Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2009
10/01/2009WO2009095486A3 Semiconductor package
10/01/2009WO2009088869A3 Multiple access over proximity communication
10/01/2009US20090246909 Semiconductor device and method of manufacturing the same
10/01/2009US20090246892 Sensor, method, and design structure for a low-k delamination sensor
10/01/2009US20090246891 Mark forming method and method for manufacturing semiconductor device
10/01/2009US20090245308 Active solid heatsink device and fabricating method thereof
10/01/2009US20090244868 Semiconductor device and bonding material
10/01/2009US20090243985 Contact structure of conductive films and thin film transistor array panel including the same
10/01/2009US20090243123 Increasing Exposure Tool Alignment Signal Strength for a Ferroelectric Capacitor Layer
10/01/2009US20090243122 Alignment mark for opaque layer
10/01/2009US20090243121 Semiconductor integrated circuit and layout method for the same
10/01/2009US20090243120 Semiconductor element and semiconductor element fabrication method
10/01/2009US20090243119 Semiconductor integrated circuit
10/01/2009US20090243118 Semiconductor device and manufacturing method of the same
10/01/2009US20090243117 Contact structure, a semiconductor device employing the same, and methods of manufacturing the same
10/01/2009US20090243116 Reducing patterning variability of trenches in metallization layer stacks with a low-k material by reducing contamination of trench dielectrics
10/01/2009US20090243115 Semiconductor device and method of manufacturing the same
10/01/2009US20090243114 Densely packed metal segments patterned in a semiconductor die
10/01/2009US20090243113 Semiconductor structure
10/01/2009US20090243112 against the diffusing copper from the interconnection body side or the diffusing silicon from the insulating film side
10/01/2009US20090243111 Semiconductor substrate, electrode forming method, and solar cell fabricating method
10/01/2009US20090243110 Voltage controlled oscillator
10/01/2009US20090243109 Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices
10/01/2009US20090243108 Control of localized air gap formation in an interconnect stack
10/01/2009US20090243107 Novel approach to high temperature wafer processing
10/01/2009US20090243106 Structures and methods to enhance copper metallization
10/01/2009US20090243105 Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer
10/01/2009US20090243104 Forming thick metal interconnect structures for integrated circuits
10/01/2009US20090243103 Synthesis of zeolite crystals and formation of carbon nanostructures in patterned structures
10/01/2009US20090243102 Method of aligning deposited nanotubes onto an etched feature using a spacer
10/01/2009US20090243101 Method for forming interconnection levels of an integrated circuit
10/01/2009US20090243100 Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate
10/01/2009US20090243099 Window type bga semiconductor package and its substrate
10/01/2009US20090243098 Underbump metallurgy for enhanced electromigration resistance
10/01/2009US20090243097 Semiconductor device having low dielectric constant film and manufacturing method thereof
10/01/2009US20090243096 Semiconductor device and fabrication method thereof
10/01/2009US20090243095 Substrate, manufacturing method thereof, method for manufacturing semiconductor device
10/01/2009US20090243094 Semiconductor device and manufacturing method thereof
10/01/2009US20090243093 Contact structure and connecting structure
10/01/2009US20090243092 Semiconductor device and manufacturing method of semiconductor device
10/01/2009US20090243091 Mock bump system for flip chip integrated circuits
10/01/2009US20090243090 Mock bump system for flip chip integrated circuits
10/01/2009US20090243089 Module including a rough solder joint
10/01/2009US20090243088 Multiple Layer Metal Integrated Circuits and Method for Fabricating Same
10/01/2009US20090243087 Semiconductor device and method for manufacturing same
10/01/2009US20090243086 Enhanced Thermal Dissipation Ball Grid Array Package
10/01/2009US20090243085 Apparatus and method for attaching a heat dissipating device
10/01/2009US20090243084 Suspension microstructure and a fabrication method for the same
10/01/2009US20090243083 Wafer Integrated with Permanent Carrier and Method Therefor
10/01/2009US20090243082 Integrated circuit package system with planar interconnect
