| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/01/2009 | US20090242268 Semiconductor device capable of switching operation modes |
| 10/01/2009 | US20090242122 Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device |
| 10/01/2009 | DE202009009818U1 Befestigungsbaugruppe für ein Kühlmodul Mounting assembly for a cooling module |
| 10/01/2009 | DE202009009817U1 Schnelllöseanordnung für ein Kühlmodul sowie Kühlmodul Quick release arrangement for a cooling module and cooling module |
| 10/01/2009 | DE19953843B4 Verfahren zur Herstellung einer Kupferverdrahtung für eine Halbleitervorrichtung A process for producing a copper wiring for a semiconductor device |
| 10/01/2009 | DE102009012643A1 Connecting structure for connecting electronic component i.e. semiconductor chip, and/or substrate carrier on organic printed circuit board, has contact elements at which material of component or carrier is removed for forming free area |
| 10/01/2009 | DE102009012524A1 Halbleitermodul Semiconductor module |
| 10/01/2009 | DE102009007708A1 Elektronikeinrichtung Electronic device |
| 10/01/2009 | DE102009000625A1 Zweifach-Damascene-Prozess Dual damascene process |
| 10/01/2009 | DE102009000588A1 Leistungshalbleitermodul mit verbesserter Isolationsfestigkeit und Verfahren zur Herstellung eines Leistungshalbleitermoduls mit verbesserter Isolationsfestigkeit Power semiconductor module with improved insulation resistance and method for producing a power semiconductor module with improved insulation resistance |
| 10/01/2009 | DE102008016534A1 Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauelements Radiation-emitting semiconductor device and method of manufacturing a radiation-emitting semiconductor component |
| 10/01/2009 | DE102008016458A1 Printed circuit board for use in e.g. lighting device, has heat dissipating element arranged in through-hole, and radiation source i.e. LED, arranged on heat dissipating element, where heat dissipating element is electrically conductive |
| 10/01/2009 | DE102008016424A1 Verringern der Strukturierungsschwankung von Gräben in Metallisierungsschichtstapeln mit einem Material mit kleinem ε durch Verringerung der Kontamination der Grabendielektrika Reduce the fluctuation of patterning trenches in Metallisierungsschichtstapeln with a material with a small ε, by reducing the contamination of the Grabendielektrika |
| 10/01/2009 | DE102008014750A1 Device for protecting electronic or micro system technical component before mechanical or chemical interference, has nanofilm which is applied on electronic component, where two electrodes are bypassed with interference |
| 10/01/2009 | DE102008014112A1 Power semiconductor module for use on cooling component, has contact elements with contact section exhibiting deformation turned away from other contact section and forming contact surface for contacting with paths |
| 10/01/2009 | DE102008014111A1 Teststrukturen zur Überprüfung der Positioniergenauigkeit bei Herstellungsprozessen von mikroelektronischen Schaltkreisen Test structures for testing the positioning accuracy in manufacturing processes of microelectronic circuits |
| 10/01/2009 | DE102008000842A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly |
| 10/01/2009 | DE102008000825A1 Insulating material metal composite substrate, particularly ceramic metal composite substrate, has insulating layer, metal conductive paths, and power elements |
| 10/01/2009 | DE102004063143B4 Dummy-Schicht bei einem Halbleiter-Bauelement und Herstellungsverfahren dafür Dummy layer in a semiconductor device and manufacturing method thereof |
| 10/01/2009 | DE10064042B4 Verfahren zur Herstellung einer Kupferverdrahtung in einem Halbleiterbauelement A process for producing a copper wiring in a semiconductor device |
| 09/30/2009 | EP2106002A2 Package for optical semiconductor element |
| 09/30/2009 | EP2105975A1 Resin sheet for encapsulating optical semiconductor element and optical semiconductor device |
| 09/30/2009 | EP2105961A2 Method and system for inter-chip communication via package waveguides |
| 09/30/2009 | EP2105953A1 Amorphous carbon film, semiconductor device, film forming method, film forming apparatus and storage medium |
| 09/30/2009 | EP2105466A1 Curable silicone rubber composition and semiconductor devices |
| 09/30/2009 | EP1576649B1 Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same |
| 09/30/2009 | EP1442479B1 Method of forming reliable cu interconnects |
| 09/30/2009 | CN201319375Y Double-slide holder lead frame structure |
| 09/30/2009 | CN201319374Y Integrated circuit chip packing structure made from ultrasonic copper wire |
| 09/30/2009 | CN201319373Y Improved structure of heat radiation device for memory |
| 09/30/2009 | CN101548379A Electronic component module and method for production thereof |
| 09/30/2009 | CN101548378A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/30/2009 | CN101548377A Packaged integrated circuit with enhanced thermal dissipation |
| 09/30/2009 | CN101547588A Cooling device for accommodated printed circuit board in a chassis |
| 09/30/2009 | CN101547586A Heat sink, heat sink combination and fixing device thereof |
| 09/30/2009 | CN101547585A Heat sink |
| 09/30/2009 | CN101547584A Heat sink, heat sink combination and fixing device thereof |
| 09/30/2009 | CN101547583A Heat sink combination with protective device |
| 09/30/2009 | CN101546907A Electrostatic protection circuit and active-element array substrate |
| 09/30/2009 | CN101546803A 光学半导体器件 The optical semiconductor device |
