| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/29/2009 | US7595559 Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip |
| 09/29/2009 | US7595558 Semiconductor device and method of manufacturing the same |
| 09/29/2009 | US7595555 Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures |
| 09/29/2009 | US7595553 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
| 09/29/2009 | US7595552 Stacked semiconductor package in which semiconductor packages are connected using a connector |
| 09/29/2009 | US7595551 Semiconductor package for a large die |
| 09/29/2009 | US7595550 Flex-based circuit module |
| 09/29/2009 | US7595549 Surface mount semiconductor device |
| 09/29/2009 | US7595548 Physical quantity sensor and manufacturing method therefor |
| 09/29/2009 | US7595547 Semiconductor die package including cup-shaped leadframe |
| 09/29/2009 | US7595546 Printed circuit board |
| 09/29/2009 | US7595545 Anodic bonding apparatus, anodic bonding method, and method of producing acceleration sensor |
| 09/29/2009 | US7595537 MOS type semiconductor device having electrostatic discharge protection arrangement |
| 09/29/2009 | US7595270 Passivated stoichiometric metal nitride films |
| 09/29/2009 | US7595268 Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same |
| 09/29/2009 | US7595260 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices |
| 09/29/2009 | US7595229 Configurable integrated circuit capacitor array using via mask layers |
| 09/29/2009 | US7595228 Method for manufacturing electronic component-mounted board |
| 09/29/2009 | US7595227 Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same |
| 09/29/2009 | US7595226 Method of packaging an integrated circuit die |
| 09/29/2009 | US7595223 Process for bonding and electrically connecting microsystems integrated in several distinct substrates |
| 09/29/2009 | US7595222 Semiconductor device and manufacturing method thereof |
| 09/29/2009 | US7595220 Image sensor package and fabrication method thereof |
| 09/29/2009 | US7595120 Higher melting substrate is an oxide or nitride of aluminum, titanium or zirconium; layer is silica powder, glass powder, glaze powder, copper oxide, lead oxide, hafnium oxide, or boron oxide and has embedded nanostructure stalagmites or columns extending towards the substrate; no polishing required |
| 09/29/2009 | US7595017 Method for using a pre-formed film in a transfer molding process for an integrated circuit |
| 09/29/2009 | US7594644 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
| 09/29/2009 | US7594322 Methods of fabricating substrates including at least one conductive via |
| 09/29/2009 | US7594320 Method of manufacturing printed wiring board |
| 09/29/2009 | CA2388300C Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 09/24/2009 | WO2009117476A2 Method of fabricating a semiconductor package or circuit assembly using a fluxing underfill composition applied to solder contact points in a dip process |
| 09/24/2009 | WO2009117255A2 Tungsten liner for aluminum-based electromigration resistant interconnect structure |
| 09/24/2009 | WO2009117006A1 Apparatus and method for series connection of two die or chips in single electronics package |
| 09/24/2009 | WO2009116677A1 Semiconductor apparatus manufacturing method and semiconductor apparatus |
| 09/24/2009 | WO2009116585A1 Power module |
| 09/24/2009 | WO2009116523A1 Piezoelectric device |
| 09/24/2009 | WO2009116517A1 Electronic device and method for manufacturing the same |
| 09/24/2009 | WO2009116457A1 Wiring board for mounting light emitting element thereon, and light emitting device |
| 09/24/2009 | WO2009116455A1 Piezoelectric fan and cooling device employing said fan |
| 09/24/2009 | WO2009116439A1 Substrate for power module with heat sink and method for producing the same, power module with heat sink, and substrate for power module |
| 09/24/2009 | WO2009116426A1 Electronic component and method for manufacturing the same |
| 09/24/2009 | WO2009116403A1 Multilayer dielectric substrate, and semiconductor package |
| 09/24/2009 | WO2009116357A1 Highly thermal conductive resin molded product |
| 09/24/2009 | WO2009116347A1 Electronic member wherein barrier-seed layer is formed on base |
| 09/24/2009 | WO2009116346A1 Electronic member wherein barrier-seed layer is formed on base |
| 09/24/2009 | WO2009116245A1 Heat spreader and method for manufacturing the same |
| 09/24/2009 | WO2009116202A1 Mounted board, mounted board set, and panel unit |
| 09/24/2009 | WO2009116177A1 Optical matrix device |
| 09/24/2009 | WO2009116162A1 Process for manufacture of packaged micro moving element, and packaged micro moving element |
| 09/24/2009 | WO2009115910A1 Die substrate with reinforcement structure |
| 09/24/2009 | WO2009115686A2 Connection component with hollow inserts and method for making same |
