Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2014
08/28/2014DE102004060378B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
08/27/2014EP2770806A1 Method for forming through holes in insulating substrate and method for manufacturing insulating substrate for interposer
08/27/2014EP2770531A2 Electronic component connection structure
08/27/2014EP2770530A2 Electronic component unit and fixing structure
08/27/2014EP2770014A1 Thermal-conductive sheet, led mounting substrate, and led module
08/27/2014EP2769956A1 Circuit board comprising spatial light modulator
08/27/2014EP2769411A1 Package-on-package assembly with wire bond vias
08/27/2014EP2769410A1 Power semiconducter module and power semiconductor module assembly with multiple power semiconducter modules
08/27/2014EP2769409A1 Stub minimization for multi-die wirebond assemblies with orthogonal windows
08/27/2014EP2769408A1 Bulk amorphous alloy heat sink
08/27/2014EP2769164A2 Temperature system having an impurity filter
08/26/2014US8819609 Countermeasure method and device for protecting data circulating in an electronic microcircuit
08/26/2014US8817838 Laser device with optical element module on separate plate
08/26/2014US8817486 Semiconductor package having multi pitch ball land
08/26/2014US8817475 System with shared heatsink
08/26/2014US8817473 Liquid cooling system for modular electronic systems
08/26/2014US8817472 Methods and systems for on-chip osmotic airflow cooling
08/26/2014US8816707 Misalignment detection devices
08/26/2014US8816515 Semiconductor module having sliding case and manufacturing method thereof
08/26/2014US8816514 Microelectronic assembly with joined bond elements having lowered inductance
08/26/2014US8816513 Electronic assembly with three dimensional inkjet printed traces
08/26/2014US8816512 Light emitting device module
08/26/2014US8816510 Semiconductor apparatus, substrate design method, and substrate design apparatus
08/26/2014US8816509 Semiconductor package including underfill layers
08/26/2014US8816508 Integrated lighting apparatus having a control device and method of manufacturing the same
08/26/2014US8816507 Package-on-Package structures having buffer dams and method for forming the same
08/26/2014US8816506 Semiconductor device and method of manufacturing the same
08/26/2014US8816505 Low stress vias
08/26/2014US8816503 Semiconductor device with buried electrode
08/26/2014US8816502 Integrated circuit device and method for manufacturing same
08/26/2014US8816501 IC device including package structure and method of forming the same
08/26/2014US8816500 Semiconductor device having peripheral polymer structures
08/26/2014US8816499 Electrical interconnections of semiconductor devices and methods for fabricating the same
08/26/2014US8816498 Pillar design for conductive bump
08/26/2014US8816497 Electronic devices and components for high efficiency power circuits
08/26/2014US8816496 Thermal loading mechanism
08/26/2014US8816495 Structures and formation methods of packages with heat sinks
08/26/2014US8816494 Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages
08/26/2014US8816493 Semiconductor device
08/26/2014US8816492 Method and apparatus for isolating MEMS devices from external stimuli
08/26/2014US8816491 Stacked integrated chips and methods of fabrication thereof
08/26/2014US8816490 Integrated circuit die stacks with rotationally symmetric VIAS
08/26/2014US8816489 Integrated circuit structures, semiconductor structures, and semiconductor die
08/26/2014US8816487 Integrated circuit packaging system with package-in-package and method of manufacture thereof
08/26/2014US8816486 Pad structure for 3D integrated circuit
08/26/2014US8816485 Methods and materials useful for chip stacking, chip and wafer bonding
08/26/2014US8816484 Semiconductor device
08/26/2014US8816483 Semiconductor chip package structure
08/26/2014US8816482 Flip-chip leadframe semiconductor package
08/26/2014US8816481 Semiconductor device having a porous nickel plating part
08/26/2014US8816480 Electronic device packages and methods of manufacturing the same
08/26/2014US8816476 Through silicon via processing techniques for lateral double-diffused MOSFETS
