| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/10/2009 | US20090224393 Semiconductor device and fabricating method thereof |
| 09/10/2009 | US20090224392 Semiconductor package having side walls and method for manufacturing the same |
| 09/10/2009 | US20090224391 Wafer Level Die Integration and Method Therefor |
| 09/10/2009 | US20090224390 Integrated circuit with step molded inner stacking module package in package system |
| 09/10/2009 | US20090224389 Integrated circuit package system with stacked devices |
| 09/10/2009 | US20090224387 Semiconductor chip and method for manufacturing the same and semiconductor device |
| 09/10/2009 | US20090224386 Optical Semiconductor Device Having Pre-Molded Leadframe with Window and Method Therefor |
| 09/10/2009 | US20090224385 Package structure of integrated circuit device and manufacturing method thereof |
| 09/10/2009 | US20090224384 Chip package |
| 09/10/2009 | US20090224383 Semiconductor die package including exposed connections |
| 09/10/2009 | US20090224382 Semiconductor package with mold lock vent |
| 09/10/2009 | US20090224381 Double-faced electrode package and its manufacturing method |
| 09/10/2009 | US20090224380 Leadframe and semiconductor package having downset baffle paddles |
| 09/10/2009 | US20090224379 Copper alloy sheet and qfn package |
| 09/10/2009 | US20090224378 Package structure with embedded die and method of fabricating the same |
| 09/10/2009 | US20090224377 Semiconductor device with wire-bonding on multi-zigzag fingers |
| 09/10/2009 | US20090224376 Circuit board having conductive shield member and semiconductor package using the same |
| 09/10/2009 | US20090224375 Semiconductor device and semiconductor device manufacturing method |
| 09/10/2009 | US20090224374 Advanced multilayer dielectric cap with improved mechanical and electrical properties |
| 09/10/2009 | US20090224373 Integrated circuit and method for manufacturing same |
| 09/10/2009 | US20090224372 Wafer translator having a silicon core isolated from signal paths by a ground plane |
| 09/10/2009 | US20090224371 Protection for Bonding Pads and Methods of Formation |
| 09/10/2009 | US20090224368 Maskless selective boron-doped epitaxial growth |
| 09/10/2009 | US20090224361 Semiconductor Package with Stacked Semiconductor Die each Having IPD and Method of Reducing Mutual Inductive Coupling by Providing Selectable Vertical and Lateral Separation Between IPD |
| 09/10/2009 | US20090224360 Semiconductor integrated circuit device and method of fabricating the same |
| 09/10/2009 | US20090224325 Antifuse elements |
| 09/10/2009 | US20090224324 Semiconductor device and manufacturing method thereof |
| 09/10/2009 | US20090224323 Integrated circuit with mosfet fuse element |
| 09/10/2009 | US20090224267 Process for fabricating a thin film semiconductor device, thin film semiconductor device, and liquid crystal display |
| 09/10/2009 | US20090224264 Semiconductor component with regions electrically insulated from one another and method for making a semiconductor component |
| 09/10/2009 | US20090224242 Isolation circuit |
| 09/10/2009 | US20090224241 Semiconductor device |
| 09/10/2009 | US20090223653 Method for Operating a Heat Dissipation System Background of the Invention |
| 09/10/2009 | US20090223036 Electrochemical cell and fabrication method of the same |
| 09/10/2009 | DE112007002615T5 Thermoelektrisches Element und Thermoelektrisches Modul A thermoelectric element and thermoelectric module |
| 09/10/2009 | DE112007002587T5 Systeme und Verfahren zum Passivieren von Umverteilungsverbindungen auf dem Chip Systems and methods for passivating redistribution connections on the chip |
| 09/10/2009 | DE112007001227T5 Flip-Chip-MLP mit gefalteter Wärmesenke Flip-chip MLP with folded heat sink |
| 09/10/2009 | DE112006004099T5 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production |
| 09/10/2009 | DE112006004098T5 Mehrfach-Chip-Baugruppe Multi-chip module |
| 09/10/2009 | DE102009011304A1 Integriertes Schaltungsbauelement mit abstimmbaren Substratkondensatoren The integrated circuit device with tunable capacitors substrate |
| 09/10/2009 | DE102009010199A1 Systemträger mit Formschlossentlüftung Carrier system with shape lock vent |
| 09/10/2009 | DE102009009874A1 Elektronikbauelement und Verfahren zu dessen Herstellung An electronics device and process for its preparation |
| 09/10/2009 | DE102008050010A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 09/10/2009 | DE102008045721A1 Halbleitervorrichtung Semiconductor device |
| 09/10/2009 | DE102008033852B3 Power semiconductor module arrangement, has power semiconductor module with two fixing elements e.g. locking-centering-fasteners, formed such that fixing elements limit movement of substrate towards lower side of housing |
| 09/10/2009 | DE102008013231A1 Härtbares Reaktionsharzsystem Curable reactive resin system |
