| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/02/2009 | EP2095409A1 Interconnect structure having enhanced electromigration reliability and a method of fabricating same |
| 09/02/2009 | EP2094972A2 Pulsating fluid cooling with frequency control |
| 09/02/2009 | EP1588371B1 Tamper-resistant packaging and approach using magnetically-set data |
| 09/02/2009 | EP1430530B1 Heat exchanger |
| 09/02/2009 | EP1360721B1 Electronic package having embedded capacitors and method of fabrication therefor |
| 09/02/2009 | CN201302996Y Lead wire frame structure for integrated circuit |
| 09/02/2009 | CN201302995Y Lead wire frame structure for integrated circuit with double loading plates |
| 09/02/2009 | CN201302994Y Molding structure for lead wire framework of integrated circuit |
| 09/02/2009 | CN201302993Y Lead wire framework for miniature diode |
| 09/02/2009 | CN201302992Y Arrangement structure of lead wire framework of integrated circuit |
| 09/02/2009 | CN201302991Y Composite structure of lead wire for packaging transistor |
| 09/02/2009 | CN101523596A Semiconductor device having improved heat dissipation capabilities |
| 09/02/2009 | CN101523595A Heat generator cooling structure and driving apparatus fitted with the same |
| 09/02/2009 | CN101523594A Semiconductor package and method for producing semiconductor package |
| 09/02/2009 | CN101522013A Electronic device, loop heat pipe and cooling device |
| 09/02/2009 | CN101522012A Heat-emitting element cooling apparatus |
| 09/02/2009 | CN101522010A Heat dissipating device and manufacturing method thereof |
| 09/02/2009 | CN101521372A Integrated circuit with electrostatic discharge protecting circuit |
| 09/02/2009 | CN101521253A Solid luminous element and light source module |
| 09/02/2009 | CN101521235A Diode with low frequency, low noise and low twinkling |
| 09/02/2009 | CN101521234A Lead-free diode |
| 09/02/2009 | CN101521221A 有机发光显示装置 The organic light emitting display device |
| 09/02/2009 | CN101521218A 影像显示系统 Image display system |
| 09/02/2009 | CN101521216A Solid-state imaging device and camera |
| 09/02/2009 | CN101521205A Memory array and method for manufacturing same |
| 09/02/2009 | CN101521204A Transistor having vertical channel and method for fabricating the same |
| 09/02/2009 | CN101521198A Electronic device |
| 09/02/2009 | CN101521196A Light-emitting diode (LED) and method for preparing LED and base of LED |
| 09/02/2009 | CN101521194A High-speed photoelectric subassembly and flip chip structure thereof |
| 09/02/2009 | CN101521193A Electronic encapsulating structure |
| 09/02/2009 | CN101521192A Package structure of light emitting diode and the packaging method thereof |
| 09/02/2009 | CN101521190A Anti-fuse and method for forming the same, unit cell of nonvolatile memory device with the same |
| 09/02/2009 | CN101521189A Multilayer printed wiring board |
| 09/02/2009 | CN101521188A Lead frame structure and surface sticking semiconductor packaging structure formed by same |
| 09/02/2009 | CN101521187A Wafer-level integrated circuit package with top and bottom side electrical connections |
| 09/02/2009 | CN101521186A Semiconductor device and manufacturing method therefor |
| 09/02/2009 | CN101521185A Package structure and package process of optical wafer |
| 09/02/2009 | CN101521184A Semiconductor device |
| 09/02/2009 | CN101521183A Semiconductor light emitting device and method for manufacturing the same |
| 09/02/2009 | CN101521170A Solder contacts and methods of forming same |
| 09/02/2009 | CN101521169A Semiconductor device and a method of manufacturing the same |
| 09/02/2009 | CN101521167A Semiconductor device and manufacturing method of the same |
| 09/02/2009 | CN101521163A Heightened flexible circuit board of bonding pad and manufacturing method thereof |
| 09/02/2009 | CN101521160A A method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate |
| 09/02/2009 | CN101521159A Method for improving the uniformity of disc and interlayer medium |
| 09/02/2009 | CN101520580A TFT-LCD array substrate structure and manufacturing method thereof |
| 09/02/2009 | CN101520166A Optical device and method of fabricating the same |
| 09/02/2009 | CN101520165A Light emitting diode lighting device |
| 09/02/2009 | CN101519576A Method for preparing packaging adhesive used for high-transmittance high-power light emitting diode |
