| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/20/2009 | WO2009100614A1 Electronic circuit package |
| 08/20/2009 | WO2009100588A1 A led base structure capable of improving the extraction efficiency |
| 08/20/2009 | WO2009077268A3 Cooling body of at least one electrical component |
| 08/20/2009 | WO2009074303A8 Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
| 08/20/2009 | WO2009052816A3 Substrate for semiconductor elements |
| 08/20/2009 | WO2007078148A3 Flip chip mount type of bump, manufacturing method thereof, and bonding method for flip chip using non conductive adhesive |
| 08/20/2009 | US20090210164 Analyte monitoring device and methods of use |
| 08/20/2009 | US20090209838 Analyte Monitoring Device and Methods of Use |
| 08/20/2009 | US20090209063 Chipstack package and manufacturing method thereof |
| 08/20/2009 | US20090207640 Semiconductor device |
| 08/20/2009 | US20090207575 Oc2 oriented connections 2 |
| 08/20/2009 | US20090206946 Apparatus and method for reducing propagation delay in a conductor |
| 08/20/2009 | US20090206865 Electrical test structure and method for characterization of deep trench sidewall reliability |
| 08/20/2009 | US20090206495 Semiconductor Device and Method for Manufacturing Same |
| 08/20/2009 | US20090206494 Wiring over substrate, semiconductor device, and methods for manufacturing thereof |
| 08/20/2009 | US20090206493 Flip Chip Interconnection Pad Layout |
| 08/20/2009 | US20090206492 Semiconductor device |
| 08/20/2009 | US20090206491 Semiconductor device |
| 08/20/2009 | US20090206490 semiconductor device and a method of manufacturing the sae |
| 08/20/2009 | US20090206489 Dual damascene metal interconnect structure having a self-aligned via |
| 08/20/2009 | US20090206488 Through substrate annular via including plug filler |
| 08/20/2009 | US20090206487 Wire bonding substrate and fabrication thereof |
| 08/20/2009 | US20090206486 Wirebond over post passivation thick metal |
| 08/20/2009 | US20090206485 Novel structure and method for metal integration |
| 08/20/2009 | US20090206484 Microstructure modification in copper interconnect structure |
| 08/20/2009 | US20090206483 Nanotube and metal composite interconnects |
| 08/20/2009 | US20090206482 Tooling method for fabricating a semiconductor device and semiconductor devices fabricated thereof |
| 08/20/2009 | US20090206481 Stacking of transfer carriers with aperture arrays as interconnection joints |
| 08/20/2009 | US20090206480 Fabricating low cost solder bumps on integrated circuit wafers |
| 08/20/2009 | US20090206479 Solder interconnect pads with current spreading layers |
| 08/20/2009 | US20090206478 Flip chip device and manufacturing method thereof |
| 08/20/2009 | US20090206477 Semiconductor device and method of manufacturing semiconductor device |
| 08/20/2009 | US20090206476 Conductive structure for a semiconductor integrated circuit |
| 08/20/2009 | US20090206475 Method of manufacturing semiconductor device, and semiconductor device |
| 08/20/2009 | US20090206474 Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film |
| 08/20/2009 | US20090206473 System and Method for Integrated Waveguide Packaging |
| 08/20/2009 | US20090206472 Cof packaging structure, method of manufacturing the cof packaging structure, and method for assembling a driver ic and the cof packaging structure thereof |
| 08/20/2009 | US20090206471 Electronic parts packaging structure and method of manufacturing the same |
| 08/20/2009 | US20090206470 Semiconductor device manufacturing method, semiconductor device, and wiring board |
| 08/20/2009 | US20090206469 Semiconductor device and method of manufacturing semiconductor device |
| 08/20/2009 | US20090206468 Board on chip package and manufacturing method thereof |
| 08/20/2009 | US20090206467 Integrated circuit package |
| 08/20/2009 | US20090206466 Semiconductor device |
| 08/20/2009 | US20090206465 Semiconductor chip package structure for achieving electrical connection without using a wire-bonding process and method for making the same |
| 08/20/2009 | US20090206464 Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same |
| 08/20/2009 | US20090206463 Semiconductor device, method of manufacturing the same, and electronic equipment using the same |
| 08/20/2009 | US20090206461 Integrated circuit and method |
| 08/20/2009 | US20090206460 Intermediate Bond Pad for Stacked Semiconductor Chip Package |
| 08/20/2009 | US20090206459 Quad flat non-leaded package structure |
| 08/20/2009 | US20090206458 Flat leadless packages and stacked leadless package assemblies |
| 08/20/2009 | US20090206457 Resin molding part and manufacturing method thereof |
| 08/20/2009 | US20090206456 Module including a sintered joint bonding a semiconductor chip to a copper surface |
| 08/20/2009 | US20090206455 Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom |
