| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/23/2009 | CN101540305A Semiconductor chip package and manufacturing methods thereof |
| 09/23/2009 | CN101540304A Semiconductor chip package |
| 09/23/2009 | CN101540303A 抗磨损和晶须的涂覆系统和方法 Abrasion resistant coating systems and methods and whiskers |
| 09/23/2009 | CN101540302A Sheet structure and method of manufacturing sheet structure |
| 09/23/2009 | CN101540301A Hermetic sealing apparatus and hermetic sealing method using frit |
| 09/23/2009 | CN101540300A Wafer encapsulation body |
| 09/23/2009 | CN101540299A Device mounting board and manufacturing method therefor, semiconductor module, and portable equipment |
| 09/23/2009 | CN101540298A TFT-LCD array substrate and manufacturing method thereof |
| 09/23/2009 | CN101540290A Resin encapsulation and manufacturing method thereof |
| 09/23/2009 | CN101540289A Semiconductor integrated circuit package and method for packaging semiconductor integrated circuit |
| 09/23/2009 | CN101539691A System for displaying images and manufacturing method thereof |
| 09/23/2009 | CN101539285A LED radiating loop structure |
| 09/23/2009 | CN101539284A LED illumination device |
| 09/23/2009 | CN101539283A LED fixture |
| 09/23/2009 | CN101539275A Illuminating apparatus and light engine thereof |
| 09/23/2009 | CN101539274A Illuminating apparatus and light engine thereof |
| 09/23/2009 | CN101538367A Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the same |
| 09/23/2009 | CN100544558C 多层印刷配线板 Multilayer printed wiring board |
| 09/23/2009 | CN100544065C Water-capturing agent and organic EL device |
| 09/23/2009 | CN100544006C Solid-state imaging device and method for manufacturing the same |
| 09/23/2009 | CN100543983C Method of manufacturing a circuit board layer on substrate surface |
| 09/23/2009 | CN100543981C 半导体元件及半导体封装 Semiconductor elements and semiconductor packages |
| 09/23/2009 | CN100543980C Nano-fuse structural arrangements and its manufacture method |
| 09/23/2009 | CN100543979C Semiconductor module |
| 09/23/2009 | CN100543978C Semiconductor device, manufacturing method for semiconductor device, strip carrier and semiconductor module device |
| 09/23/2009 | CN100543977C Electronic component mounting package and package assembled substrate |
| 09/23/2009 | CN100543976C Optoelectronic component packaging structure having silicon substrates |
| 09/23/2009 | CN100543975C Liquid-cooled jacket |
| 09/23/2009 | CN100543974C Heat dispersing module and its manufacturing method |
| 09/23/2009 | CN100543973C Radiator without base plate |
| 09/23/2009 | CN100543972C Hot-pipe cooling device |
| 09/23/2009 | CN100543971C Semiconductor device and method for manufacturing the same |
| 09/23/2009 | CN100543953C Electronic device and its manufacturing method |
| 09/23/2009 | CN100543947C Low electric inductivity organic silicate film mixture for deposition |
| 09/23/2009 | CN100543099C Resin composition for encapsulating semiconductor |
| 09/23/2009 | CN100543082C Resin compositions and methods of use thereof |
| 09/22/2009 | US7593708 Methods of operating electronic devices, and methods of providing electronic devices |
| 09/22/2009 | US7593232 Electronic apparatus and circuit board unit |
| 09/22/2009 | US7593228 Technique for forming a thermally conductive interface with patterned metal foil |
| 09/22/2009 | US7593208 Multi-functional energy conditioner |
| 09/22/2009 | US7592710 Bond pad structure for wire bonding |
| 09/22/2009 | US7592709 Board on chip package and method of manufacturing the same |
| 09/22/2009 | US7592707 Method and apparatus for facilitating proximity communication and power delivery |
| 09/22/2009 | US7592706 Multi-layer circuit board with fine pitches and fabricating method thereof |
| 09/22/2009 | US7592705 Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device |
| 09/22/2009 | US7592704 Etched interposer for integrated circuit devices |
| 09/22/2009 | US7592703 RF and MMIC stackable micro-modules |
| 09/22/2009 | US7592702 Via heat sink material |
| 09/22/2009 | US7592701 Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure |
| 09/22/2009 | US7592700 Semiconductor chip and method of manufacturing semiconductor chip |
| 09/22/2009 | US7592699 Hidden plating traces |
| 09/22/2009 | US7592698 Power semiconductor modules having a cooling component and method for producing them |
| 09/22/2009 | US7592697 Microelectronic package and method of cooling same |
