Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2014
09/04/2014DE102013105293B3 Kühlanordnung für ein Computersystem und Lufthutze Cooling arrangement for a computer system and air scoop
09/04/2014DE102013104970A1 Gekapselte Halbleitervorrichtungen und Kapselungsvorrichtungen und -verfahren Encapsulated semiconductor devices and Kapselungsvorrichtungen and procedures
09/04/2014DE102013002628B4 Gehäuse und Verfahren zum Verbinden zweier Gehäuseteile Housing and method for connecting two housing parts
09/03/2014EP2772937A1 Microwave circuit package
09/03/2014EP2772936A2 Method of wire bonding parallel bond wires aswell as a reshaping process of the same, and the related apparatus
09/03/2014EP2772717A1 Flow channel member, heat exchanger using same, semiconductor device, and device for manufacturing semiconductor
09/03/2014EP2772684A1 System for cooling devices
09/03/2014EP2771908A1 Flip-chip hybridization of microelectronic components by local heating of connecting elements
09/02/2014US8826221 Adaptive patterning for panelized packaging
09/02/2014US8824994 Wireless communication system
09/02/2014US8824226 Providing capacitors to improve radiation hardening in memory elements
09/02/2014US8824177 Semiconductor device and snubber device having a SiC-MOSFET and a Zener diode
09/02/2014US8824163 RF layered module using three dimensional vertical wiring and disposing method thereof
09/02/2014US8824159 Three dimensional structure memory
09/02/2014US8824146 Directly injected forced convection cooling for electronics
09/02/2014US8824144 Base for power module
09/02/2014US8823853 Solid-state image sensor, method of manufacturing the same and camera
09/02/2014US8823415 Logic gate
09/02/2014US8823409 Semiconductor apparatus and method of testing and manufacturing the same
09/02/2014US8823317 Circuits and methods for heating batteries in series using resonance components in series
09/02/2014US8823187 Semiconductor package, semiconductor package manufacturing method and semiconductor device
09/02/2014US8823186 Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
09/02/2014US8823185 Semiconductor packages
09/02/2014US8823184 Optoelectronic device and method for the production thereof
09/02/2014US8823183 Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package
09/02/2014US8823182 Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant
09/02/2014US8823181 Stack semiconductor apparatus having a through silicon via and method of fabricating the same
09/02/2014US8823180 Package on package devices and methods of packaging semiconductor dies
09/02/2014US8823179 Electronic device package and method for fabricating the same
09/02/2014US8823178 Bit cell with double patterned metal layer structures
09/02/2014US8823177 Semiconductor device and package wiring substrate with matrix pattern external terminals for transmitting a differential signal
09/02/2014US8823176 Discontinuous/non-uniform metal cap structure and process for interconnect integration
09/02/2014US8823175 Reliable area joints for power semiconductors
09/02/2014US8823174 Electronic device
09/02/2014US8823173 Semiconductor device having plurality of wiring layers and designing method thereof
09/02/2014US8823172 Semiconductor package and method for fabricating the same
09/02/2014US8823171 Semiconductor package, semiconductor device having the same, and method of manufacturing the same
09/02/2014US8823170 Apparatus and method for three dimensional integrated circuits
09/02/2014US8823169 Semiconductor manufacturing method and semiconductor structure thereof
09/02/2014US8823168 Die underfill structure and method
09/02/2014US8823167 Copper pillar bump with non-metal sidewall protection structure and method of making the same
09/02/2014US8823166 Pillar bumps and process for making same
09/02/2014US8823165 Memory module in a package
09/02/2014US8823164 Heatsink attachment module
09/02/2014US8823163 Antimony-free glass, antimony-free frit and a glass package that is hermetically sealed with the frit
09/02/2014US8823162 Integrated circuit die stacks with translationally compatible vias
09/02/2014US8823161 Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failures
09/02/2014US8823160 Integrated circuit package system having cavity
09/02/2014US8823159 Stacked microelectronic devices
09/02/2014US8823158 Semiconductor package and stacked semiconductor package having the same
09/02/2014US8823156 Semiconductor device packages having stacking functionality and including interposer
09/02/2014US8823155 Semiconductor device and method of manufacturing the same
09/02/2014US8823154 Encapsulation architectures for utilizing flexible barrier films
09/02/2014US8823153 Semiconductor package
09/02/2014US8823152 Semiconductor device with increased I/O leadframe
09/02/2014US8823151 Semiconductor device
09/02/2014US8823150 Optical module with a lens encapsulated within sealant and method for manufacturing the same
09/02/2014US8823149 Contact landing pads for a semiconductor device and methods of making same
09/02/2014US8823145 Multilayer board and light-emitting module having the same
09/02/2014US8823144 Semiconductor package with interface substrate having interposer
09/02/2014US8823134 Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device
09/02/2014US8823133 Interposer having an inductor
09/02/2014US8823114 Sensor device having electrode draw-out portions through side of substrate
09/02/2014US8823106 ESD protective element and plasma display including the ESD protective element
09/02/2014US8823101 ESD protection semiconductor device having an insulated-gate field-effect transistor
09/02/2014US8823010 Thin-film transistor array substrate and display device including the same
09/02/2014US8823004 Semiconductor device and manufacturing method thereof
09/02/2014US8822994 Method of repairing probe pads
09/02/2014US8822993 Integrated circuit including sensor structure, related method and design structure
09/02/2014US8822839 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/02/2014US8822830 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/02/2014US8822828 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/02/2014US8822331 Anchored damascene structures
09/02/2014US8822329 Method for making conductive interconnects
09/02/2014US8822325 Chip package and fabrication method thereof
09/02/2014US8822324 Passivated copper chip pads
09/02/2014US8822323 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
09/02/2014US8822281 Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
09/02/2014US8822276 Magnetic integration double-ended converter
09/02/2014US8822271 Method and apparatus for manufacturing chip package
09/02/2014US8822268 Redistributed chip packages containing multiple components and methods for the fabrication thereof
09/02/2014US8822266 Integrated circuit micro-module
09/02/2014US8822253 Semiconductor housing and method for the production of a semiconductor housing
09/02/2014US8822238 Apparatus and method for predetermined component placement to a target platform
09/02/2014US8822137 Self-aligned fine pitch permanent on-chip interconnect structures and method of fabrication
09/02/2014US8822036 Sintered silver joints via controlled topography of electronic packaging subcomponents
09/02/2014US8821961 MgO-based coating for electrically insulating semiconductive substrates and production method thereof
09/02/2014US8821768 Bonding method and bonding material using metal particle
09/02/2014US8820616 Method and apparatus providing fine alignment of a structure relative to a support
09/02/2014US8819930 Method for improving the adhesion between silver surfaces and resin materials
08/2014
08/28/2014WO2014130979A1 Defect reduction in a substrate treatment method
08/28/2014WO2014130959A1 Carrier-less silicon interposer
08/28/2014WO2014130828A1 Package-on-package structures
08/28/2014WO2014130299A1 Complementary back end of line (beol) capacitor
08/28/2014WO2014130047A1 Component assembly using a temporary attach material
08/28/2014WO2014129976A1 Semiconductor structure and method of fabricating the same
08/28/2014WO2014128582A1 Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
08/28/2014WO2014128556A1 Sloped hierarchically-structured surface designs for enhanced condensation heat transfer
08/28/2014WO2014128151A1 A silicon devices / heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly
08/28/2014WO2014049059A3 Component arrangement and method for producing electrical components
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