 Semiconductor apparatus and method for manufacturing the same
08/13/2009US20090200678 Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same
08/13/2009US20090200677 Semiconductor device
08/13/2009US20090200676 Semiconductor device
08/13/2009US20090200675 Passivated Copper Chip Pads
08/13/2009US20090200674 Structure and method of forming transitional contacts between wide and thin beol wirings
08/13/2009US20090200673 Via bottom contact and method of manufacturing same
08/13/2009US20090200672 Method for manufacturing semiconductor device
08/13/2009US20090200671 Sip semiconductor device and method for manufacturing the same
08/13/2009US20090200670 Semiconductor device and method for manufacturing the same
08/13/2009US20090200669 Enhanced interconnect structure
08/13/2009US20090200668 Interconnect structure with high leakage resistance
08/13/2009US20090200667 Ohmic contact film in semiconductor device
08/13/2009US20090200666 Semiconductor integrated circuit device
08/13/2009US20090200665 Semiconductor device and method of manufacturing the same
08/13/2009US20090200664 Manufacturing method of semiconductor apparatus and semiconductor apparatus
08/13/2009US20090200663 Polymer and solder pillars for connecting chip and carrier
08/13/2009US20090200662 Semiconductor package and method of making the same
08/13/2009US20090200661 Devices with faraday cages and internal flexibility sipes
08/13/2009US20090200660 Heatplates for heatsink attachment for semiconductor chips
08/13/2009US20090200659 Chip Package with Channel Stiffener Frame
08/13/2009US20090200658 Circuit board structure embedded with semiconductor chips
08/13/2009US20090200657 3d smart power module
08/13/2009US20090200656 Semiconductor device and manufacturing method thereof
08/13/2009US20090200655 Method of electrically connecting a microelectronic component
08/13/2009US20090200654 Method of electrically connecting a microelectronic component
08/13/2009US20090200653 Memory modules and systems including the same
08/13/2009US20090200652 Method for stacking chips in a multi-chip package
08/13/2009US20090200650 Integrated circuit package and a method of making
08/13/2009US20090200649 Semiconductor device and manufacturing method of the same
08/13/2009US20090200648 Embedded die system and method
08/13/2009US20090200647 Shielded integrated circuit pad structure
08/13/2009US20090200646 One-Dimensional Arrays of Block Copolymer Cylinders and Applications Thereof
08/13/2009US20090200639 Package substrate with built-in capacitor and manufacturing method thereof
08/13/2009US20090200636 Sub-lithographic dimensioned air gap formation and related structure
08/13/2009US20090200634 Multi-angle rotation for ion implantation of trenches in superjunction devices
08/13/2009US20090200549 Semiconductor device
08/13/2009US20090200548 Guard ring extension to prevent realiability failures
08/13/2009US20090200547 Trench depth monitor for semiconductor manufacturing
08/13/2009US20090200546 Test Structures and Methods
08/13/2009US20090200070 Cu-BASED WIRING MATERIAL AND ELECTRONIC COMPONENT USING THE SAME
08/13/2009DE19903585B4 Halbleitersensor und Halbleitersensorchip und Halbleitersensorgehäuse Semiconductor sensor and semiconductor sensor chip and semiconductor sensor housing
08/13/2009DE112006004034T5 Wärmerohr-Kühlvorrichtung und Verfahren zu ihrer Herstellung Heat-pipe cooling apparatus and process for their preparation
08/13/2009DE102009007612A1 Vorrichtung zur Wärmeabfuhr und Verfahren zu ihrer Herstellung Device for heat dissipation and processes for their preparation
08/13/2009DE102009005650A1 Mehrchipmodul Multi-chip module
08/13/2009DE102009004451A1 Elektronikbauelement und Verfahren zu dessen Herstellung An electronics device and process for its preparation
08/13/2009DE102008061634A1 Integrierter HF-ESD-Schutz für Hochfrequenzschaltungen Integrated RF ESD protection for high frequency circuits
08/13/2009DE102008059848A1 Verbesserung des ESD/EOS-Verhaltens durch Einführung von Defekten Improve ESD / EOS behavior by introducing defects
08/13/2009DE102008008535A1 Einrichtung zur Fixierung eines elektronischen Bausteins wie Halbleiterelement Device for fixing an electronic device such as semiconductor element
08/13/2009DE102007062163B4 Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul Arrangement in pressure contact with a power semiconductor module
08/13/2009DE102005043914B4 Halbleiterbauelement für Bondverbindung und Verfahren zur Herstellung A semiconductor device for bonding and methods for preparing
08/13/2009DE102004026210B4 Vorrichtung zur Erfassung einer physikalischen Größe und Gehäuse für eine Anordnung zur Messung einer physikalischen Größe A device for detecting a physical quantity and housing for a device for measuring a physical quantity
08/13/2009CA2715040A1 Doped tin tellurides for thermoelectric applications
08/12/2009EP2088675A2 Antifuse reroute of dies
08/12/2009EP2088623A1 A multi-component electrical module
08/12/2009EP2088620A1 Semiconductor device
08/12/2009EP2088493A2 Portable computer and method for preheating portable computer before booting
08/12/2009EP2088214A1 Copper alloy plate for electrical and electronic components
08/12/2009EP2087516A2 Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
08/12/2009EP2087515A2 Abrasive powder coatings and methods for inhibiting tin whisker growth
08/12/2009EP2087514A1 Ic socket having heat dissipation function
08/12/2009EP2087508A1 Method of making a contact on a backside of a die
08/12/2009EP1797617A4 Ceramic antenna module and methods of manufacture thereof
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