| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/17/2009 | US20090233228 A photo-acid generator, a terpene compound in combination with of a hydroxypolyamide which undergoes cyclization upoon curing to become a polybenzoxazole; semiconductors; excellant positive lithography performance such as sensitivity and resolution |
| 09/17/2009 | US20090232971 Self-encapsulated silver alloys for interconnects |
| 09/17/2009 | US20090231827 Interposer and method for manufacturing interposer |
| 09/17/2009 | US20090231584 Periodic patterns and technique to control misaligment between two layers |
| 09/17/2009 | US20090231477 Solid-state image pickup apparatus and method for manufacturing the same |
| 09/17/2009 | US20090231020 Electrical fuse, semiconductor device and method of disconnecting electrical fuse |
| 09/17/2009 | US20090230571 Masking of repeated overlay and alignment marks to allow reuse of photomasks in a vertical structure |
| 09/17/2009 | US20090230570 Resin composition and semiconductor device empolying the same |
| 09/17/2009 | US20090230569 Device comprising a semiconductor cmponent, and a manufacturing method |
| 09/17/2009 | US20090230568 Adhesive Film for Semiconductor and Semiconductor Device Therewith |
| 09/17/2009 | US20090230567 Method of post-mold grinding a semiconductor package |
| 09/17/2009 | US20090230566 Method of underfill air vent for flipchip BGA |
| 09/17/2009 | US20090230565 Semiconductor package and method for manufacturing the same |
| 09/17/2009 | US20090230564 Chip structure and stacked chip package as well as method for manufacturing chip structures |
| 09/17/2009 | US20090230563 Semiconductor device and method of manufacturing the same |
| 09/17/2009 | US20090230562 Semiconductor integrated circuit device |
| 09/17/2009 | US20090230561 Semiconductor device |
| 09/17/2009 | US20090230560 Semiconductor device and manufacturing method thereof |
| 09/17/2009 | US20090230559 Semiconductor device |
| 09/17/2009 | US20090230557 Semiconductor Device and Method for Making Same |
| 09/17/2009 | US20090230556 Nonvolatile semiconductor memory apparatus and manufacturing method thereof |
| 09/17/2009 | US20090230555 Tungsten liner for aluminum-based electromigration resistant interconnect structure |
| 09/17/2009 | US20090230554 Wafer-level redistribution packaging with die-containing openings |
| 09/17/2009 | US20090230553 Semiconductor device including adhesive covered element |
| 09/17/2009 | US20090230552 Bump-on-Lead Flip Chip Interconnection |
| 09/17/2009 | US20090230551 Semiconductor device |
| 09/17/2009 | US20090230550 Method and system for the modular design and layout of integrated circuits |
| 09/17/2009 | US20090230549 Flip chip package |
| 09/17/2009 | US20090230548 Semiconductor package and multi-chip package using the same |
| 09/17/2009 | US20090230547 Design structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof |
| 09/17/2009 | US20090230546 Mounted body and method for manufacturing the same |
| 09/17/2009 | US20090230545 Electronic device contact structures |
| 09/17/2009 | US20090230544 Heat sink structure and semiconductor package as well as method for configuring heat sinks on a semiconductor package |
| 09/17/2009 | US20090230543 Semiconductor package structure with heat sink |
| 09/17/2009 | US20090230542 Semiconductor Device With Integrated Passive Circuit and Method of Making the Same Using Sacrificial Substrate |
| 09/17/2009 | US20090230541 Semiconductor device and manufacturing method of the same |
| 09/17/2009 | US20090230540 High performance multi-chip flip chip package |
| 09/17/2009 | US20090230539 Semiconductor device |
| 09/17/2009 | US20090230538 Semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process and method for making the same |
| 09/17/2009 | US20090230537 Semiconductor die package including embedded flip chip |
| 09/17/2009 | US20090230536 Semiconductor die package including multiple semiconductor dice |
| 09/17/2009 | US20090230535 Semiconductor module |
| 09/17/2009 | US20090230534 Semiconductor memory apparatus |
| 09/17/2009 | US20090230533 Manufacturing stacked semiconductor device |
| 09/17/2009 | US20090230532 System for solder ball inner stacking module connection |
| 09/17/2009 | US20090230531 Semiconductor Package with Penetrable Encapsulant Joining Semiconductor Die and Method Thereof |
| 09/17/2009 | US20090230530 Semiconductor device and method for producing semiconductor device |
| 09/17/2009 | US20090230529 Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof |
| 09/17/2009 | US20090230528 Support Mounted Electrically Interconnected Die Assembly |
| 09/17/2009 | US20090230527 Multi-chips package structure and the method thereof |
| 09/17/2009 | US20090230526 Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof |
| 09/17/2009 | US20090230525 Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof |
| 09/17/2009 | US20090230524 Semiconductor chip package having ground and power regions and manufacturing methods thereof |