| 09/02/2009 | CN101519531A White heat-curable silicone resin composition, optoelectric part case, and molding method |
| 09/02/2009 | CN100536140C Wiring protection element for laser deleted tungsten fuse |
| 09/02/2009 | CN100536127C 电路装置 Circuit means |
| 09/02/2009 | CN100536126C Method and arrangement for shielding a component against electrostatic interference |
| 09/02/2009 | CN100536125C Metal layer structure of semiconductor device |
| 09/02/2009 | CN100536124C Interconnection structure and forming method thereof |
| 09/02/2009 | CN100536123C Semiconductor device and electronic device |
| 09/02/2009 | CN100536122C Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 09/02/2009 | CN100536121C Semiconductor device and preparation method thereof |
| 09/02/2009 | CN100536120C Semiconductor chip and preparation method thereof |
| 09/02/2009 | CN100536119C A semiconductor device and a method of manufacturing the same |
| 09/02/2009 | CN100536109C Method and structure for manufacturing high-capacitance capacitor by using copper |
| 09/02/2009 | CN100536105C Methods of fabricating interconnects for semiconductor components |
| 09/02/2009 | CN100536103C Method of fabricating semiconductor device |
| 09/02/2009 | CN100536101C Semiconductor device and method of manufacturing the same |
| 09/02/2009 | CN100536099C Resin material |
| 09/02/2009 | CN100536095C High density microvia substrate with high wireability |
| 09/02/2009 | CN100536079C Semiconductor base plate and its manufacturing method |
| 09/02/2009 | CN100535829C Heat dissipating module of notebook computer |
| 09/02/2009 | CN100534673C Method for preparing Si-Al alloy using spray deposition forming process |
| 09/01/2009 | USRE40887 Semiconductor chip with redistribution metal layer |
| 09/01/2009 | US7583862 Packaged microelectronic imagers and methods of packaging microelectronic imagers |
| 09/01/2009 | US7583511 Semiconductor die package with internal bypass capacitors |
| 09/01/2009 | US7583484 Circuit and method for ESD protection |
| 09/01/2009 | US7583093 Electrical test method of an integrated circuit |
| 09/01/2009 | US7582976 Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module device |
| 09/01/2009 | US7582974 Semiconductor device and method of manufacturing same |
| 09/01/2009 | US7582973 Flip-chip type assembly |
| 09/01/2009 | US7582972 Semiconductor device and fabrication method thereof |
| 09/01/2009 | US7582971 Semiconductor device and manufacturing method of the same |
| 09/01/2009 | US7582970 Carbon containing silicon oxide film having high ashing tolerance and adhesion |
| 09/01/2009 | US7582969 Hermetic interconnect structure and method of manufacture |
| 09/01/2009 | US7582968 Wiring board with a protective film greater in heights than bumps |
| 09/01/2009 | US7582967 Semiconductor device, electronic module, and method of manufacturing electronic module |
| 09/01/2009 | US7582966 Semiconductor chip and method for fabricating the same |
| 09/01/2009 | US7582965 Electronic device and method for bonding an electronic device |
| 09/01/2009 | US7582964 Semiconductor package having non-ceramic based window frame |
| 09/01/2009 | US7582963 Vertically integrated system-in-a-package |
| 09/01/2009 | US7582962 Heat dissipation device |
| 09/01/2009 | US7582961 Package structure with circuits directly connected to semiconductor chip |
| 09/01/2009 | US7582960 Multiple chip package module including die stacked over encapsulated package |
| 09/01/2009 | US7582959 Driver module structure with flexible circuit board |
| 09/01/2009 | US7582958 Semiconductor package |
| 09/01/2009 | US7582957 Integrated circuit package system with encapsulation lock |
| 09/01/2009 | US7582956 Flip chip in leaded molded package and method of manufacture thereof |
| 09/01/2009 | US7582955 Semiconductor device manufacturing method and manufacturing apparatus |
| 09/01/2009 | US7582953 Package structure with leadframe on offset chip-stacked structure |
| 09/01/2009 | US7582952 Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof |
| 09/01/2009 | US7582951 Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages |
| 09/01/2009 | US7582938 I/O and power ESD protection circuits by enhancing substrate-bias in deep-submicron CMOS process |
| 09/01/2009 | US7582937 ESD protection circuit |