| 08/20/2009 | US20090206447 Anti-fuse device structure and electroplating circuit structure and method |
| 08/20/2009 | US20090206446 Electrical Device and Fabrication Method |
| 08/20/2009 | US20090206445 Semiconductor device and method of forming the same |
| 08/20/2009 | US20090206444 Integrated semiconductor device |
| 08/20/2009 | US20090206442 Method and structure for relieving transistor performance degradation due to shallow trench isolation induced stress |
| 08/20/2009 | US20090206440 Power Semiconductor Device |
| 08/20/2009 | US20090206411 Semiconductor device and a method of manufacturing the same |
| 08/20/2009 | US20090206381 Anti-fuse and method for forming the same, unit cell of nonvolatile memory device with the same |
| 08/20/2009 | US20090206349 Semiconductor device and method of manufacturing the same |
| 08/20/2009 | US20090206334 Display substrate, display panel having the same, and method of testing a display substrate |
| 08/20/2009 | DE202009007822U1 Kühlvorrichtung LED-Lampen Cooler LED lamps |
| 08/20/2009 | DE10220924B4 Sensorschaltungsmodul und elektronische Vorrichtung unter Verwendung desselben The same sensor circuit module and electronic device using |
| 08/20/2009 | DE102008009913A1 Electronic power converter module for power electronics, has semiconductor module, which is arranged on base body, and has two direct current connections |
| 08/20/2009 | DE102007030812B4 Metallische Leitung in Halbleitervorrichtung und Verfahren zum Bilden derselben Metallic lead in the semiconductor device and method of forming same |
| 08/20/2009 | DE102005014176B4 Verfahren zum Erstellen einer Schutzanordnung zum Schutz eines Elektronikbausteins vor elektrostatischen Entladungen und entsprechend ausgebildeter Elektronikbaustein Method for creating a protective order to protect an electronic module from ESD and appropriately designed electronic module |
| 08/20/2009 | DE102005008491B4 Leistungs-Halbleitervorrichtung und Verfahren zu ihrer Herstellung Power semiconductor device and process for their preparation |
| 08/20/2009 | DE102004042168B4 Halbleiterelement mit einem Metallisierungsschichtstapel mit kleinem ε mit erhöhter Widerstandsfähigkeit gegen Elektromigration und Verfahren zum Bilden des Halbleiterelements Semiconductor element having a metallization layer with a small ε with increased resistance to electromigration and method for forming the semiconductor element |
| 08/20/2009 | CA2715344A1 Semiconductor element module and method for manufacturing the same |
| 08/20/2009 | CA2708207A1 Through substrate annular via including plug filler |
| 08/19/2009 | EP2091081A1 Switching assembly with bond connection |
| 08/19/2009 | EP2091079A1 Outdoor-type high-power light emitting diode illumination device |
| 08/19/2009 | EP2091078A1 Electronic component for surface mounting |
| 08/19/2009 | EP2091072A1 Conductive film forming method, thin film transistor, panel with thin film transistor and thin film transistor manufacturing method |
| 08/19/2009 | EP2090633A1 Dicing Die-Bonding Film |
| 08/19/2009 | EP2090146A1 Electronic device and frequency converter of motor |
| 08/19/2009 | EP2089911A1 Heat dissipation system for photovoltaic array interconnection sytem |
| 08/19/2009 | EP2089904A1 Semiconductor component |
| 08/19/2009 | EP2089903A2 Latch-up free vertical tvs diode array structure using trench isolation |
| 08/19/2009 | EP2089902A1 Pulsating cooling system |
| 08/19/2009 | EP2089901A2 Microcircuit package having ductile layer |
| 08/19/2009 | EP2089900A1 Fabrication of a diffusion barrier cap on copper containing conductive elements |
| 08/19/2009 | EP2089838A2 Chip module for an rfid system |
| 08/19/2009 | EP1745256A4 Multiple evaporator heat pipe assisted heat sink |
| 08/19/2009 | EP1204136B1 Method of fabricating a packaged semiconductor device |
| 08/19/2009 | EP1118122B1 Integrated circuit and method for producing the same |
| 08/19/2009 | EP1060513B1 Semiconductor component with several semiconductor chips |
| 08/19/2009 | CN201294709Y Prick piece packed radiator |
| 08/19/2009 | CN201294708Y Passive radiator |
| 08/19/2009 | CN201294706Y Composite material tube cold type radiator |
| 08/19/2009 | CN201294705Y High-power power supply self-cooling type radiator |
| 08/19/2009 | CN201294704Y Cooling device for high-power electronic device |
| 08/19/2009 | CN201294702Y 散热模组结构 Cooling module structure |
| 08/19/2009 | CN201294701Y Water-cooling cooling device for electrical component of intermediate frequency power supply heating equipment |
| 08/19/2009 | CN201294700Y Joining structure for radiating fin and pipe |
| 08/19/2009 | CN201294452Y Water cooling device for converter power module |
| 08/19/2009 | CN201294451Y Cascade press-loading thyristor variable flow module |
| 08/19/2009 | CN201294227Y Conductor frame structure of LED |