H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2009
08/19/2009	CN100530637C Stacked structures and methods of forming stacked structures
08/19/2009	CN100530636C Three-dimensional multiple chips packaging module and preparation method
08/19/2009	CN100530635C Stacking method and stacked structure for attaching memory components to associated device
08/19/2009	CN100530633C Methods for fabrication of fuse structure
08/19/2009	CN100530632C 集成电路 IC
08/19/2009	CN100530631C Semiconductor wafer and semiconductor device formed thereby
08/19/2009	CN100530630C Semiconductor device
08/19/2009	CN100530629C Multi-wafer piling base plate and multi-wafer piling encapsulation structure based on this base plate
08/19/2009	CN100530628C Thin film crystal-covering package substrate
08/19/2009	CN100530627C Package, method of manufacturing the same and use thereof
08/19/2009	CN100530626C Tape carrier for TAB and method of manufacturing the same
08/19/2009	CN100530625C Wiring substrate of a semiconductor component comprising external contact pads for external contacts and method for producing the same
08/19/2009	CN100530624C Making procedure for array encapsulation structure of lead frame base ball
08/19/2009	CN100530623C Structure of material of conducting wire rack for photocell
08/19/2009	CN100530622C Semiconductor chip or device of vertical structure, and manufacturing method
08/19/2009	CN100530621C Silicon-controlled rectifier with cooling structure
08/19/2009	CN100530620C 半导体装置 Semiconductor device
08/19/2009	CN100530619C Signal transmission structure
08/19/2009	CN100530618C Processing device on which processing elements having same function are embedded in one chip
08/19/2009	CN100530617C Systems for improved heat exchanger
08/19/2009	CN100530616C Radiating module
08/19/2009	CN100530615C Radiator and its producing method
08/19/2009	CN100530614C Packaging structure
08/19/2009	CN100530613C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/19/2009	CN100530612C Semiconductor device and manufacturing method thereof
08/19/2009	CN100530611C Wireless chip and manufacturing method of the same
08/19/2009	CN100530610C Novel integrated water-cooling thyristor ceramic housing
08/19/2009	CN100530609C Semiconductor device and manufacturing method of the same
08/19/2009	CN100530608C Direct build-up layer on encapsulated die package having moisture barrier structure
08/19/2009	CN100530606C Thin-film transistor array substrates and manufacturing method therefor
08/19/2009	CN100530605C Picture element structure and its manufacturing method
08/19/2009	CN100530582C Semiconductor device and method for making the same
08/19/2009	CN100530581C Method for manufacturing semiconductor module using interconnection structure
08/19/2009	CN100530576C Semiconductor device and its manufacturing method
08/19/2009	CN100530574C Semiconductor module and its manufacturing method
08/19/2009	CN100530565C Semiconductor device and method for manufacturing same
08/19/2009	CN100530553C Method of manufacturing wiring substrate
08/19/2009	CN100530544C Method for preparing high power element in wide band gap material
08/19/2009	CN100530531C A method of fabricating a composite substrate
08/19/2009	CN100530436C Fuse structure
08/19/2009	CN100530377C Semiconductor laser apparatus for clearing influence of tri-light beam return light and its producing method
08/19/2009	CN100530037C Heat radiating module
08/19/2009	CN100529642C Heat pipe and its manufacturing method
08/19/2009	CN100529039C Post-dry etching cleaning liquid composition and process for fabricating semiconductor device
08/19/2009	CN100528568C Functional material fixing method and functional material fixing device
08/18/2009	US7577926 Security-sensitive semiconductor product, particularly a smart-card chip
08/18/2009	US7577223 Multiplexed RF isolator circuit
08/18/2009	US7576988 Electronic device
08/18/2009	US7576961 Electrostatic discharge protection circuit using triple welled silicon controlled rectifier
08/18/2009	US7576619 Integrated circuit arrangement
