| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/24/2009 | US20090236726 Package-on-package semiconductor structure |
| 09/24/2009 | US20090236725 Solder Preform and Electronic Component |
| 09/24/2009 | US20090236724 Ic package with wirebond and flipchip interconnects on the same die with through wafer via |
| 09/24/2009 | US20090236723 Integrated circuit packaging system with package-in-package and method of manufacture thereof |
| 09/24/2009 | US20090236722 Semiconductor memory card and semiconductor memory device |
| 09/24/2009 | US20090236721 Semiconductor device and manufacturing method thereof |
| 09/24/2009 | US20090236720 Integrated circuit package system with step mold recess |
| 09/24/2009 | US20090236719 Package in package system incorporating an internal stiffener component |
| 09/24/2009 | US20090236718 Package-on-package system with internal stacking module interposer |
| 09/24/2009 | US20090236717 Organic Electronic Component With Dessicant-Containing Passivation Material |
| 09/24/2009 | US20090236716 Rectifying diode package structure |
| 09/24/2009 | US20090236715 Semiconductor package structure with laminated interposing layer |
| 09/24/2009 | US20090236714 Robust leaded molded packages and methods for forming the same |
| 09/24/2009 | US20090236713 Semiconductor integrated circuit package and method of packaging semiconductor integrated circuit |
| 09/24/2009 | US20090236712 Ic package having reduced thickness |
| 09/24/2009 | US20090236711 Method of making and designing lead frames for semiconductor packages |
| 09/24/2009 | US20090236710 Col semiconductor package |
| 09/24/2009 | US20090236709 Semiconductor chip package |
| 09/24/2009 | US20090236708 Semiconductor package having a bridged plate interconnection |
| 09/24/2009 | US20090236707 Electronic devices with enhanced heat spreading |
| 09/24/2009 | US20090236706 Semiconductor chip package |
| 09/24/2009 | US20090236705 Apparatus and method for series connection of two die or chips in single electronics package |
| 09/24/2009 | US20090236704 Integrated circuit package system with isolated leads |
| 09/24/2009 | US20090236703 Chip package structure and the method thereof |
| 09/24/2009 | US20090236702 SiP SUBSTRATE |
| 09/24/2009 | US20090236701 Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement |
| 09/24/2009 | US20090236700 Semiconductor device and manufacturing method of the same |
| 09/24/2009 | US20090236699 Discreet placement of radiation sources on integrated circuit devices |
| 09/24/2009 | US20090236688 Semiconductor device having fuse pattern and methods of fabricating the same |
| 09/24/2009 | US20090236687 Fuse of Semiconductor Device and Method for Forming the Same |
| 09/24/2009 | US20090236685 Embedded interconnects, and methods for forming same |
| 09/24/2009 | US20090236678 Sensor device and production method therefor |
| 09/24/2009 | US20090236671 High voltage-resistant semiconductor device and method of manufacturing high voltage-resistant semiconductor device |
| 09/24/2009 | US20090236666 Integrated Circuitry |
| 09/24/2009 | US20090236663 Hybrid orientation substrate with stress layer |
| 09/24/2009 | US20090236638 Semiconductor Constructions |
| 09/24/2009 | US20090236627 Method of forming metal wiring |
| 09/24/2009 | US20090236613 Semiconductor device and method of manufacturing the same |
| 09/24/2009 | US20090236607 Electronic circuit |
| 09/24/2009 | US20090236599 Active device array substrate |
| 09/24/2009 | US20090236406 Method of electrically connecting a microelectronic component |
| 09/24/2009 | DE202009005305U1 Kühlplatte mit Kapillarkanälen für Flüssigkeitskühler Cooling plate with capillary liquid cooler |
| 09/24/2009 | DE10326555B4 Verfahren zur Herstellung einer integrierten Schaltung sowie durch das Verfahren hergestellte integrierte Schaltung A method of manufacturing an integrated circuit and integrated circuit prepared by the process |
| 09/24/2009 | DE102009011975A1 Halbleiteranordnung mit einem lagestabilen überdeckten Element A semiconductor device comprising a positionally stable element covered |
| 09/24/2009 | DE102008059581A1 ESD-Schutzvorrichtung und Verfahren zu Ihrer Herstellung ESD Protection Device and method for their preparation |
| 09/24/2009 | DE102008034165A1 Sensorbaustein Sensor module |
| 09/24/2009 | DE102008015452A1 Korrosionsschutzschicht für Halbleiter-Bauelemente Corrosion protective layer for semiconductor devices |
| 09/24/2009 | DE102008014742A1 Arrangement for flip-chip-dry construction, has integrated switching circuit with multiple solder contact elements and support, on which integrated switching circuit is positioned |
| 09/24/2009 | DE102008014653A1 Vorrichtung mit Halbleiterbauelement sowie Herstellungsverfahren Device with semiconductor device and manufacturing method |
