Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2009
10/13/2009US7602051 Thermally conductive resin sheet and power module using the same
10/13/2009US7602050 Integrated circuit packaging
10/13/2009US7602049 Capacitive techniques to reduce noise in high speed interconnections
10/13/2009US7602048 Semiconductor device and semiconductor wafer having a multi-layered insulation film
10/13/2009US7602044 Semiconductor device having polycrystalline silicon resistors
10/13/2009US7602042 Nonvolatile memory device, array of nonvolatile memory devices, and methods of making the same
10/13/2009US7602041 Input protection circuit preventing electrostatic discharge damage of semiconductor integrated circuit
10/13/2009US7602040 Semiconductor device and a method of manufacturing the same
10/13/2009US7602039 Programmable capacitor associated with an input/output pad
10/13/2009US7602026 Memory cell, semiconductor memory device, and method of manufacturing the same
10/13/2009US7602022 Surge voltage protection diode with controlled p-n junction density gradients
10/13/2009US7602002 Semiconductor device with DRAM portion having capacitor-over-bit-line structure and logic portion
10/13/2009US7601631 Very low dielectric constant plasma-enhanced CVD films
10/13/2009US7601625 Method for manufacturing semiconductor device having solder layer
10/13/2009US7601563 Small form factor molded memory card and a method thereof
10/13/2009US7601562 Microelectronic component assemblies having lead frames adapted to reduce package bow
10/13/2009US7601561 Heat-radiating tape carrier package and method for manufacturing the same
10/13/2009US7601560 Method for producing an electronic circuit
10/13/2009US7601281 Production method of anisotropic conductive sheet
10/13/2009US7600881 Semiconductor light emitting apparatus and its manufacturing method
10/13/2009US7600557 Heat sink mechanism
10/13/2009CA2457042C Heat sink for semiconductor components or similar devices, method for its production and tool for carrying out the method
10/13/2009CA2433887C Chemical monolayer and micro-electronic junctions and devices containing same
10/08/2009WO2009124280A2 Inductor with patterned ground plane
10/08/2009WO2009124246A1 Interposers, electronic modules, and methods for forming the same
10/08/2009WO2009124158A1 Method for integrating heat transfer members, and an led device
10/08/2009WO2009123818A1 Semiconductor structure
10/08/2009WO2009123308A1 Semiconductor package and method for manufacturing the same
10/08/2009WO2009123217A1 Display device, process for producing the display device, and sputtering target
10/08/2009WO2009123159A1 Copper alloy material for electric and electronic apparatuses, and electric and electronic components
10/08/2009WO2009123158A1 Copper alloy material for electric and electronic apparatuses, and electric and electronic components
10/08/2009WO2009123136A1 Cu-ni-si alloy for electronic materials
10/08/2009WO2009123104A1 Composition and method for production thereof, porous material and method for production thereof, interlayer insulating film, semiconductor material, semiconductor device, and low-refractive-index surface protection film
10/08/2009WO2009123058A1 Epoxy resin composition and molded object
10/08/2009WO2009123049A1 Method for depositing high stress thin film and method for fabricating semiconductor integrated circuit device
10/08/2009WO2009123048A1 Electronic component used for wiring and method for manufacturing the same
10/08/2009WO2009122911A1 Semiconductor module, method for manufacturing semiconductor module and portable apparatus
10/08/2009WO2009122854A1 Wiring board and semiconductor device using the wiring board
10/08/2009WO2009122835A1 Electronic component module and method for manufacturing the electronic component module
10/08/2009WO2009122704A1 Piezoelectric vibrating part
10/08/2009WO2009122680A1 Multilayer circuit board, insulating sheet, and semiconductor package using multilayer circuit board
10/08/2009WO2009122671A1 Resin composition, resin-containing carrier material, multi-layered printed circuit board, and semiconductor device
10/08/2009WO2009122496A1 Semiconductor device and method for manufacturing the same
10/08/2009WO2009122452A2 An integrated circuit
10/08/2009WO2009121876A1 Movable electrical conductor
10/08/2009WO2009121737A1 Substrate with flat heat pipe
10/08/2009WO2009121675A1 Component arrangement and method for producing a component arrangement
10/08/2009WO2009121200A1 Method of balancing multilayer substrate stress and multilayer substrate
10/08/2009WO2009099500A3 Electrostatic discharge protection
