| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/09/2009 | CN101527291A Conducting wire frame structure |
| 09/09/2009 | CN101527290A Semiconductor module |
| 09/09/2009 | CN101527289A Semiconductor device and fabricating method thereof |
| 09/09/2009 | CN101527288A Contact point structure and jointing structure |
| 09/09/2009 | CN101527287A Wire bond structure and producing method thereof |
| 09/09/2009 | CN101527286A Semiconductor module and method of producing the same |
| 09/09/2009 | CN101527285A Crystal coated sealing structure with zone projection and its wedge bond process |
| 09/09/2009 | CN101527281A Active element array substrate and method for manufacturing same |
| 09/09/2009 | CN101527278A Through via process, semiconductor element and method for forming wafer stack |
| 09/09/2009 | CN101527198A Capacitor devices with co-coupling electrode planes |
| 09/09/2009 | CN101527131A Apparatus and method for distinguishing panel of display device |
| 09/09/2009 | CN101527100A Flat panel display apparatus |
| 09/09/2009 | CN101527005A Novel mobile phone function expansion card and method for achieving same |
| 09/09/2009 | CN101526205A Outdoor lamp |
| 09/09/2009 | CN101526204A High-power forced radiation type heat pipe LED illumination device |
| 09/09/2009 | CN101526203A LED luminaire |
| 09/09/2009 | CN101526202A Light-emitting diode (LED) illuminating apparatus |
| 09/09/2009 | CN101526201A LED lamp and heat radiating device thereof |
| 09/09/2009 | CN101526200A LED illumination device and radiating member thereof |
| 09/09/2009 | CN101526199A Backlight module and light-emitting device thereof |
| 09/09/2009 | CN101526198A LED lamp |
| 09/09/2009 | CN101526181A LED light source |
| 09/09/2009 | CN101525437A Modified polyaluminosiloxane |
| 09/09/2009 | CN101524902A Low-thermal resistance high-heat conductivity polymer dielectric composite material |
| 09/09/2009 | CN100539129C Semiconductor package and its manufacturing method |
| 09/09/2009 | CN100539127C Device package and methods for the fabrication and testing thereof |
| 09/09/2009 | CN100539119C Test base, test base mask and forming method of test base |
| 09/09/2009 | CN100539118C Dielectric materialand method to make the same |
| 09/09/2009 | CN100539117C Methods for incorporating high k dielectric materials for enhanced SRAM operation and structures produced thereby |
| 09/09/2009 | CN100539116C Semiconductor device and manufacturing method therefor |
| 09/09/2009 | CN100539115C 半导体器件 Semiconductor devices |
| 09/09/2009 | CN100539114C Roughness reducing film at interface, materials for forming roughness reducing film at interface, wiring layer and semiconductor device prepared by the same, and method for manufacturing semiconductor |
| 09/09/2009 | CN100539113C Anchored damascene structures |
| 09/09/2009 | CN100539112C Optimized power delivery to high speed, high pin-count devices |
| 09/09/2009 | CN100539111C Semiconductor encapsulation coiling belt |
| 09/09/2009 | CN100539110C Thin membrane crystal cover packaging construction for preventing thin membrane dent forming glue filling bubble |
| 09/09/2009 | CN100539109C Semiconductor packaging supported films and packaging construction for preventing rupture of pin buckle position |
| 09/09/2009 | CN100539108C Mounting structure and method of electronic component |
| 09/09/2009 | CN100539107C Circuit substrate for enhancing lead wire tensile strength and its integrated circuit package structure |
| 09/09/2009 | CN100539106C Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 09/09/2009 | CN100539105C TAB tape carrier |
| 09/09/2009 | CN100539104C Lead wire frame |
| 09/09/2009 | CN100539103C Semiconductor die package including universal footprint and method for manufacturing the same |
| 09/09/2009 | CN100539102C Electric connecting structure of circuit board embedding with semiconductor chip |
| 09/09/2009 | CN100539101C High-frequency integrated circuit package structure with unification projection jointing altitude and method for manufacturing the same |
| 09/09/2009 | CN100539100C Packaging structure and its manufacturing method |
| 09/09/2009 | CN100539099C Novel bonding and probing pad structures |
| 09/09/2009 | CN100539098C Soldered ball redistribution connecting structure |
| 09/09/2009 | CN100539097C Semiconductor device of chip constitution and manufacturing method thereof |
