Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2014
08/28/2014US20140242791 Method of forming bump structure
08/28/2014US20140242757 Adhesive for electronic component
08/28/2014US20140242755 Making an integtated circuit module with dual leadframes
08/28/2014US20140242753 Flip chip packaging method, and flux head manufacturing method applied to the same
08/28/2014US20140242752 Method of fabricating semiconductor package
08/28/2014US20140242751 Packaged integrated circuit devices with through-body conductive vias, and methods of making same
08/28/2014US20140242736 Mixed metal-silicon-oxide barriers
08/28/2014US20140242734 Leadframe, semiconductor device, and method of manufacturing the same
08/28/2014US20140242374 Porous Metal Coating
08/28/2014US20140242367 Barrier film and methods of making same
08/28/2014US20140242323 Reactive hot-melt adhesive for use on electronics
08/28/2014US20140240945 Multi-Die Package with Separate Inter-Die Interconnects
08/28/2014US20140240934 Multilayer wiring board for an electronic device
08/28/2014US20140240704 Measurement mark, method for measurement, and measurement apparatus
08/28/2014US20140240033 On-Die Programming of Integrated Circuit Bond Pads
08/28/2014US20140239514 Microelectronic package with consolidated chip structures
08/28/2014US20140239512 Connections for memory electrode lines
08/28/2014US20140239511 Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
08/28/2014US20140239510 Bumpless build-up layer package with pre-stacked microelectronic devices
08/28/2014US20140239509 Semiconductor Device and Method of Forming Topside and Bottom-side Interconnect Structures Around Core Die with TSV
08/28/2014US20140239508 Semiconductor device and method for manufacturing semiconductor device
08/28/2014US20140239507 Peripheral Electrical Connection of Package on Package
08/28/2014US20140239506 Semiconductor Device and Manufacturing Method Thereof
08/28/2014US20140239505 Bump-on-Trace Methods and Structures in Packaging
08/28/2014US20140239503 Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects
08/28/2014US20140239502 Electronic device comprising at least a chip enclosed in a package and a corresponding assembly process
08/28/2014US20140239501 Integrated circuit interconnects and methods of making same
08/28/2014US20140239500 Integrated circuit (ic) having electrically conductive corrosion protecting cap over bond pads
08/28/2014US20140239499 Semiconductor device and method for production of semiconductor device
08/28/2014US20140239498 Silicided trench contact to buried conductive layer
08/28/2014US20140239497 Packaged semiconductor device
08/28/2014US20140239496 Semiconductor Device and Method of Forming Micro-Vias Partially Through Insulating Material Over Bump Interconnect Conductive Layer for Stress Relief
08/28/2014US20140239495 Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
08/28/2014US20140239494 Semiconductor package structure and semiconductor process
08/28/2014US20140239493 Semiconductor chip and semiconductor device
08/28/2014US20140239492 Semiconductor apparatus
08/28/2014US20140239491 Microelectronic unit and package with positional reversal
08/28/2014US20140239490 Packaging substrate and fabrication method thereof
08/28/2014US20140239489 Semiconductor device
08/28/2014US20140239488 Electronic component unit and fixing structure
08/28/2014US20140239487 Heat pipe in overmolded flip chip package
08/28/2014US20140239486 Cooling device for semiconductor module, and semiconductor module
08/28/2014US20140239485 Window ball grid array (bga) semiconductor packages
08/28/2014US20140239484 Method for forming sintered silver coating film, baking apparatus, and semiconductor device
08/28/2014US20140239483 Heat spreading in molded semiconductor packages
08/28/2014US20140239482 Integrated heat spreader for multi-chip packages
08/28/2014US20140239481 Electronic devices assembled with thermally insulating layers
08/28/2014US20140239480 Electronic devices assembled with thermally insulating layers
08/28/2014US20140239479 Microelectronic package including an encapsulated heat spreader
08/28/2014US20140239478 Semiconductor device and method for fabricating the same
08/28/2014US20140239477 Semiconductor packages and methods of forming the same
08/28/2014US20140239476 Semiconductor device with integral heat sink
08/28/2014US20140239475 Packaging substrate, semiconductor package and fabrication methods thereof
08/28/2014US20140239474 Chip arrangement and a method for manufacturing a chip arrangement
08/28/2014US20140239473 Wire bonding assembly and method
08/28/2014US20140239472 Dual-flag stacked die package
08/28/2014US20140239471 Ic package with stainless steel leadframe