10/08/2009WO2009085423A3 A heat sink and method of forming a heatsink using a wedge-lock system
10/08/2009US20090252401 Methods, Objects and Apparatus Employing Machine Readable Data
10/08/2009US20090251615 Active matrix substrate, display device, television apparatus, manufacturing method of an active matrix substrate, and manufacturing method of a display device
10/08/2009US20090251166 Ball grid array connection monitoring system and method
10/08/2009US20090251160 Semiconductor integrated circuit wafer, semiconductor integrated circuit chip, and method of testing semiconductor integrated circuit wafer
10/08/2009US20090251131 Inverted magnetic isolator
10/08/2009US20090251119 Three chip package
10/08/2009US20090250826 Process for manufacturing semiconductor device and semiconductor device manufactured by such process
10/08/2009US20090250825 crack resistance, transparency, minimal discoloration; optical semiconductor device; reacting polyester of cyclohexanedicarboxylic acid and neopentyl glycol; methylhexahydrophthalic anhydride; polyepoxide; 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate
10/08/2009US20090250824 Method and apparatus to reduce pin voids
10/08/2009US20090250823 Electronic Modules and Methods for Forming the Same
10/08/2009US20090250822 Multi-chip stack package
10/08/2009US20090250821 Corrosion resistant via connections in semiconductor substrates and methods of making same
10/08/2009US20090250820 Configurable non-volatile logic structure for characterizing an integrated circuit device
10/08/2009US20090250819 Metal line of semiconductor device and method of forming the same
10/08/2009US20090250818 Via electromigration improvement by changing the via bottom geometric profile
10/08/2009US20090250817 Method of fabricating semiconductor device and semiconductor device
10/08/2009US20090250816 Ultra-thin diffusion-barrier layer for cu metallization
10/08/2009US20090250815 Surface treatment for selective metal cap applications
10/08/2009US20090250814 Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof
10/08/2009US20090250813 Integrated circuit solder bumping system
10/08/2009US20090250812 Flip-chip mounting substrate and flip-chip mounting method
10/08/2009US20090250811 Semiconductor Device and Method of Self-Confinement of Conductive Bump Material During Reflow Without Solder Mask
10/08/2009US20090250810 Integrated circuit packaging system with warpage control system and method of manufacture thereof
10/08/2009US20090250809 Semiconductor package having thermal stress canceller member
10/08/2009US20090250808 Reliability improvement in a compound semiconductor mmic
10/08/2009US20090250807 Electronic Component and Method for its Production
10/08/2009US20090250806 Semiconductor package using an active type heat-spreading element
10/08/2009US20090250805 Heat Dissipation For Integrated Circuit
10/08/2009US20090250804 Leadframe-based ic-package with supply-reference comb
10/08/2009US20090250803 Semiconductor device and method of manufacturing the same
10/08/2009US20090250802 Multilayer wiring substrate, semiconductor package, and methods of manufacturing semiconductor package
10/08/2009US20090250800 Semiconductor device and manufacturing method therefor
10/08/2009US20090250799 Power Semiconductor Module Comprising an Explosion Protection System
10/08/2009US20090250798 Integrated circuit package system with interconnect support
10/08/2009US20090250797 Multi-Chip Package
10/08/2009US20090250796 Semiconductor device package having features formed by stamping
10/08/2009US20090250795 Leadframe for packaged electronic device with enhanced mold locking capability
10/08/2009US20090250794 Method of forming a semiconductor package and structure therefor
10/08/2009US20090250793 Bpsg film deposition with undoped capping
10/08/2009US20090250792 Curing Low-k Dielectrics for Improving Mechanical Strength
10/08/2009US20090250788 Semiconductor device
10/08/2009US20090250786 Fuse part of semiconductor device and method of fabricating the same
10/08/2009US20090250783 Semiconductor device having an annular guard ring
10/08/2009US20090250781 Power semiconductor device
10/08/2009US20090250740 Semiconductor device and method of manufacturing the same
10/08/2009US20090250721 Electrical surge protective apparatus
10/08/2009US20090250698 Fabrication management system
10/08/2009US20090250697 Semiconductor device and manufacturing method therefor
10/08/2009US20090250612 Post-supported microbolometer pixel
10/08/2009US20090250257 Electronic parts packaging structure and method of manufacturing the same
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