| 09/09/2009 | CN100539096C Semiconductor device and producing method thereof |
| 09/09/2009 | CN100539095C Spray cooling with spray deflection |
| 09/09/2009 | CN100539094C Heat sink, an electronic component package, and a method of manufacturing a heat sink |
| 09/09/2009 | CN100539093C Heat sink packaging assembly for electronic components |
| 09/09/2009 | CN100539092C Semiconductor device and method of manufacturing thereof |
| 09/09/2009 | CN100539091C Chip package structure |
| 09/09/2009 | CN100539090C 半导体装置 Semiconductor device |
| 09/09/2009 | CN100539089C Semiconductor device and method for manufacturing the same |
| 09/09/2009 | CN100539088C Structure for packaging semiconductor, fabricating method |
| 09/09/2009 | CN100539087C 半导体器件 Semiconductor devices |
| 09/09/2009 | CN100539049C Graphic drawing device and method, detector for the device |
| 09/09/2009 | CN100539014C Structural body for producing electronic device and method for producing electronic device using the same |
| 09/09/2009 | CN100538480C Liquid crystal display device |
| 09/08/2009 | US7587696 Semiconductor device, layout method and apparatus and program |
| 09/08/2009 | US7587648 Integrated circuit having electrically isolatable test circuitry |
| 09/08/2009 | US7587193 Signal transmission arrangement having a transformer and a receiver circuit |
| 09/08/2009 | US7587175 Radio frequency unit analog level detector and feedback control system |
| 09/08/2009 | US7586758 Integrated circuit stacking system |
| 09/08/2009 | US7586755 Electronic circuit component |
| 09/08/2009 | US7586529 Solid-state imaging device |
| 09/08/2009 | US7586202 Alignment sensing method for semiconductor device |
| 09/08/2009 | US7586201 Wiring modeling technique |
| 09/08/2009 | US7586200 Light emitting diode chip with reflective layer thereon |
| 09/08/2009 | US7586199 Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types |
| 09/08/2009 | US7586198 Innerlayer panels and printed wiring boards with embedded fiducials |
| 09/08/2009 | US7586197 Wire structure, method of forming wire, thin film transistor substrate, and method of manufacturing thin film transistor substrate |
| 09/08/2009 | US7586196 Apparatus for an improved air gap interconnect structure |
| 09/08/2009 | US7586195 Semiconductor device |
| 09/08/2009 | US7586193 Mm-wave antenna using conventional IC packaging |
| 09/08/2009 | US7586192 Routing configuration for high frequency signals in an integrated circuit package |
| 09/08/2009 | US7586191 Integrated circuit apparatus with heat spreader |
| 09/08/2009 | US7586190 Optoelectronic component and a module based thereon |
| 09/08/2009 | US7586189 Heat dissipation structure accommodated in electronic control device |
| 09/08/2009 | US7586188 Chip package and coreless package substrate thereof |
| 09/08/2009 | US7586187 Interconnect structure with stress buffering ability and the manufacturing method thereof |
| 09/08/2009 | US7586186 Ball grid array |
| 09/08/2009 | US7586184 Electronic package |
| 09/08/2009 | US7586183 Multilevel semiconductor module and method for fabricating the same |
| 09/08/2009 | US7586182 Packaged semiconductor die and manufacturing method thereof |
| 09/08/2009 | US7586181 Semiconductor device and method for manufacturing |
| 09/08/2009 | US7586180 Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
| 09/08/2009 | US7586179 Wireless semiconductor package for efficient heat dissipation |
| 09/08/2009 | US7586178 Alternative flip chip in leaded molded package design and method for manufacture |
| 09/08/2009 | US7586177 Semiconductor-on-insulator silicon wafer |
| 09/08/2009 | US7586176 Semiconductor device with crack prevention ring |
| 09/08/2009 | US7586175 Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface |
| 09/08/2009 | US7586160 Method of manufacturing a semiconductor integrated circuit and semiconductor integrated circuit |
| 09/08/2009 | US7586155 Apparatus and method for improving drive-strength and leakage of deep submicron MOS transistors |
| 09/08/2009 | US7586149 Circuit device including vertical transistors connected to buried bitlines and method of manufacturing the same |
| 09/08/2009 | US7586126 Light emitting diode lighting module with improved heat dissipation structure |
| 09/08/2009 | US7586048 Electronic component |