| 09/17/2009 | US20090230523 Advanced quad flat no lead chip package having a cavity structure and manufacturing methods thereof |
| 09/17/2009 | US20090230522 Method for producing a semiconductor device and the semiconductor device |
| 09/17/2009 | US20090230521 Stress Mitigation in Packaged Microchips |
| 09/17/2009 | US20090230520 Leadframe package with dual lead configurations |
| 09/17/2009 | US20090230519 Semiconductor Device |
| 09/17/2009 | US20090230518 Semiconductor die package including ic driver and bridge |
| 09/17/2009 | US20090230517 Integrated circuit package system with integration port |
| 09/17/2009 | US20090230506 Semiconductor device and method for fabricating the same |
| 09/17/2009 | US20090230493 Solid-state imaging device and method of fabricating solid-state imaging device |
| 09/17/2009 | US20090230487 Semiconductor device, semiconductor device manufacturing method and lid frame |
| 09/17/2009 | US20090230486 Piezoelectric device and electronic apparatus |
| 09/17/2009 | US20090230477 Resettable short-circuit protection configuration |
| 09/17/2009 | US20090230476 Optically triggered electro-static discharge protection circuit |
| 09/17/2009 | US20090230448 Semiconductor integrated circuit device and manufacture thereof |
| 09/17/2009 | US20090230421 Semiconductor package structure, lead frame and conductive assembly for the same |
| 09/17/2009 | US20090230420 Housing Body and Method for Production Thereof |
| 09/17/2009 | DE102009000587A1 Modul mit einer gesinterten Verbindung zwischen einem Halbleiterchip und einer Kupferoberfläche und Verfahren zur Herstellung eines Moduls mit einer gesinterten Verbindung zwischen einem Halbleiterchip und einer Kupferoberfläche Module with a sintered connection between a semiconductor chip and a copper surface and method of manufacturing a module with a sintered connection between a semiconductor chip and a copper surface, |
| 09/17/2009 | DE102008045581A1 Halbleitervorrichtung und Herstellungsverfahren der Halbleitervorrichtung A semiconductor device and manufacturing method of the semiconductor device |
| 09/17/2009 | DE102008012570A1 Power semiconductor module system e.g. converter system, for supplying electric current to motor, has assembly adapter and power semiconductor module snapped with each other in two different snap-in stages |
| 09/17/2009 | DE102008006536A1 Cooling system for power semiconductor arranged on supporting circuit board, particularly for supporting boards equipped with light-emitting diodes, comprises coolant, where sub-coolant lies opposite to rear side of circuit board |
| 09/17/2009 | DE102006021758B4 Dünnschicht-Transistor-Array, elektrostatikentladungs-Schutzeinrichtung davon und Verfahren zu seiner Herstellung Thin-film transistor array, electrostatic discharge protection device thereof, and process for its preparation |
| 09/17/2009 | CA2716920A1 Semiconductor device, and communication apparatus and electronic apparatus having the same |
| 09/16/2009 | EP2101352A2 Semiconductor module with pressure contact configuration |
| 09/16/2009 | EP2101351A1 Cooling device for cooling a component |
| 09/16/2009 | EP2101349A2 Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same |
| 09/16/2009 | EP2101346A1 Method for forming wiring film, transistor, and electronic device |
| 09/16/2009 | EP2100908A1 Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition |
| 09/16/2009 | EP2100865A1 Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and semiconductor module using the same |
| 09/16/2009 | EP2100490A1 Rack enclosure |
| 09/16/2009 | EP2100331A1 Electronic component module and method for the production thereof |
| 09/16/2009 | EP2100328A1 Solder bump/under bump metallurgy structure for high temperature applications |
| 09/16/2009 | EP2100327A1 Electronic, in particular microelectronic, functional group and method for its production |
| 09/16/2009 | EP2100323A2 Plastic electronic component package |
| 09/16/2009 | EP2099867A1 Curable silicone composition and electronic component |
| 09/16/2009 | EP1273039B1 Process for semiconductor wafer-level chip scale packages |
| 09/16/2009 | EP0917189B1 Method for mounting encapsulated body on mounting board and optical converter |
| 09/16/2009 | CN201311929Y Radiating structure of improved transistor |
| 09/16/2009 | CN101536184A Bond pad structure and method for producing same |
| 09/16/2009 | CN101536183A Leadframes for improved moisture reliability of semiconductor devices |
| 09/16/2009 | CN101536182A 半导体器件 Semiconductor devices |
| 09/16/2009 | CN101536181A Semiconductor device and method for manufacturing same |
| 09/16/2009 | CN101536180A Electronic component package |
| 09/16/2009 | CN101536179A Lighting device package |
| 09/16/2009 | CN101534627A High-effective integral spray cooling system |
| 09/16/2009 | CN101534626A Thermal module combination and radiator combination thereof |
| 09/16/2009 | CN101534625A Radiator fastener and radiator combination using the fastener |
| 09/16/2009 | CN101534624A Radiator combination |