| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/15/2009 | US7589415 Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip |
| 09/15/2009 | US7589414 I/O Architecture for integrated circuit package |
| 09/15/2009 | US7589413 Semiconductor device comprising a vertical semiconductor component and method for producing the same |
| 09/15/2009 | US7589412 Semiconductor device |
| 09/15/2009 | US7589411 Device for electrical connection of an integrated circuit chip |
| 09/15/2009 | US7589410 Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package |
| 09/15/2009 | US7589409 Stacked packages and microelectronic assemblies incorporating the same |
| 09/15/2009 | US7589408 Stackable semiconductor package |
| 09/15/2009 | US7589407 Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package |
| 09/15/2009 | US7589406 Stacked semiconductor component |
| 09/15/2009 | US7589405 Memory cards and method of fabricating the memory cards |
| 09/15/2009 | US7589404 Semiconductor device |
| 09/15/2009 | US7589403 Lead structure for a semiconductor component and method for producing the same |
| 09/15/2009 | US7589402 Semiconductor module and manufacturing method thereof |
| 09/15/2009 | US7589401 Lightweight, hermetically sealed package having auxiliary, selectively contoured, low mass, pseudo wall insert for surface-mounting and dissipating heat from electronic circuit components |
| 09/15/2009 | US7589400 Inverter and vehicle drive unit using the same |
| 09/15/2009 | US7589399 Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device |
| 09/15/2009 | US7589398 Embedded metal features structure |
| 09/15/2009 | US7589397 System and method for providing a uniform oxide layer over a laser trimmed fuse with a differential wet etch stop technique |
| 09/15/2009 | US7589396 Chip scale surface mount package for semiconductor device and process of fabricating the same |
| 09/15/2009 | US7589395 Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation |
| 09/15/2009 | US7589394 Interposer |
| 09/15/2009 | US7589390 Shielded through-via |
| 09/15/2009 | US7589389 Semiconductor device and method of manufacturing the same |
| 09/15/2009 | US7589388 Semiconductor device and method of manufacturing the same |
| 09/15/2009 | US7589386 Semiconductor device and manufacturing method thereof |
| 09/15/2009 | US7589384 Semiconductor device including an electrostatic discharge protection element |
| 09/15/2009 | US7589363 Fuse structures, methods of making and using the same, and integrated circuits including the same |
| 09/15/2009 | US7589308 Method and apparatus for regulating photo currents induced by dose rate events |
| 09/15/2009 | US7589282 Wiring board and a semiconductor device using the same |
| 09/15/2009 | US7589147 Resin composition for thermal conductive material and thermal conductive material |
| 09/15/2009 | US7589014 Semiconductor device having multiple wiring layers and method of producing the same |
| 09/15/2009 | US7589010 Semiconductor devices with permanent polymer stencil and method for manufacturing the same |
| 09/15/2009 | US7588999 Method of forming a leaded molded array package |
| 09/15/2009 | US7588972 Thin film transistor, method of manufacturing the same, display apparatus having the same and method of manufacturing the display apparatus |
| 09/15/2009 | US7588964 Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same |
| 09/15/2009 | US7588962 Method of making semiconductor device |
| 09/15/2009 | US7588950 Test pattern for reliability measurement of copper interconnection line having moisture window and method for manufacturing the same |
| 09/15/2009 | US7588948 Test structure for electrically verifying the depths of trench-etching in an SOI wafer, and associated working methods |
| 09/15/2009 | US7587941 Vibration piezoelectric acceleration sensor |
| 09/11/2009 | WO2009111187A1 Integrated circuit with mosfet fuse element |
| 09/11/2009 | WO2009111186A1 Semiconductor stack assembly having reduced thermal spreading resistance and methods of making same |
| 09/11/2009 | WO2009111164A2 Structure and method for coupling signals to and/or from stacked semiconductor dies |
| 09/11/2009 | WO2009110424A1 Modified epoxy resin, epoxy resin compositions and cured articles |
| 09/11/2009 | WO2009110414A1 Method for forming bump |
| 09/11/2009 | WO2009110405A1 Thermosetting organic-inorganic hybrid transparent material |
| 09/11/2009 | WO2009110376A1 Leadframe substrate, semiconductor module and method for manufacturing leadframe substrate |
| 09/11/2009 | WO2009110355A1 Mounting structure and method for manufacturing same |
| 09/11/2009 | WO2009110345A1 One-pack type epoxy resin composition and use thereof |