| 09/10/2009 | DE102008012384A1 Deckel für Mikro-Systeme und Verfahren zur Herstellung eines Deckels Lid for micro-systems and method for producing a lid |
| 09/10/2009 | DE102008011943A1 Sensoranordnung Sensor array |
| 09/10/2009 | DE102008008853A1 Schaltungsanordnung mit Bondverbindung Circuitry with bond |
| 09/10/2009 | DE102007051312B4 Verfahren zur Herstellung einer CMOS-Einrichtung mit Peltier-Element und Fotodiode A method of manufacturing a CMOS device with Peltier element and photodiode |
| 09/10/2009 | DE102004026061B4 Leistungshalbleitermodul und Verfahren zum Kühlen eines Leistungshalbleitermoduls The power semiconductor module and method for cooling a power semiconductor module |
| 09/10/2009 | DE10064041B4 Verfahren zur Herstellung einer Kupferverdrahtung in einem Halbleiterbauelement A process for producing a copper wiring in a semiconductor device |
| 09/09/2009 | EP2099069A2 Heat dissipator, in particular for electronic components |
| 09/09/2009 | EP2099068A1 Process for producing metallized aluminum nitride substrate |
| 09/09/2009 | EP2099060A1 Method and device for manufacturing an assembly with at least two microelectronic chips |
| 09/09/2009 | EP2098555A1 Modified polyaluminosiloxane |
| 09/09/2009 | EP2097936A1 Superconducting shielding for use with an intergrated circuit for quantum computing |
| 09/09/2009 | EP2097925A2 Stacked packages |
| 09/09/2009 | EP2097924A2 Front-end processed wafer having through-chip connections |
| 09/09/2009 | EP2020029A4 Improved cmos diodes with dual gate conductors, and methods for forming the same |
| 09/09/2009 | EP1908167B1 Compensation for parasitic coupling between rf or microwave transistors in the same package |
| 09/09/2009 | EP1761951A4 Lead solder indicator and method |
| 09/09/2009 | EP1232677B1 Flip chip package, circuit board thereof and packaging method thereof |
| 09/09/2009 | EP1112674B1 Laminates for encapsulating oled devices |
| 09/09/2009 | EP1107306B1 Semiconductor package and manufacturing method thereof |
| 09/09/2009 | CN201307593Y Glass diode with color circle |
| 09/09/2009 | CN201307592Y Insulation structure of IC module stack |
| 09/09/2009 | CN201307591Y Economical type triode lead frame |
| 09/09/2009 | CN201307590Y Light-thin type triode lead frame |
| 09/09/2009 | CN201307589Y Multi-parallel slot ball grid array packaging structure |
| 09/09/2009 | CN201307588Y Active temperature control cooling device based on piezoelectric pump |
| 09/09/2009 | CN101529589A Bottom source ldmosfet structure and method |
| 09/09/2009 | CN101529588A Power module substrate, method for manufacturing power module substrate, and power module |
| 09/09/2009 | CN101529587A Method of packaging a device having a multi-contact elastomer connector contact area and device thereof |
| 09/09/2009 | CN101529586A Method of packaging a semiconductor device and a prefabricated connector |
| 09/09/2009 | CN101529585A Electronic device package structure and package manufacturing method |
| 09/09/2009 | CN101529584A Semiconductor element mounting structure and semiconductor element mounting method |
| 09/09/2009 | CN101529583A Lid for functional part and process for producing the same |
| 09/09/2009 | CN101529582A Semiconductor device, display device and electronic device |
| 09/09/2009 | CN101528019A Heat radiating device |
| 09/09/2009 | CN101528018A Heat radiating device and manufacturing method thereof |
| 09/09/2009 | CN101528017A Radiating component and radiating method |
| 09/09/2009 | CN101527557A Robust semiconductor power devices with design to protect transistor cells with slower switching speed |
| 09/09/2009 | CN101527313A Metal oxide semiconductor element and manufacturing method thereof |
| 09/09/2009 | CN101527310A Solid-state image sensing apparatus and package of same |
| 09/09/2009 | CN101527309A Image sensor capable of reducing noise |
| 09/09/2009 | CN101527307A Thin film transistor panel and manufacturing method of the same |
| 09/09/2009 | CN101527306A Active component array substrate and LCD panel |
| 09/09/2009 | CN101527305A Active element array substrate |
| 09/09/2009 | CN101527302A Power converter apparatus |
| 09/09/2009 | CN101527301A Battery protection IC chip |
| 09/09/2009 | CN101527300A 堆叠式集成电路与其制造方法 Stacked ICs and its manufacturing method |
| 09/09/2009 | CN101527299A Package structure |
| 09/09/2009 | CN101527298A Circuit board having conductive shield member and semiconductor package using the same |
| 09/09/2009 | CN101527297A Alignment apparatus and application thereof |
| 09/09/2009 | CN101527296A Integrated circuit and method for manufacturing same |
| 09/09/2009 | CN101527295A Clustered stacked vias for reliable electronic substrates and manufacturing method thereof |
| 09/09/2009 | CN101527294A Manufacturing method of thermal dissipation layer for driver ic substrate and structure thereof |
| 09/09/2009 | CN101527293A Square flat pinless type encapsulation structure and lead frame |
| 09/09/2009 | CN101527292A 芯片封装结构 Chip package structure |