| 09/22/2009 | US7592696 Power module having at least two substrates |
| 09/22/2009 | US7592695 Compound heat sink |
| 09/22/2009 | US7592694 Chip package and method of manufacturing the same |
| 09/22/2009 | US7592693 Interconnecting electrical devices |
| 09/22/2009 | US7592692 Semiconductor device with a dummy electrode |
| 09/22/2009 | US7592691 High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies |
| 09/22/2009 | US7592690 Semiconductor device including semiconductor elements mounted on base plate |
| 09/22/2009 | US7592689 Semiconductor module comprising semiconductor chips and method for producing the same |
| 09/22/2009 | US7592688 Semiconductor package |
| 09/22/2009 | US7592687 Device and method for preventing an integrated circuit from malfunctioning due to surge voltage |
| 09/22/2009 | US7592685 Device and methodology for reducing effective dielectric constant in semiconductor devices |
| 09/22/2009 | US7592673 ESD protection circuit with isolated diode element and method thereof |
| 09/22/2009 | US7592636 Radiation-emitting semiconductor component and method for the production thereof |
| 09/22/2009 | US7592623 Semiconductor device including wiring connection testing structure |
| 09/22/2009 | US7592399 Epoxy/silicone hybrid resin composition and optical semiconductor device |
| 09/22/2009 | US7592383 Heat conductive silicone composition |
| 09/22/2009 | US7592246 Method and semiconductor device having copper interconnect for bonding |
| 09/22/2009 | US7592220 Capacitance process using passivation film scheme |
| 09/22/2009 | US7592205 Over-passivation process of forming polymer layer over IC chip |
| 09/22/2009 | US7592200 Solid-state imaging device and method of manufacturing the same |
| 09/22/2009 | US7591151 Renewability and shortened renewing time, preventing elements in a substrate thereof from diffusing into the surface of diamond-like carbon (DLC), heat resistance of the molding die and adhesion between the DLC layer and substrate |
| 09/17/2009 | WO2009114670A2 Support mounted electrically interconnected die assembly |
| 09/17/2009 | WO2009114406A2 Semiconductor die package including ic driver and bridge |
| 09/17/2009 | WO2009114392A2 Semiconductor die package including embedded flip chip |
| 09/17/2009 | WO2009114372A2 Thermal interconnect and integrated interface systems, methods of production and uses thereof |
| 09/17/2009 | WO2009113959A1 Cooling device and method for the manufacturing thereof |
| 09/17/2009 | WO2009113865A1 Passive cooling system for photo voltaic modules |
| 09/17/2009 | WO2009113507A1 Semiconductor device, and communication apparatus and electronic apparatus provided with semiconductor device |
| 09/17/2009 | WO2009113373A1 Semiconductor device |
| 09/17/2009 | WO2009113372A1 Semiconductor device |
| 09/17/2009 | WO2009113267A1 Semiconductor device and semiconductor device fabrication method |
| 09/17/2009 | WO2009113262A1 Semiconductor device and semiconductor device manufacturing method |
| 09/17/2009 | WO2009113236A1 Method and apparatus for cutting substrate |
| 09/17/2009 | WO2009113198A1 Interposer and interposer manufacturing method |
| 09/17/2009 | WO2009112644A1 Assembly including a wire member and a microelectronic chip with a notch, including at least one stud for holding the wire member |
| 09/17/2009 | WO2009112456A1 Test structures for checking the positional precision in microelectronic circuits |
| 09/17/2009 | WO2009112272A1 Method for the production of a semiconductor-based circuit, and semiconductor-based circuit comprising a three-dimensional circuit topology |
| 09/17/2009 | WO2009111978A1 Led daylight strip lamp |
| 09/17/2009 | WO2009111940A1 Led lamp radiator and led lamp with the radiator |
| 09/17/2009 | WO2009111818A1 Method of adhering wire bond loops to reduce loop height |
| 09/17/2009 | WO2009111817A1 Electronic device with wire bonds secured to the adhesive surface |
| 09/17/2009 | WO2009094537A3 Nanoscale metal paste for interconnect and method of use |
| 09/17/2009 | WO2009090349A3 Method for making an electrically conducting mechanical interconnection member |
| 09/17/2009 | WO2009078289A3 Cooling fin and manufacturing method of the cooling fin |
| 09/17/2009 | WO2009074453A3 Semiconductor switching device with gate connection |
| 09/17/2009 | WO2008129423A3 Conductive via formation |
| 09/17/2009 | US20090233440 Seed Layers for Metallic Interconnects |