| 09/24/2009 | DE102008000786A1 Sensorvorrichtung und Verfahren zur Herstellung einer Sensorvorrichtung Sensor device and method of manufacturing a sensor device |
| 09/24/2009 | DE102007052397B4 Kühlanordnung zur thermischen Kontaktierung zwischen elektronischem Bauelement und Kühlkörper Cooling system for thermal contact between the electronic component and heat sink |
| 09/24/2009 | DE102006043133B4 Anschlusspad zu einem Kontaktieren eines Bauelements und Verfahren zu dessen Herstellung Contacting a terminal pad to a device and process for its preparation |
| 09/24/2009 | DE10054115B4 Verfahren zur Ausbildung einer Barriereschicht A method of forming a barrier layer |
| 09/24/2009 | DE10049356B4 Halbleitersensor Semiconductor sensor |
| 09/23/2009 | EP2104182A1 Integrated antenna phased array control device |
| 09/23/2009 | EP2104144A1 Scalable radio receiver architecture providing three-dimensional packaging of multiple receivers |
| 09/23/2009 | EP2104143A2 Structure for testing MOS capacitance and method for measuring a capacitance curve according to the associated voltage |
| 09/23/2009 | EP2104142A2 Semiconductor chip package |
| 09/23/2009 | EP2104141A2 Sheet structure and method of manufacturing sheet structure |
| 09/23/2009 | EP2104140A1 Conductive microstructure obtained by converting porous silicon into porous metal |
| 09/23/2009 | EP2104139A1 Device for preheating a cooled component by conduction and/or convection |
| 09/23/2009 | EP2102907A2 High-z structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels |
| 09/23/2009 | EP1354350B1 Plastic encapsulated semiconductor devices with improved corrosion resistance |
| 09/23/2009 | CN201315318Y Conductor frame structure |
| 09/23/2009 | CN101542764A RF circuit and element of mixed material |
| 09/23/2009 | CN101542726A Semiconductor chip with silicon through holes and side bonding pads |
| 09/23/2009 | CN101542725A Cooler for power module and power module |
| 09/23/2009 | CN101542724A Pulsating cooling system |
| 09/23/2009 | CN101542723A High temperature, high voltage SiC void-less electronic package |
| 09/23/2009 | CN101542722A Interposer |
| 09/23/2009 | CN101542721A Film for sealing and semiconductor device using the same |
| 09/23/2009 | CN101542720A Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof |
| 09/23/2009 | CN101542719A Connection structure for flip-chip semiconductor package, buildup layer material, sealing resin composition and circuit board |
| 09/23/2009 | CN101542718A Resin bleeding inhibitor and method of preventing resin bleeding |
| 09/23/2009 | CN101542717A Method of forming a micromechanical device with microfluidic lubricant channel |
| 09/23/2009 | CN101542702A Bonding method of three dimensional wafer lamination based on silicon through holes |
| 09/23/2009 | CN101542701A Bonding method of three dimensional wafer lamination based on silicon through holes |
| 09/23/2009 | CN101541159A Boiling heat transfer device of electronic component |
| 09/23/2009 | CN101541158A Fixer, heat radiator module set with same and electronic equipment with same |
| 09/23/2009 | CN101541155A Heat dissipating combination |
| 09/23/2009 | CN101541143A Printed circuit board and electronic device |
| 09/23/2009 | CN101540503A Esd protection circuit and method thereof |
| 09/23/2009 | CN101540339A High-side NLDMOS structure |
| 09/23/2009 | CN101540333A Thin-film transistor substrate and display device having the same |
| 09/23/2009 | CN101540330A Active element array mother board |
| 09/23/2009 | CN101540329A Thin film transistor substrate and manufacturing process thereof |
| 09/23/2009 | CN101540324A Semiconductor device |
| 09/23/2009 | CN101540323A Programmable semiconductor antisurge protective device, fabricating process and layout |
| 09/23/2009 | CN101540322A Semiconductor component and manufacturing method thereof |
| 09/23/2009 | CN101540320A Static discharge protection diode |
| 09/23/2009 | CN101540316A 集成电路芯片 IC chip |
| 09/23/2009 | CN101540314A Light-emitting diode element and forming method thereof |
| 09/23/2009 | CN101540313A Switching assembly with bond connection |
| 09/23/2009 | CN101540312A Stacked chip encapsulation structure |
| 09/23/2009 | CN101540311A Multilayer wiring substrate and method of manufacturing the same |
| 09/23/2009 | CN101540310A Semiconductor chip package and manufacturing methods thereof |
| 09/23/2009 | CN101540309A Semiconductor chip package and manufacturing methods thereof |
| 09/23/2009 | CN101540308A Semiconductor chip package |
| 09/23/2009 | CN101540307A Semiconductor encapsulation structure with pins on chip and applicable lead frame thereof |
| 09/23/2009 | CN101540306A Semiconductor wafer encapsulation body and encapsulation method thereof |