10/01/2009US20090243081 System and method of forming a wafer scale package
10/01/2009US20090243080 Flip Chip Interconnection Structure with Bump on Partial Pad and Method Thereof
10/01/2009US20090243079 Semiconductor device package
10/01/2009US20090243078 Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same
10/01/2009US20090243077 Integrated circuit package system with rigid locking lead
10/01/2009US20090243076 Electronic system modules and method of fabrication
10/01/2009US20090243075 Mounting structure of semiconductor device and electronic apparatus using same
10/01/2009US20090243074 Semiconductor through silicon vias of variable size and method of formation
10/01/2009US20090243073 Stacked integrated circuit package system
10/01/2009US20090243072 Stacked integrated circuit package system
10/01/2009US20090243071 Integrated circuit package system with stacking module
10/01/2009US20090243070 Integrated circuit package system with support structure under wire-in-film adhesive
10/01/2009US20090243069 Integrated circuit package system with redistribution
10/01/2009US20090243068 Integrated circuit package system with non-symmetrical support structures
10/01/2009US20090243067 Mountable integrated circuit package system with substrate
10/01/2009US20090243066 Mountable integrated circuit package system with exposed external interconnects
10/01/2009US20090243065 Semiconductor Device and Method for Manufacturing Semiconductor Device
10/01/2009US20090243064 Method and Apparatus For a Package Having Multiple Stacked Die
10/01/2009US20090243063 Packaging method of micro electro mechanical system device and package thereof
10/01/2009US20090243062 Ic tag and manufacturing method of the same
10/01/2009US20090243061 Complex Semiconductor Packages and Methods of Fabricating the Same
10/01/2009US20090243060 Lead frame and package of semiconductor device
10/01/2009US20090243059 Semiconductor package structure
10/01/2009US20090243058 Lead frame and package of semiconductor device
10/01/2009US20090243057 Semiconductor Chip Package Assembly Method and Apparatus for Countering Leadfinger Deformation
10/01/2009US20090243056 Chip package having asymmetric molding
10/01/2009US20090243055 Leadframe, semiconductor packaging structure and manufacturing method thereof
10/01/2009US20090243054 I/o connection scheme for qfn leadframe and package structures
10/01/2009US20090243053 Structure for reduction of soft error rates in integrated circuits
10/01/2009US20090243052 Electronic device with shielding structure and method of manufacturing the same
10/01/2009US20090243051 Integrated conductive shield for microelectronic device assemblies and associated methods
10/01/2009US20090243050 Isolation Structure in Memory Device and Method for Fabricating the Same
10/01/2009US20090243049 Double deposition of a stress-inducing layer in an interlayer dielectric with intermediate stress relaxation in a semiconductor device
10/01/2009US20090243048 Metallic nanocrystal encapsulation
10/01/2009US20090243047 Semiconductor Device With an Interconnect Element and Method for Manufacture
10/01/2009US20090243046 Pulse-Laser Bonding Method for Through-Silicon-Via Based Stacking of Electronic Components
10/01/2009US20090243045 Through Hole Vias at Saw Streets Including Protrusions or Recesses for Interconnection
10/01/2009US20090243038 Method of manufacturing semiconductor device and semiconductor device
10/01/2009US20090243035 Semiconductor device and method of manufacturing the same and semiconductor device mounting structure
10/01/2009US20090243033 Fuse part in semiconductor device and method for forming the same
10/01/2009US20090243032 Electrical fuse structure
10/01/2009US20090243012 Electromagnetic interference shield structures for semiconductor components
10/01/2009US20090243006 Electronic part with affixed mems
10/01/2009US20090242992 Inverter, logic circuit including an inverter and methods of fabricating the same
10/01/2009US20090242928 Resin sheet for encapsulating optical semiconductor element and optical semiconductor device
10/01/2009US20090242926 Package for optical semiconductor element
10/01/2009US20090242914 Led assembly with high heat dissipating capability
10/01/2009US20090242912 Multifunctional tape
10/01/2009US20090242905 Semiconductor device, optical print head and image forming apparatus
10/01/2009US20090242882 Three-dimensional microstructures and methods for making same
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