| 09/24/2009 | WO2009115673A2 Contactless object with integrated circuit connected to circuit terminals by capacitive coupling |
| 09/24/2009 | WO2009115551A1 Method for making microstructures by converting porous silicon into porous metal or ceramics |
| 09/24/2009 | WO2009115449A1 Method for fabricating through-substrate vias |
| 09/24/2009 | WO2009094558A3 Method for reversibly mounting a device wafer to a carrier substrate |
| 09/24/2009 | WO2009079651A3 Electronic device package and method of formation |
| 09/24/2009 | WO2009059015A3 Method of protecting circuits using integrated array fuse elements and process for fabrication |
| 09/24/2009 | WO2009052814A3 Cooling device for semiconductor elements, semiconductor cooling arrangement and method for producing the same |
| 09/24/2009 | WO2009048604A3 Robust multi-layer wiring elements and assemblies with embedded microelectronic elements |
| 09/24/2009 | WO2009017271A3 Metal-based package substrate, three-dimensional multi-layered package module using the same, and manufacturing method thereof |
| 09/24/2009 | WO2009001982A3 Metal-based photonic device package module and manufacturing method thereof |
| 09/24/2009 | WO2008115468A3 Integrated circuits and interconnect structure for integrated circuits |
| 09/24/2009 | US20090240451 Mos capacitance test structure and associated method for measuring a curve of capacitance as a function of the voltage |
| 09/24/2009 | US20090239377 Semiconductor device and method for manufacturing the same |
| 09/24/2009 | US20090239372 Seed Layers for Electroplated Interconnects |
| 09/24/2009 | US20090239329 Method for manufacturing package structure of optical device |
| 09/24/2009 | US20090237105 Semiconductor Arrangement and Method for the Measurement of a Resistance |
| 09/24/2009 | US20090237103 Image sensor monitor structure in scribe area |
| 09/24/2009 | US20090236760 Substrate for a display panel, and a display panel having the same |
| 09/24/2009 | US20090236759 Curable silicone rubber composition and semiconductor device |
| 09/24/2009 | US20090236758 Semiconductor module |
| 09/24/2009 | US20090236757 Semiconductor device and method for manufacturing |
| 09/24/2009 | US20090236756 Flip chip interconnection system |
| 09/24/2009 | US20090236755 Chip package structure |
| 09/24/2009 | US20090236754 Integrated circuit package system with stacking module |
| 09/24/2009 | US20090236753 Integrated circuit package system for stackable devices |
| 09/24/2009 | US20090236752 Package-on-package system with via z-interconnections |
| 09/24/2009 | US20090236751 Integrated circuit package system with support structure for die overhang |
| 09/24/2009 | US20090236750 Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof |
| 09/24/2009 | US20090236749 Electronic device and manufacturing thereof |
| 09/24/2009 | US20090236748 Semiconductor device and method of manufacturing a semiconductor device |
| 09/24/2009 | US20090236747 Semiconductor device and method for fabricating the same |
| 09/24/2009 | US20090236746 Semiconductor device and method for fabricating semiconductor device |
| 09/24/2009 | US20090236745 Adhesion to Copper and Copper Electromigration Resistance |
| 09/24/2009 | US20090236744 Semiconductor device and method of producing the same |
| 09/24/2009 | US20090236743 Programmable Resistive RAM and Manufacturing Method |
| 09/24/2009 | US20090236742 Wire bonding over active circuits |
| 09/24/2009 | US20090236741 Conductive structure of a chip and method for manufacturing the same |
| 09/24/2009 | US20090236740 Window ball grid array package |
| 09/24/2009 | US20090236739 Semiconductor package having substrate id code and its fabricating method |
| 09/24/2009 | US20090236738 Semiconductor Device and Method of Forming Oxide Layer on Signal Traces for Electrical Isolation in Fine Pitch Bonding |
| 09/24/2009 | US20090236737 Rf transistor output impedance technique for improved efficiency, output power, and bandwidth |
| 09/24/2009 | US20090236736 Microelectronic devices and methods for manufacturing microelectronic devices |
| 09/24/2009 | US20090236735 Upgradeable and repairable semiconductor packages and methods |
| 09/24/2009 | US20090236733 Ball grid array package system |
| 09/24/2009 | US20090236732 Thermally-enhanced multi-hole semiconductor package |
| 09/24/2009 | US20090236731 Stackable integrated circuit package system |
| 09/24/2009 | US20090236730 Die substrate with reinforcement structure |
| 09/24/2009 | US20090236729 Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof |
| 09/24/2009 | US20090236728 Semiconductor device |
| 09/24/2009 | US20090236727 Wiring substrate and method of manufacturing the same, and semiconductor device and method of manufacturing the same |