H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2009
10/07/2009	CN100547783C Integrated circuit test carrier and method for testing manufacture process of the tested carrier
10/07/2009	CN100547782C Semiconductor apparatus
10/07/2009	CN100547781C Integrated circuit structure with switching welding pad set on active circuit top
10/07/2009	CN100547780C Package substrate
10/07/2009	CN100547779C Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
10/07/2009	CN100547778C Flexible circuit substrate and its forming method and assembly comprising flexible circuit substrate
10/07/2009	CN100547777C Die package with asymmetric leadframe connection
10/07/2009	CN100547776C An integrated circuit device package with an additional contact pad,and an electronic device
10/07/2009	CN100547775C Lead frame, sensor, resin composition, and sensor including the resin mold
10/07/2009	CN100547773C Semiconductor interposer and its application in electronic package
10/07/2009	CN100547772C Wafer-level photoelectric semiconductor assembling structure and its manufacturing method
10/07/2009	CN100547771C Method, system and apparatus for cooling high power density devices
10/07/2009	CN100547770C Heat radiator with attached heat pipe
10/07/2009	CN100547769C Semiconductor structure and semiconductor chip
10/07/2009	CN100547753C Solid package structure and manufacture method thereof
10/07/2009	CN100547750C Method of designing package for semiconductor device, method of manufacturing the same, and layout design tool
10/07/2009	CN100547722C Methods of forming semiconductor devices of diamond bottom
10/07/2009	CN100547607C Modularized memory card apparatus capable of dividing memory body magnetic region
10/06/2009	US7599193 Tape circuit substrate with reduced size of base film
10/06/2009	US7599190 High-frequency module, and method of producing same
10/06/2009	US7599185 Cooling device
10/06/2009	US7599165 Palladium-containing particles, method and apparatus of manufacturing palladium-containing devices made therefrom
10/06/2009	US7599037 Thin film transistor array panel for liquid crystal display and method for manufacturing the same
10/06/2009	US7598796 Semiconductor integrated circuit including charging pump
10/06/2009	US7598630 IC with on-die power-gating circuit
10/06/2009	US7598622 Encapsulation of a chip module
10/06/2009	US7598621 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths
10/06/2009	US7598620 Copper bonding compatible bond pad structure and method
10/06/2009	US7598619 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
10/06/2009	US7598618 Semiconductor device
10/06/2009	US7598617 Stack package utilizing through vias and re-distribution lines
10/06/2009	US7598615 Analytic structure for failure analysis of semiconductor device having a multi-stacked interconnection structure
10/06/2009	US7598614 Low leakage metal-containing cap process using oxidation
10/06/2009	US7598613 Flip chip bonding structure
10/06/2009	US7598612 Semiconductor device and manufacturing method thereof
10/06/2009	US7598611 Semiconductor device with side terminals
10/06/2009	US7598610 Plate structure having chip embedded therein and the manufacturing method of the same
10/06/2009	US7598609 Structure of polymer-matrix conductive film and method for fabricating the same
10/06/2009	US7598608 Mounting substrate
10/06/2009	US7598607 Semiconductor packages with enhanced joint reliability and methods of fabricating the same
10/06/2009	US7598606 Integrated circuit package system with die and package combination
10/06/2009	US7598605 Semiconductor device having capacitive insulation means and communication terminal using the device
10/06/2009	US7598604 Low profile semiconductor package
10/06/2009	US7598603 Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
10/06/2009	US7598602 Controlling warping in integrated circuit devices
10/06/2009	US7598601 Current sensor
10/06/2009	US7598600 Stackable power semiconductor package system
10/06/2009	US7598599 Semiconductor package system with substrate having different bondable heights at lead finger tips
10/06/2009	US7598598 Offset etched corner leads for semiconductor package
10/06/2009	US7598596 Methods and apparatus for a dual-metal magnetic shield structure
10/06/2009	US7598593 N-type ohmic electrode for n-type group III nitride semiconductor, semiconductor light-emitting device with the electrode, and method for forming n-type ohmic electrode
10/06/2009	US7598588 Semiconductor structure and method of manufacture
10/06/2009	US7598585 Structure for preventing leakage of a semiconductor device