08/26/2014US8816453 MEMS component and a semiconductor component in a common housing having at least one access opening
08/26/2014US8816436 Method and structure for forming fin resistors
08/26/2014US8816411 Mosfet package
08/26/2014US8816407 Semiconductor package
08/26/2014US8816404 Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant
08/26/2014US8816403 Efficient semiconductor device cell layout utilizing underlying local connective features
08/26/2014US8816390 System and method for an electronic package with a fail-open mechanism
08/26/2014US8816343 Display panel
08/26/2014US8816342 Semiconductor device
08/26/2014US8816338 Electrode foil and organic device
08/26/2014US8816327 Nanowire efuses
08/26/2014US8816213 Terminal structure, printed wiring board, module substrate, and electronic device
08/26/2014US8815732 Wire bonding method and semiconductor device
08/26/2014US8815731 Semiconductor package and method of fabricating the same
08/26/2014US8815730 Method for forming bond pad stack for transistors
08/26/2014US8815707 Environmentally-assisted technique for transferring devices onto non-conventional substrates
08/26/2014US8815665 Methods of manufacturing the gallium nitride based semiconductor devices
08/26/2014US8815648 Multi-step sintering of metal paste for semiconductor device wire bonding
08/26/2014US8815647 Chip package and a method for manufacturing a chip package
08/26/2014US8815646 Semiconductor device adapted to improve heat dissipation
08/26/2014US8815645 Multi-chip stacking method to reduce voids between stacked chips
08/26/2014US8815643 Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die
08/26/2014US8815624 Method of etching and singulating a cap wafer
08/26/2014US8815614 Method for improving prompt dose radiation response of mixed-signal integrated circuits
08/26/2014US8815400 Epoxy resin composition, die attach method using same, and semiconductor device containing cured product thereof
08/26/2014US8814406 Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip
08/26/2014US8814054 Inclusion of chip elements in a sheathed wire
08/26/2014US8813832 Heat sink
08/26/2014US8813354 Method of manufacturing an electromagnetic shielding structure
08/26/2014US8813353 Method of manufacturing a dielectric structure
08/26/2014DE202014103775U1 Kühlstruktur eines Mobilgeräts The cooling structure of a mobile device
08/26/2014DE202014103656U1 Kreuzgewebte Kapillarstruktur Cross Woven capillary
08/26/2014CA2670204C Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof
08/21/2014WO2014127381A1 Structures for z-axis interconnection of multilayer electronic substrates
08/21/2014WO2014126818A1 Dual substrate, power distribution and thermal solution for direct stacked integrated devices
08/21/2014WO2014126800A1 Three-dimensional (3d) integrated circuits (3dics) with graphene shield and related fabrication method
08/21/2014WO2014126575A1 Multi-chip module with a compressible structure for maintaining alignment between chips in the module
08/21/2014WO2014126366A1 Epoxy resin composition and light-emitting apparatus using the same
08/21/2014WO2014125318A1 Method of fabricating an integrated circuit device, and an integrated circuit device therefrom
08/21/2014WO2014125317A1 Integrated circuit with integrated current sensor
08/21/2014WO2014104390A3 Curable silicone composition, cured product thereof, and optical semiconductor device
08/21/2014WO2014104389A3 Curable silicone composition, cured product thereof, and optical semiconductor device
08/21/2014WO2014104388A3 Curable silicone composition, cured product thereof, and optical semiconductor device
08/21/2014US20140235183 Interposer package structure for wireless communication element, thermal enhancement, and emi shielding
08/21/2014US20140235019 Decoupling MIM Capacitor Designs for Interposers and Methods of Manufacture Thereof
08/21/2014US20140235018 Diamond particle mololayer heat spreaders and associated methods
08/21/2014US20140235017 Semiconductor package and method of forming the same
08/21/2014US20140235016 Method of fabricating semiconductor package
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