08/28/2014US20140239470 Resin package
08/28/2014US20140239469 Information encoding using wirebonds
08/28/2014US20140239468 Semiconductor device
08/28/2014US20140239467 Semiconductor device
08/28/2014US20140239466 Electronic Device
08/28/2014US20140239465 Semiconductor package having a waveguide antenna and manufacturing method thereof
08/28/2014US20140239464 Semiconductor packages with thermal-enhanced conformal shielding and related methods
08/28/2014US20140239463 Embedded chip package structure
08/28/2014US20140239459 Method for producing mechanically flexible silicon substrate
08/28/2014US20140239458 Bonded structure with enhanced adhesion strength
08/28/2014US20140239457 Thermal via for 3d integrated circuits structures
08/28/2014US20140239456 Semiconductor wafer and its manufacture method, and semiconductor chip
08/28/2014US20140239455 Semiconductor device and semiconductor wafer
08/28/2014US20140239445 Semiconductor device and method of manufacturing the same
08/28/2014US20140239444 Buried tsv's used for decaps
08/28/2014US20140239441 Semiconductor device and method of manufacturing the same
08/28/2014US20140239440 Thin Beam Deposited Fuse
08/28/2014US20140239439 Electrical fuses and methods of making electrical fuses
08/28/2014US20140239438 Semiconductor device
08/28/2014US20140239434 Semiconductor package
08/28/2014US20140239427 Integrated Antenna on Interposer Substrate
08/28/2014US20140239425 Semiconductor device and method of manufacturing semiconductor device
08/28/2014US20140239422 Electronic device, package, electronic apparatus, and moving object
08/28/2014US20140239411 Through Vias and Methods of Formation Thereof
08/28/2014US20140239408 Semiconductor chip including region having cross-coupled transistor configuration with offset electrical connection areas on gate electrode forming conductive structures and at least two different inner extension distances of gate electrode forming conductive struc
08/28/2014US20140239303 Semiconductor devices including wisx and methods of fabrication
08/28/2014US20140238045 Semiconductor device comprising a stacked die configuration including an integrated peltier element
08/28/2014DE112012004917T5 Verfahren zum Verhindern eines elektrischen Kurzschlusses in einem Halbleiterschichtstapel, CPV-Zelle mit dünnem Substrat und Solarzellenanordnung A method for preventing an electrical short circuit in a semiconductor layer stack, CPV-cell with thin substrate and solar cell arrangement
08/28/2014DE112011105805T5 Ätzstop-Schichten und Kondensatoren Etch stop layers and capacitors
08/28/2014DE112008002566B4 Wärmeleitfähige Lage und Verfahren zum Herstellen derselben, und Leistungsmodul Heat-conductive sheet and method for manufacturing the same, and power module
08/28/2014DE112007002446B4 Elektronische Schaltungsvorrichtung und Verfahren zu ihrer Herstellung An electronic circuit apparatus and methods for their preparation
08/28/2014DE10314307B4 Verfahren zur Herstellung eines Halbleiterbauelements mit Kondensator A method for producing a semiconductor device having capacitor
08/28/2014DE102014203427A1 Elektronisches Bauteil und elektronische Vorrichtung Electronic component and electronic device
08/28/2014DE102014102692A1 Elektronisches Bauelement Electronic component
08/28/2014DE102014102364A1 Mehrchipbaugruppe mit getrennten zwischenverbindungen zwischen chips Multi-chip module with separate between connections between chips
08/28/2014DE102014101408A1 Chipanordnung und Verfahren zur Herstellung einer Chipanordnung Chip arrangement and method for producing a chip arrangement
08/28/2014DE102014101407A1 Eine Chipanordnung und ein Verfahren zum Herstellen einer Chipanordnung A chip assembly and a method for producing a chip arrangement
08/28/2014DE102014101074A1 Durchkontaktierungen und Verfahren zu ihrer Ausbildung Vias and methods of training
08/28/2014DE102013114600A1 Ein Kühlkörper mit einer integrierten Dampfkammer A heat sink with an integrated steam chamber
08/28/2014DE102013109532B3 Leistungshalbleitereinrichtung Power semiconductor device
08/28/2014DE102013102540A1 Metall-Keramik-Substrat, Modulanordnung sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate, module assembly and method of manufacturing a metal-ceramic substrate
08/28/2014DE102009021083B4 Chipträger und Halbleiter-Bauelement Chip carrier and semiconductor device
08/28/2014DE102008047378B4 Leistungsbauelemente und Verfahren zum Herstellen eines Leistungsbauelements sowie zum Herstellen einer Maske für eine Metallisierung Power devices and methods for producing a power component and for producing a mask for metallization
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