10/06/2009	US7598566 Trench gate field effect devices
10/06/2009	US7598558 Method of manufacturing semiconductor integrated circuit device having capacitor element
10/06/2009	US7598557 Semiconductor device and method for fabricating a semicondutor device including first and second hydrogen diffusion preventing films
10/06/2009	US7598538 ESD protecting circuit and manufacturing method thereof
10/06/2009	US7598537 Semiconductor device
10/06/2009	US7598535 Light-emitting diode assembly and method of fabrication
10/06/2009	US7598534 LED light source with integrated circuit and light guide
10/06/2009	US7598522 Semiconductor substrate and production process thereof
10/06/2009	US7598520 Semiconductor device including active layer of zinc oxide with controlled crystal lattice spacing and manufacturing method thereof
10/06/2009	US7598462 Sealed remote keyless entry device
10/06/2009	US7598126 Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips
10/06/2009	US7598121 Method of manufacturing a semiconductor device
10/06/2009	US7598098 Monitoring the reduction in thickness as material is removed from a wafer composite and test structure for monitoring removal of material
10/06/2009	US7597769 forming a solar cell conductive feature using monodisperse silver or silver alloy fine particles coated with a ceramic or metal; silver particles made in an aerosol stream and coated by vapor deposition
10/06/2009	US7597561 Method and system for batch forming spring elements in three dimensions
10/06/2009	US7597006 Method of evaluating adhesiveness of member
10/06/2009	CA2462451C Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
10/01/2009	WO2009120977A2 Enhanced thermal dissipation ball grid array package
10/01/2009	WO2009120900A2 Interconnection system on a plane adjacent to a solid-state device structure
10/01/2009	WO2009120857A2 Semiconductor chip package assembly method and apparatus for countering leadfinger deformation
10/01/2009	WO2009120633A2 Semiconductor package with embedded magnetic component and method of manufacture
10/01/2009	WO2009120482A1 Sip substrate
10/01/2009	WO2009120250A1 Getter precursors for hermetically sealed packaging
10/01/2009	WO2009119875A1 Component-incorporating wiring board
10/01/2009	WO2009119804A1 Thin film interconnect for electronic component, and sputtering target material for formation of thin film interconnect
10/01/2009	WO2009119745A1 Wiring board, semiconductor package and method of fabricating wiring board
10/01/2009	WO2009119634A1 Fixing material comprising silane compound polymer and photonic device sealed body
10/01/2009	WO2009119603A1 Aluminum nitride substrate with oxide layer, aluminum nitride sintered compact, processes for producing the aluminum nitride substrate and the aluminum nitride sintered compact, circuit board, and led module
10/01/2009	WO2009119590A1 Lead frame and process for producing the same
10/01/2009	WO2009119583A1 Material for chemical vapor deposition, silicon-containing insulating film and process for production thereof
10/01/2009	WO2009119513A1 Epoxy resin composition and cured product
10/01/2009	WO2009119438A1 Insulating substrate and method for producing the same
10/01/2009	WO2009119427A1 Semiconductor device and manufacturing method for the same
10/01/2009	WO2009119374A1 Method for manufacturing electronic component module
10/01/2009	WO2009119289A1 Heat pipe, method of manufacturing heat pipe, and circuit board with heat pipe function
10/01/2009	WO2009119199A1 Method for producing multilayer ceramic substrate and composite sheet
10/01/2009	WO2009119175A1 Semiconductor device
10/01/2009	WO2009119046A1 Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
10/01/2009	WO2009118999A1 Semiconductor device, multilayer wiring board and method for manufacturing semiconductor device
10/01/2009	WO2009118925A1 Circuit board having built-in electronic parts and its manufacturing method
10/01/2009	WO2009118805A1 Wiring board, semiconductor device, and process for producing semiconductor device
10/01/2009	WO2009118674A1 Esd networks for solder bump integrated circuits
10/01/2009	WO2009118468A2 Connection component provided with inserts comprising compensating blocks
10/01/2009	WO2009117900A1 A clamp for the heat sink of the chip
10/01/2009	WO2009117882A1 Pulse-laser bonding method for through-silicon-via based stacking of electronic components
10/01/2009	WO2009117845A1 Semiconductor light-emitting device with double-sided passivation
10/01/2009	WO2009099834A3 Wafer level chip scale package and process of manufacture

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