| 09/11/2009 | WO2009110339A1 Device package, electronic module, and electronic apparatus |
| 09/11/2009 | WO2009110330A1 Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium |
| 09/11/2009 | WO2009110286A1 Electronic component and method for manufacturing the same |
| 09/11/2009 | WO2009110095A1 Conductive material, conductive paste, circuit board, and semiconductor device |
| 09/11/2009 | WO2009110045A1 Structure for attaching component having heating body mounted thereon |
| 09/11/2009 | WO2009109934A1 Void-free copper filling of recessed features using a smooth non-agglomerated copper seed layer |
| 09/11/2009 | WO2009109932A1 Reverse engineering resistant read only memory |
| 09/11/2009 | WO2009109488A1 Housing with a cooling unit for power electronics |
| 09/11/2009 | WO2009109482A1 Modified reaction resin |
| 09/11/2009 | WO2009109413A1 Curable reaction resin system |
| 09/11/2009 | WO2009109235A1 Semiconductor chip |
| 09/11/2009 | WO2009090517A3 Redundant chain test structure for precise contact/via fail rate measurement |
| 09/11/2009 | WO2008157108A3 Metal plugged substrates with no adhesive between metal and polyimide |
| 09/11/2009 | WO2007122586A3 A high power integrated rf amplifier |
| 09/11/2009 | CA2713153A1 Integrated circuit with mosfet fuse element |
| 09/11/2009 | CA2713151A1 Semiconductor stack assembly having reduced thermal spreading resistance and methods of making same |
| 09/11/2009 | CA2709547A1 Modified reaction resin |
| 09/10/2009 | US20090228289 Audio signal processing apparatus |
| 09/10/2009 | US20090228288 Audio signal processing apparatus |
| 09/10/2009 | US20090228287 Audio signal processing apparatus |
| 09/10/2009 | US20090228286 Audio signal processing apparatus |
| 09/10/2009 | US20090228214 Analyte Monitoring Device and Methods of Use |
| 09/10/2009 | US20090227941 Analyte Monitoring Device and Methods of Use |
| 09/10/2009 | US20090227940 Analyte Monitoring Device and Methods of Use |
| 09/10/2009 | US20090227757 Photosemiconductor element encapsulating material a polyaluminosiloxane modified by reaction with a silane coupling agent, such as 3-(methacryloyloxypropyl)trimethoxysilane; useful for backlights for liquid crystal displays, traffic lights, outdoor big displays, and advertisement sign boards |
| 09/10/2009 | US20090227088 Semiconductor wafer and manufacturing process for semiconductor device |
| 09/10/2009 | US20090227072 Packaging Structure and Method |
| 09/10/2009 | US20090227064 X-y address type solid state image pickup device and method of producing the same |
| 09/10/2009 | US20090225268 Mounting structure and electro optical device |
| 09/10/2009 | US20090224794 Semiconductor integrated circuit and method for inspecting same |
| 09/10/2009 | US20090224422 Methods of fabricating a composite carbon nanotube thermal interface device |
| 09/10/2009 | US20090224413 Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
| 09/10/2009 | US20090224412 Non-planar substrate strip and semiconductor packaging method utilizing the substrate strip |
| 09/10/2009 | US20090224411 Multi-Chips Module Package Structure and the Method thereof |
| 09/10/2009 | US20090224410 Wafer translator having a silicon core fabricated with printed circuit board manufacturing techniques |
| 09/10/2009 | US20090224409 Semiconductor Device |
| 09/10/2009 | US20090224408 Methods for Multi-Wire Routing and Apparatus Implementing Same |
| 09/10/2009 | US20090224407 Semiconductor device |
| 09/10/2009 | US20090224406 Dense Seed Layer and Method of Formation |
| 09/10/2009 | US20090224405 Through via process |
| 09/10/2009 | US20090224404 Method And System For Fabricating Semiconductor Components With Through Interconnects |
| 09/10/2009 | US20090224403 Semiconductor device and method of manufacturing the same |
| 09/10/2009 | US20090224402 Semiconductor Package Having Semiconductor Die with Internal Vertical Interconnect Structure and Method Therefor |
| 09/10/2009 | US20090224401 Semiconductor device and manufacturing method thereof |
| 09/10/2009 | US20090224400 Semiconductor assembly having reduced thermal spreading resistance and methods of making same |
| 09/10/2009 | US20090224399 Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and semiconductor module using the same |
| 09/10/2009 | US20090224398 Semiconductor module and method of manufacturing the same |
| 09/10/2009 | US20090224397 Substrate and semiconductor package for lessening warpage |
| 09/10/2009 | US20090224396 Oversized Contacts and Vias in Semiconductor Chip Defined by Linearly Constrained Topology |
| 09/10/2009 | US20090224395 Substrate strip for semiconductor packages |
| 09/10/2009 | US20090224394 Solid-state image sensing apparatus and package of same |