| 09/30/2009 | CN101546802A Resin sheet for encapsulating optical semiconductor element and optical semiconductor device |
| 09/30/2009 | CN101546775A Semiconductor device, electrooptical apparatus, and electronic apparatus |
| 09/30/2009 | CN101546774A Active element array substrate |
| 09/30/2009 | CN101546765A High-frequency integrated circuit |
| 09/30/2009 | CN101546763A Embedded memory device and procedure method thereof |
| 09/30/2009 | CN101546762A Light-emitting diode and manufacturing method thereof |
| 09/30/2009 | CN101546760A Inverse parallel double diode |
| 09/30/2009 | CN101546759A Method for manufacturing an electronic module and an electronic module |
| 09/30/2009 | CN101546757A Packaging structure of card type memory |
| 09/30/2009 | CN101546754A LED module |
| 09/30/2009 | CN101546753A Double-purpose light-gathering solar cell component for electricity generation and LED illumination |
| 09/30/2009 | CN101546752A Semiconductor device |
| 09/30/2009 | CN101546751A Electro-migration testing structure capable of improving service life |
| 09/30/2009 | CN101546750A 半导体集成电路 The semiconductor integrated circuit |
| 09/30/2009 | CN101546749A Electrical fuse structure |
| 09/30/2009 | CN101546748A Semiconductor device and manufacturing method thereof |
| 09/30/2009 | CN101546747A Method for planning power supply network and integrated circuit layout structure thereof |
| 09/30/2009 | CN101546746A Insulating layer for guaranteeing cis-tapered contact holes and manufacturing method thereof |
| 09/30/2009 | CN101546745A Chip interconnect swizzle mechanism |
| 09/30/2009 | CN101546744A Leadframe for semiconductor packages |
| 09/30/2009 | CN101546743A Mounting structure of semiconductor device and electronic apparatus using same |
| 09/30/2009 | CN101546742A Mounting structure of semiconductor device and electronic apparatus using thereof |
| 09/30/2009 | CN101546741A Contact element, power semiconductor module and circuit apparatus comprising the module |
| 09/30/2009 | CN101546740A Embedded printed circuit board and manufacturing method thereof |
| 09/30/2009 | CN101546739A Chip packaging structure reaching electrical connection without routing and method for manufacturing same |
| 09/30/2009 | CN101546738A A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate |
| 09/30/2009 | CN101546737A Package structure of compound semiconductor component and manufacturing method thereof |
| 09/30/2009 | CN101546736A Semiconductor wafer, semiconductor device, and method of manufacturing semiconductor device |
| 09/30/2009 | CN101546735A Packaging structure of bug-hole downwards wafer and manufacturing method thereof |
| 09/30/2009 | CN101546734A Semiconductor element and semiconductor element fabrication method |
| 09/30/2009 | CN101546731A Vertical channel transistor in semiconductor device and method of fabricating the same |
| 09/30/2009 | CN101546719A Highly-reliable semiconductor plastic packaging body and method for welding bonding wires thereof |
| 09/30/2009 | CN101546718A Semiconductor device package and method of making a semiconductor device package |
| 09/30/2009 | CN101546717A Method and apparatus for applying heat-conducting silicone grease on semiconductor devices |
| 09/30/2009 | CN101546711A Conducting wire frame and method for manufacturing same |
| 09/30/2009 | CN101545622A Light emitting diode illumination device |
| 09/30/2009 | CN101545621A Illumination device and radiation structure thereof |
| 09/30/2009 | CN101545620A Led lamp |
| 09/30/2009 | CN101545615A Light emitting diode surface light source device |
| 09/30/2009 | CN101545586A Heat-radiation LED illuminating lamp of loop heat-tube heat radiator |
| 09/30/2009 | CN101545127A Process for producing electronically-encapsulated metal cover plate |
| 09/30/2009 | CN101544833A Curable silicone rubber composition and semiconductor devices |
| 09/30/2009 | CN101544089A Heat-conductive laminated material and manufacturing method thereof |
| 09/30/2009 | CN100546132C Optical modulator module |
| 09/30/2009 | CN100546028C 半导体装置 Semiconductor device |
| 09/30/2009 | CN100546025C Semiconductor device and manufacture method thereof |
| 09/30/2009 | CN100546024C Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor |
| 09/30/2009 | CN100546023C Electronic structures utilizing etch resistant boron and phosphorus materials and methods to form same |
| 09/30/2009 | CN100546022C Shadow mask gas phase deposition system and shadow mask gas phase deposition method |
| 09/30/2009 | CN100546021C 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 09/30/2009 | CN100546020C Wafer level package configured to compensate size difference in different types of packages |
| 09/30/2009 | CN100546019C Heat radiator, circuit board, electronic equipment |
| 09/30/2009 | CN100546018C Epoxy bleedout-preventing agent and method, wiring substrate and semiconductor package |
| 09/30/2009 | CN100546017C Silicon based compliant substrate material for zinc oxide epitaxial film growth |
| 09/29/2009 | US7596477 Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method |
| 09/29/2009 | US7595997 Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component |
| 09/29/2009 | US7595991 Using the wave soldering process to attach motherboard chipset heat sinks |
| 09/29/2009 | US7595562 Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device |
| 09/29/2009 | US7595561 Semiconductor device including multiple rows of peripheral circuit units |
| 09/29/2009 | US7595560 Semiconductor device |