08/18/2009	US7576441 Boron-doped amorphous carbon film for use as a hard etch mask during the formation of a semiconductor device
08/18/2009	US7576440 Semiconductor chip having bond pads and multi-chip package
08/18/2009	US7576439 Electrically connecting substrate with electrical device
08/18/2009	US7576438 Printed circuit board and method thereof and a solder ball land and method thereof
08/18/2009	US7576437 Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
08/18/2009	US7576436 Structure of wafer level package with area bump
08/18/2009	US7576435 Low-cost and ultra-fine integrated circuit packaging technique
08/18/2009	US7576434 Wafer-level solder bumps
08/18/2009	US7576433 Semiconductor memory device and manufacturing method thereof
08/18/2009	US7576432 Using external radiators with electroosmotic pumps for cooling integrated circuits
08/18/2009	US7576431 Semiconductor chip package and multichip package
08/18/2009	US7576430 Bonding structure
08/18/2009	US7576429 Packaged semiconductor device with dual exposed surfaces and method of manufacturing
08/18/2009	US7576428 Melting temperature adjustable metal thermal interface materials and application thereof
08/18/2009	US7576427 Cold weld hermetic MEMS package and method of manufacture
08/18/2009	US7576426 Wafer level package including a device wafer integrated with a passive component
08/18/2009	US7576425 Conducting layer in chip package module
08/18/2009	US7576424 Semiconductor device
08/18/2009	US7576423 Semiconductor device
08/18/2009	US7576422 Semiconductor device
08/18/2009	US7576421 Semiconductor device having a multi-layered semiconductor substrate
08/18/2009	US7576419 Semiconductor device
08/18/2009	US7576418 Lead frame structure and applications thereof
08/18/2009	US7576416 Chip package having with asymmetric molding and turbulent plate downset design
08/18/2009	US7576415 EMI shielded semiconductor package
08/18/2009	US7576414 Electrostatic discharge (ESD) protection structure
08/18/2009	US7576412 Wafer with improved sawing loops
08/18/2009	US7576411 Semiconductor device and method for manufacturing the same
08/18/2009	US7576408 Fuse box, method of forming a fuse box, and fuse cutting method
08/18/2009	US7576403 Method of manufacturing infrared rays receiver and structure thereof
08/18/2009	US7576400 Circuitry and gate stacks
08/18/2009	US7576395 Dual gate stack CMOS structure with different dielectrics
08/18/2009	US7576393 Semiconductor device and method of manufacturing the same
08/18/2009	US7576392 Semiconductor device including gate wiring, main electrodes and connecting plate connected onto said main electrodes
08/18/2009	US7576374 Semiconductor device with robust polysilicon fuse
08/18/2009	US7576357 System for characterization of low-k dielectric material damage
08/18/2009	US7576356 Solution processed crosslinkable hole injection and hole transport polymers for OLEDs
08/18/2009	US7575963 Method for manufacturing contact structures of wiring
08/18/2009	US7575957 Leadless semiconductor package and method for manufacturing the same
08/18/2009	US7575956 Fabrication method for semiconductor package heat spreaders
08/18/2009	US7575953 Stacked die with a recess in a die BGA package
08/18/2009	US7575173 Smart card, smart card module, and a method for production of a smart card module
08/18/2009	US7575045 Heat dissipating device
08/18/2009	US7574793 Process of forming a laminate ceramic circuit board
08/13/2009	WO2009099934A2 Methods and apparatus for heat transfer for a component
08/13/2009	WO2009099912A2 Differential internally matched wire-bond interface
08/13/2009	WO2009099834A2 Wafer level chip scale package and process of manufacture
08/13/2009	WO2009099791A1 Methods of reducing cd loss in a microelectromechanical device
08/13/2009	WO2009099699A2 Shielded integrated circuit pad structure
08/13/2009	WO2009099693A1 High bandwidth cache-to-processing unit communication in a multiple processor/cache system

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